Power Simulation Software; Reference Thermal Solution; Filling Groove With Adhesive - Intel WiFi Link 5100 Design Manual

Figure 17.

Filling Groove with Adhesive

Note: Prior to installing the heatsink, be sure that the thermocouple wires remain below the
IHS top surface by running a flat blade on top of the IHS, for example.
5.2

Power Simulation Software

Power simulation software now exists for the Intel
simulation software is a utility designed to dissipate the thermal design power on a
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Intel 5100 MCH Chipset when used in conjunction with the Dual-Core Intel
processor 5X00 series. The combination of the above mentioned processor(s) and the
higher bandwidth capability of the Intel
system performance. To assess the thermal performance of the MCH chipset thermal
solution under "worst-case realistic application" conditions, Intel developed a software
utility that operates the chipset at near worst-case thermal power dissipation.
The power simulation software developed should only be used to test thermal solutions
at or near the thermal design power. Real world applications may exceed the thermal
design power limit for transient time periods. For power supply current requirements
under these transient conditions, please refer to each component's datasheet for the
ICC (Max Power Supply Current) specification. Contact your Intel field sales
representative to order the power simulation software: Intel
Hub Chipset (embedded) – Maximum Power Application.
6.0

Reference Thermal Solution

Intel has developed two reference thermal solutions that meet the cooling needs of the
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Intel 5100 MCH Chipset under the embedded operating environments and
specifications defined in this document. This chapter describes the overall requirements
for the torsional clip heatsink reference thermal solution including critical-to-function
dimensions, operating environment, and validation criteria. Other chipset components
may or may not need attached thermal solutions depending on your specific system
local-ambient operating conditions. For information on the ICH9R, refer to the thermal
specification in the Intel
Design Guidelines.
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Intel 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
TDG
24
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5100 MCH Chipset enables higher levels of
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I/O Controller Hub 9 (ICH9) Family Thermal and Mechanical
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Intel 5100 MCH Chipset
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5100 MCH Chipset. The power
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5100 Memory Controller
Order Number: 318676-003US
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Xeon
July 2008