Chapter 3 Packaging - Freescale Semiconductor DSP56311 Technical Data Manual

3
Packaging
This section includes diagrams of the DSP56311 package pin-outs and tables showing how the signals described in
Chapter 1 are allocated for the package. The DSP56311 is available in a 196-pin molded array plastic-ball grid
array (MAP-BGA) package.
DSP56311 Technical Data, Rev. 8
Freescale Semiconductor 3-1