Glue Curing Process And Concerns; Assembly Lp Module To Hsg Dmd - BenQ MP611 Product Service Manual

4.3 Glue "LP" and "BKT_LP" with ""UV5503 Glue" at two opening of "BKT_LP" show in Figure
4-3。
4.4 UV-5503 Glue curing process and concerns:
vii. The UV-glue must fill up the whole opening area (shown in Figure 4-3) to contact well with
LP surfaces and BKT_LP.
viii. Exposed to visible light at 350 ~ 420nm(at least 100mW/cm2) wavelength for 20
seconds.
ix. After curing, the height of UV-glue should not exceed BKT_LP for more than 0.6mm

4.5 Assembly LP Module to HSG DMD

i. Assembly two Overfill adjustment screw (8F.1A752.8R0) to HSG DMD( Figure4-4) 。**
Adjustment criteria refer to item 4.6.
ii. Insert CLIP of BKT_LP into the hole
iii. Placed LP Module on LP datum and adjustment screw well, shown ( Figure 4-6) 。
iv. Assembly "Clip_LP" first ( Figure 4-7)and make sure it hooks HSG DMD well
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Figure 4-3