Table of Contents
Advertisement
3.4
Package Thermal Specifications
The 80960SA is specified for operation when case
temperature is within the range 0°C to +85°C (PLCC)
or 0°C to 100°C (QFP). Measure case temperature
at the top center of the package. Ambient temper-
ature can be calculated from:
T
= T
+ P*θ
J
C
JC
T
= T
- P*θ
A
J
JA
−θ
T
= T
+ P*[θ
]
C
A
JA
JC
Table 13. 80960SA QFP Package Thermal Characteristics
Parameter
θ Junction-to-Ambient (Case
measured in the middle of the
top of the package)
(No Heatsink)
θ Junction-to-Case
NOTES:
This table applies to 80960SA QFP soldered directly to board.
Table 14. 80960SA PLCC Package Thermal Characteristics
Parameter
θ Junction-to-Ambient
(No Heatsink)
θ Junction-to-Case
NOTES:
This table applies to 80960SA PLCC soldered directly to board.
3.5
Stepping Register Information
Upon reset, register g0 contains die stepping infor-
mation. Table 15 shows the relationship between the
number in g0 and the current die stepping
Compute P by multiplying the maximum voltage by
the typical current at maximum temperature. Values
for θ
JA
13 for the QFP package and in Table 14 for the
PLCC package. I
typically 80 percent of specified I
Thermal Resistance — °C/Watt
Airflow — ft./min (m/sec)
0
50
100
59
57
54
11
11
11
Thermal Resistance — °C/Watt
Airflow — ft./min (m/sec)
0
50
100
200
34
32
29.5
28
12
12
12
12
The current numbering pattern in g0 may not be
consistent with past or future steppings of this
product.
and θ
for various airflows are given in Table
JC
at maximum temperature is
CC
200
400
600
50
44
40
11
11
11
400
600
800
25
23
21
12
12
12
Table 15. Die Stepping Cross Reference
Register g0
01010101H
80960SA
maximum (cold).
CC
800
38
11
1000
20.5
12
Die Stepping
C-1
27
Advertisement
Table of Contents
