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3.16.1 Using Serial Port Buffering ...................................................................................73
3.16.1.1 Configuring the Serial Port.....................................................................73
3.16.1.2 Configuration of Buffering/Filtering ........................................................76
3.16.1.3 Reading Buffered Data ..........................................................................76
3.16.1.4 Examples ...............................................................................................77
4
Connectors ....................................................................................................................................80
4.1
Backplane Connectors........................................................................................................84
4.1.1
Power Distribution Connector (Zone 1)..................................................................84
4.1.2
Data Transport Connector (Zone 2).......................................................................85
4.1.3
Alignment Blocks ...................................................................................................86
4.2
Front Panel Connectors ......................................................................................................87
4.2.1
USB Connector (J12).............................................................................................87
4.2.2
Serial Port Connector (J17) ...................................................................................87
4.2.3
4.2.4
Fibre Channel SFP Optical Transceiver Module....................................................90
4.2.5
PMC Connectors (J25, J26, J27)...........................................................................91
4.3
On-board Connectors .........................................................................................................94
4.3.1
IDE Connector (J24) ..............................................................................................94
5
Addressing.....................................................................................................................................95
5.1
Configuration Registers ......................................................................................................95
5.1.1
Configuration Address Register MCH CONFIG_ADDRESS .................................95
5.1.2
Configuration Data Register MCH CONFIG_ADDRESS .......................................95
5.2
I/O Address Assignments ...................................................................................................96
5.3
Memory Map .......................................................................................................................97
5.4
IPMC Addresses .................................................................................................................98
6
Specifications ................................................................................................................................99
6.1
Mechanical Specifications ..................................................................................................99
6.1.1
Board Outline .........................................................................................................99
6.1.2
Backing Plate .......................................................................................................102
6.1.3
Component Height ...............................................................................................102
6.2
Environmental Specifications............................................................................................107
6.3
Reliability Specifications ...................................................................................................107
6.3.1
Mean Time Between Failure (MTBF) Specifications............................................107
6.3.1.1
6.3.1.2
6.3.1.3
6.3.2
Power Consumption ............................................................................................108
6.3.3
Cooling Requirements .........................................................................................109
6.4
Board Layer Specifications ...............................................................................................109
6.5
Weight...............................................................................................................................109
7
BIOS Features .............................................................................................................................110
7.1
Introduction .......................................................................................................................110
7.2
BIOS Flash Memory Organization ....................................................................................110
7.3
Complementary Metal-Oxide Semiconductor (CMOS) .....................................................110
7.3.1
Copying and Saving CMOS Settings ...................................................................110
7.4
Redundant BIOS Functionality .........................................................................................111
7.5
System Management BIOS (SMBIOS) .............................................................................111
Technical Product Specification
Order #273817
®
Intel NetStructure
MPCBL0001 High Performance Single Board Computer
Environmental Assumptions ................................................................108
General Assumptions...........................................................................108
General Notes......................................................................................108
Contents
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