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Trademarks AMD, the AMD Arrow logo, AMD Athlon, AMD Opteron and combinations thereof, are trademarks of Advanced Micro Devices, Inc. Other product names used in this publication are for identification purposes only and may be trademarks of their...
February 2003 3.02 Revised Figure 3, “Motherboard Component Height Restrictions for the AMD Athlon™ 64 Processor Thermal Solution,” on page 16, and the drawings in the Appendix, section A3, “Motherboard Component Keep-Out Areas and Height Restriction Drawings,” on pages 35–44.
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AMD Athlon™ 64 and AMD Opteron™ Processors 26633 Rev. 3.03 September 2003 Thermal Design Guide...
AMD Opteron processors. 1.1 Summary of Requirements To allow optimal reliability of the AMD Opteron and AMD Athlon 64 processor-based systems, the thermal and cooling solution should dissipate heat from a processor operating at its maximum thermal power. The sections in this document specify required values for the thermal and mechanical parameters.
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Preliminary Information 26633 Rev. 3.03 September 2003 AMD Athlon™ 64 and AMD Opteron™ Processors Thermal Design Guide Introduction Chapter 1...
AMD Athlon 64, AMD Athlon 64 FX, and AMD Opteron processors. The thermal and mechanical specifications for the 940-pin AMD Athlon 64 FX processor are the same as those for the AMD Opteron processor. For the thermal and mechanical requirements for the AMD Athlon 64 FX processor, refer to the AMD Opteron processor information presented in this document.
Therefore, independent support structures are required for mounting the heatsink. Figure 1. 754-pin µPGA Socket Used for the AMD Athlon™ 64 Processor AMD Athlon™ 64 and AMD Opteron™ Processors Thermal Requirements Chapter 2...
Thermal Design Guide Figure 2 shows a three-dimensional view of the Socket 940, which is used for the AMD Opteron processor. As with the Socket 754, it has a 1.27 mm array pitch but has a 31x31 pin array with various pins removed from the package for keying and mechanical support.
An overview of the motherboard component restrictions for the AMD Athlon 64 is shown in Figure 3. A complete detailed set of drawings is shown in Appendix A.3 on page 47. Thermal-solution designers must adhere to these geometric restrictions to be compatible with the motherboards designed for the AMD Athlon 64 processor.
Table 2 provides the design-target specifications that must be met for the AMD Athlon 64 and AMD Opteron processors to operate reliably. Table 2. Thermal Solution Design Requirements for the AMD Athlon™ 64 and AMD Opteron™...
Table 3 lists the parts that comprise the thermal reference design solution 1 for the AMD Opteron and AMD Athlon 64 processors. The heatsink installers do not have to assemble each individual component. The heatsink suppliers package the parts with some of the components already assembled.
2.5.2 Thermal Reference Design Solution 2 Table 4 lists the parts used in the thermal reference design solution 2 for the AMD Athlon 64 and AMD Opteron processors. An exploded view of the components used for this thermal solution is shown in Figure 8 on page 23.
The size of the square hole differs according to the type of processor. The AMD Athlon 64 processor version has a 20 mm square hole while the AMD Opteron processor version has a 26 mm square hole. Using a 26-mm hole on both AMD Athlon 64 and AMD Opteron processors is being investigated, and the results will be included in an update of this document.
AMD Athlon™ 64 and AMD Opteron™ Processors Thermal Design Guide The reference spring clip material is the heat-treatable spring steel, SK7. AMD strongly recommends using SK7 or an equivalent material for the spring clip. The clip should be plated after heat treatment for cosmetic and anti-corrosive reasons. Table 5 gives the chemical composition of SK7.
An example of a low-cost heatsink utilizing extruded aluminum stock is shown in Figure 11. Figure 11. Example of a Low-Cost Heatsink Using Aluminum Extrusion Technology Chapter 2 AMD Athlon™ 64 and AMD Opteron™ Processors Thermal Requirements...
An example of a high performance heatsink using a high-density fin technology is shown in Section A.4 on page 64. Figure 12. High Performance Heatsink with Copper Slug Embedded in the Base AMD Athlon™ 64 and AMD Opteron™ Processors Thermal Requirements Chapter 2...
Thermal Design Guide 2.6.4.3 Required Exhaust Airflow Direction The current that a motherboard must supply to the AMD Athlon 64 and AMD Opteron processors has increased during the development of these processors. The increase in current requires that air exhausting from the heatsink be directed across the motherboard processor voltage regulator.
Acoustic noise is a concern for both system builders and AMD. Systems with high levels of acoustic noise can generate customer complaints and can influence the acceptance of a product.
Figure 14 shows a typical fan speed curve. The actual fan speed can depend on the heatsink, but the speed versus temperature ramping should be implemented as shown in the figure. Figure 14. Typical Temperature-Fan Speed Relation for Speed-Controlled Fan Chapter 2 AMD Athlon™ 64 and AMD Opteron™ Processors Thermal Requirements...
