Active Replacement And Hot Replacement - Fujitsu SPARC Enterprise M8000 Service Manual

6.2

Active Replacement and Hot Replacement

The active replacement procedure and hot replacement procedure are almost the same. This
section explains both procedures together. Each step that is different between these
procedures is distinguished by "Active replacement" or "Hot replacement" as a header. The
main difference between active replacement and hot replacement is as follows:
Active replacement: A CMU is disconnected from or configured into a domain by
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dynamic reconfiguration (DR).
There are restrictions on the DR operation depending on whether the Oracle Solaris OS
operates in the SPARC64 VII enhanced mode or in the SPARC64 VI compatible mode.
For DR operation, see the SPARC Enterprise M4000/M5000/M8000/M9000 Servers
Dynamic Reconfiguration (DR) User's Guide.
Hot replacement: A domain must be stopped and restarted.
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The procedure for active replacement and hot replacement is as follows.
1. Unlock and open a door of the server. (See
Caution – Before touching a CMU or dummy (filler) unit, see
Precautions" on page 1-9
result in serious damage to operating domains.
2. Check whether the CMU to be replaced is logically divided and what domains are
affected by the replacement.
a. From the console that is connected to XSCF, log in to XSCF, and execute the
b. If it is logically divided, execute the showdcl command to check whether the
c. Execute the showboards command to check the use states of the devices and
For details on how to log in to XSCF and commands, see the SPARC Enterprise
M3000/M4000/M5000/M8000/M9000 Servers XSCF User's Guide.
For details of commands, see also the SPARC Enterprise
M3000/M4000/M5000/M8000/M9000 Servers XSCF Reference Manual, or the man page.
and be sure to wear the antistatic wrist strap. Failure to do so might
showfru command. Then, check whether the CMU is logically divided.
CMU to be replaced and another CMU comprise a domain.
resources in the CMU.
Chapter 6 Replacement of CPU/Memory Board Unit (CMU), CPU Module, and DIMM
Chapter 5)
Section 1.4, "Antistatic
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