Table 1: Revision History - AMD ADA3000DAA4BW - Athlon 64 1.8 GHz Processor User Manual

PID: 30430 Rev 3.51 March 2006

Table 1: Revision History

Date Revision
March 2006 3.51
March 2006 3.47
October 2004 3.43
October 2004 3.41
August 2004 3.37
July 2004 3.29
June 2004 3.25
May 2004 3.21
April 2004 3.19
April 2004 3.17
March 2004 3.15
March 2004 3.13
January 2004 3.11
January 2004 3.07
December 2003 3.06
November 2003 3.05
September 2003 3.02
September 2003 3.00
AMD Athlon™ 64 Processor Power and Thermal Data Sheet
Description
Added three AMD Turion™ 64 Mobile Technology OPNS: TMSMT32BQX4LD,
TMSMT34BQX5LD, and TMSMT37BQX5LD.
Added OPNs across all processor brands. Added new Section 5
AMD Athlon™ 64 X2 Dual Core Processor. Added new Section 6 MTOPS.
Added OPN for model 4000+ desktop
Added FX-55 OPN. Added desktop OPNs for models 3000+, 3200+, and 3500+.
Documented T max parameter for all OPNs. Removed chapters 3, 4, and 6.
CONTROL
Added AMD Sempron™ Processor and Mobile AMD Sempron™ Processor chapters.
Removed model 3100+ 62W OPN. Added DTR Model 3700+ OPN.
Added model 3400+ 62W mobile OPN.
Added rev CG 89W model 3500+, 3700+, and 3800+ OPNs. Added FX-53 939 pin
package OPN. Added one decimal precision to some IDD numbers. Updated
document references.
Added rev CG 35W models 2700+ and 2800+.
Removed rev CG 35W OPN.
Corrected model number formatting for DTR OPNs.
Added rev CG 35W model 2700+ OPN.
Added rev CG model 2800+, 3000+, and 3200+ 89W OPNs. Added FX-53 940 pin
package OPN. Corrected note for C3 state on all Power/Thermal Specification tables.
Added package drawing references for lidless parts in OPN decode section.
Added rev CG entries for existing rev C0 parts. Corrected Max FID code for model
3200+ 62W mobile OPN. Updated FX-51 Halt/Stop Grant power number. Revised
IDD Max and TDP for Intermediate P-state #2 for 754 pin lidless package Rev C0
DTR Model 3200+.
Added model 3400+ DT and DTR parts. Added model 2800+, 3000+, and 3200+ 62W
Mobile parts.
Added model 3000+ desktop part.
General clean up. Updated S3 I/O power for non-FX parts. Fixed mobile OPN
example. Added thermal resistance specifications for all OPNs.
Changed min P-state information to N/A in Table 8, and removed unreleased entries
from Table 4 and Table 14.
Initial public release.
7