However, the thermal solutions did not meet required thermal performance levels below 3000 rpm. Figure 15. Acoustic Noise from Sample Thermal Solutions with a 70x15 mm Fan AMD Athlon™ 64 and AMD Opteron™ Processors Thermal Requirements Chapter 2...
2.6.7 EMC Shield Because of the high clock frequencies of the AMD Opteron and AMD Athlon 64 processors, an EMC shield has been designed and incorporated into the thermal solution. This shielding is a component that may or may not be necessary for meeting regulatory agency requirements, depending on the system.
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Preliminary Information 26633 Rev. 3.03 September 2003 AMD Athlon™ 64 and AMD Opteron™ Processors Thermal Design Guide AMD Athlon™ 64 and AMD Opteron™ Processors Thermal Requirements Chapter 2...
Thermal Design Guide Chapter 3 Conclusion The AMD Opteron™ and AMD Athlon™ 64 processor thermal reference design solutions 1 and 2 have been presented in this document. These thermal solutions should provide the thermal engineer the design information to either implement the thermal reference design solutions...
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Preliminary Information 26633 Rev. 3.03 September 2003 AMD Athlon™ 64 and AMD Opteron™ Processors Thermal Design Guide Conclusion Chapter 3...
Preliminary Information 26633 Rev. 3.03 September 2003 AMD Athlon™ 64 and AMD Opteron™ Processors Thermal Design Guide Appendix This section describes thermocouple instrumentation and the procedure for clip load testing. Thermocouple Instrumentation Thermocouples measure the three necessary temperatures that are used for a detailed thermal- performance analysis.
Preliminary Information 26633 Rev. 3.03 September 2003 AMD Athlon™ 64 and AMD Opteron™ Processors Thermal Design Guide 2) Tape down the thermocouple such that the bead is centered on the package as indicated by the intersection of the diagonals. Be sure to have the thermocouple oriented to align it properly with the relief groove in the heatsink as shown in Figure 17.
Preliminary Information 26633 Rev. 3.03 September 2003 AMD Athlon™ 64 and AMD Opteron™ Processors Thermal Design Guide Figure 18. Thermocouple Attached to Processor with Strain Relief on Package and PCB. Figure 19. Heatsink with Thermocouple Relief Groove Machined into Base...
Preliminary Information 26633 Rev. 3.03 September 2003 AMD Athlon™ 64 and AMD Opteron™ Processors Thermal Design Guide A.1.2 Heatsink Thermocouple Attachment 1) Drill a 1.5-mm diameter hole in the heatsink base as shown in Figure 20. Figure 20. Heatsink Thermocouple Relief Groove and Measurement Hole 2) Inject thermal grease, such as Dow Corning 340, into the hole with a needle.
Thermal Design Guide Procedure for Clip Load Testing This section provides the necessary information to measure the force applied by a heatsink clip to the AMD Athlon™ 64 processor. This force is known as the clip load. A.2.1 Equipment The following sections detail the equipment needed to measure the clip load.
Preliminary Information 26633 Rev. 3.03 September 2003 AMD Athlon™ 64 and AMD Opteron™ Processors Thermal Design Guide Figure 22. Load Cell Inserted into the Load Cell Fixture The load cell fixture should be machined from a stainless steel material. A drawing of the fixture is shown in Figure 23 on page 43.
Preliminary Information 26633 Rev. 3.03 September 2003 AMD Athlon™ 64 and AMD Opteron™ Processors Thermal Design Guide Figure 23. Drawing of Load Cell Fixture for the Entran ELW-D1 Load Cell Appendix A Appendix...
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Preliminary Information 26633 Rev. 3.03 September 2003 AMD Athlon™ 64 and AMD Opteron™ Processors Thermal Design Guide A.2.1.3 Test Board Any printed circuit board made for use with the Socket 754 processor family should be able to accept clip load testing. Be sure the fixture does not interfere with any components that may be mounted to the PCB in the socket window.
Preliminary Information 26633 Rev. 3.03 September 2003 AMD Athlon™ 64 and AMD Opteron™ Processors Thermal Design Guide A.2.2 Procedure The following procedure details how to obtain the clip load using the load cell fixture assembly: 1. Set the voltage output on the voltage source to 15.00 V and connect the load cell as indicated by the manufacturer.
Preliminary Information 26633 Rev. 3.03 September 2003 AMD Athlon™ 64 and AMD Opteron™ Processors Thermal Design Guide 6. Place the retention frame onto the board and align it with the backplate standoffs. 7. Place the heatsink on the load cell assembly.
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Height Restriction Drawings The ten drawing sheets in this section from page 48 through page 57 provide information for the motherboard component keep-out areas and height restrictions for the AMD Athlon 64 processor based on the 754-pin socket. The ten drawing sheets in this section from page 58 through page 67 provide information for the motherboard component keep-out areas and height restrictions for the AMD Opteron processor based on the 940-pin socket.
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Preliminary Information 26633 Rev. 3.03 September 2003 AMD Athlon™ 64 and AMD Opteron™ Processors Thermal Design Guide Thermal Reference Design Solution Component Drawings Pages 69 through 82 contain drawings for the components of the thermal reference design solutions 1 and 2.
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