Toshiba B-EX4 T1 Series Product Description page 38

2. SUPPLY SPECIFICATIONS
2.6.5 Cautions for using RFID Tags
1) Lift-up of Print Head
An RFID tag chip or the thermal head may be damaged when the thermal head passes over the
chip. This can be prevented by using the ribbon saving module (standard feature for the B-EX6T
and optional for the B-EX4T) by which the thermal head is lifted up preventing it from touching the
chip when it passes over the chip.
When the thermal head is lifted up, the distance from the platen roller to the head is approximately
1 mm.
2) Storage of RFID Supplies
Do not store RFID tags close to printers, or their communication performance may not be as
specified when they are used.
3) Roll-type RFID Supplies
When RFID supplies are to be rolled, roll hardness must be concerned.
Although it depends on the type of glue, tag, and backing paper, RFID-tag embedded labels tend
to stay rolled. Especially, when they are wound outside, a media jam error may occur. Unless
otherwise specified, it is recommended that the RFID-tag embedded labels be wound inside.
4) Sensor
When the transmissive sensor or reflective sensor is enabled, transmissivity or reflectivity of a
label or tag may vary at an RFID-tag embedded area depending on the pattern of an antenna or
other factors. In such cases, a manual threshold setting is required in the printer system mode.
For details, refer to the B-EX4T/EX6T Key Operation Specifications.
5) Cutter
When an RFID label or tag is used in cut issue mode, care must be taken not to cut the antenna or
the IC chip of an RFID tag in order not to damage the cutter.
6) Static Electricity
When printing is performed in a place where humidity is low or under some specific conditions,
writing data on an RFID tag may fail due to static electricity generated by a label or a ribbon.
2.6 SPECIFICATION OF RFID TAG (for B-EX700-RFID-U2-EU-R)
2-22
SPTM-0152