Advantech EVA-X4300 User Manual page 9

Fully static 32-bit x86-based processor

Hide thumbs Also See for EVA-X4300:

Table of Contents

For 4-layer:

Ball pad diameter: 14 mil

Traces width/ spacing for Signals: 5/ 5 mil

Trace width for Power and Ground: 20 mils

Vias PAD/ Drill diameter for all Signals: 22/ 12 mil

Via-to-via spacing (center to center): 40 mil

Via-to-pad spacing (center to center): 30 mil

Note!

All the Vias must be covered by solder mask. To minimize inductance,

power vias should be as large as possible and take good care of the

inadvertently cut of the ground and power planes.

EVA-X4300 System Design Guide

Table of Contents