Thermal Specifications And Design Considerations; Power Specifications For The Dual-Core Extreme Edition Processor - Intel P8700 - Core 2 Duo Processor Datasheet

Core 2 duo mobile processor, intel core 2 solo mobile processor and intel core 2 extreme mobile processor on 45-nm process, platforms based on mobile intel 4 series express chipset family
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Thermal Specifications and Design Considerations

5
Thermal Specifications and
Design Considerations
A complete thermal solution includes both component and system-level thermal
management features. To allow for the optimal operation and long-term reliability of
Intel processor-based systems, the system/processor thermal solution should be
designed so the processor remains within the minimum and maximum junction
temperature (T
listed in the tables below
Caution:
Operating the processor outside these operating limits may result in permanent
damage to the processor and potentially other components in the system.
Table 20.

Power Specifications for the Dual-Core Extreme Edition Processor

Symbol
TDP
X9100
Symbol
Auto Halt, Stop Grant Power
P
AH,
at V
P
SGNT
at V
Sleep Power
P
at V
SLP
at V
Deep Sleep Power
P
at V
DSLP
at V
P
Deeper Sleep Power
DPRSLP
P
Intel® Enhanced Deeper Sleep state Power
DC4
P
Intel® Deep Power Down Power
C6
T
Junction Temperature
J
NOTES:
1.
The TDP specification should be used to design the processor thermal solution. The TDP is
not the maximum theoretical power the processor can generate.
2.
Not 100% tested. These power specifications are determined by characterization of the
processor currents at higher temperatures and extrapolating the values for the
temperature indicated.
3.
As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal
Monitor's automatic mode is used to indicate that the maximum T
4.
The Intel Thermal Monitor automatic mode must be enabled for the processor to operate
within specifications.
5.
Processor TDP requirements in Intel Dynamic Acceleration Technology mode are lesser
than TDP in HFM.
6.
At Tj of 105
7.
At Tj of 50
8.
At Tj of 35
Datasheet
) specifications at the corresponding thermal design power (TDP) value
J
Processor
Core Frequency & Voltage
Number
3.06 GHz & V
1.6 GHz & V
0.8 GHz & V
Parameter
CCHFM
CCSLFM
CCHFM
CCSLFM
CCHFM
CCSLFM
o
C
o
C
o
C
Thermal Design
CCHFM
CCLFM
CCSLFM
Min
0
Unit
Notes
Power
44
1, 4,
29
W
5, 6
20
Typ
Max
Unit
Notes
18.8
W
2, 5, 7
6.7
17.8
W
2, 5, 7
6.4
8.2
W
2, 5, 8
3.8
1.9
W
2, 8
1.7
W
2, 8
1.3
W
2, 8
105
°C
3, 4
has been reached.
J
101

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