Mechanical Data; Introduction; Die Loading; Table 17. Mechanical Loading - AMD AX1800DMT3C - Athlon XP 1.53 GHz Processor Datasheet

24309E—March 2002
9

Mechanical Data

9.1

Introduction

9.2

Die Loading

Chapter 9
Preliminary Information
The AMD Athlon™ XP processor model 6 connects to the
motherboard through a Pin Grid Array (PGA) socket named
Socket A. This processor utilizes the Organic Pin Grid Array
( O P G A ) p a ck a g e t y p e d e s c r i b e d i n " O P G A Pa ck a g e
Description" on page 48. For more information, see the
AMD Athlon™ Processor-Based Motherboard Design Guide, order#
24363.
The processor die on the OPGA package is exposed at the top of
the package. This feature facilitates heat transfer from the die
to an approved heat sink. It is critical that the mechanical
loading of the heat sink does not exceed the limits shown in
Table 17. Any heat sink design should avoid loads on corners
and edges of die. The OPGA package has compliant pads that
serve to bring surfaces in planar contact. Tool-assisted zero
insertion force sockets should be designed so that no load is
placed on the ceramic substrate of the package.
Table 17 shows the mechanical loading specifications for the
processor die.

Table 17. Mechanical Loading

Location Dynamic (MAX)
Die Surface
Die Edge
Notes:
1. Load specified for coplanar contact to die surface.
2. Load defined for a surface at no more than a two degree angle of inclination to die surface.
Mechanical Data
AMD Athlon™ XP Processor Model 6 Data Sheet
Static (MAX)
100 30
10 10
Units Note
lbf 1
lbf 2
47