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6.3.3
Cooling Requirements
The Intel NetStructure
installed vertically in a chassis, with bottom-to-top airflow. Airflow is expected to be evenly
distributed across the bottom edge of the installed MPCBL0001 blade and maintain at least 300
LFM average airflow.
Most components on the MPCBL0001 blade are specified to operate with a localized ambient
temperature up to 70° C and do not require heat sinks. The MPCBL0001 blade uses two custom
heat sinks, one per processor (see
page
109.) The rate of airflow specified above is critical to ensuring that the blade operates as
designed.
Figure 26.
Low Voltage Intel
6.4
Board Layer Specifications
Material: TG180 FR4
Layers: 14
Copper:
•
Outer layers 1 and 14 are 1 oz copper
•
Middle planes 7 & 8 are 2 oz copper
•
All others are 1 oz copper.
6.5
Weight
The weight of the baseboard (N04 and F04) is 3.0645 kg (6.75 lbs.) without any packaging
materials.
Technical Product Specification
Order #273817
®
Intel NetStructure
MPCBL0001 High Performance Single Board Computer
®
MPCBL0001 High Performance Single Board Computer SBC should be
Figure 26, "Low Voltage Intel
®
Xeon™ Processor Heatsink
Contents
®
Xeon™ Processor Heatsink" on
B0903-01
109
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