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HP BL685c - ProLiant - 4 GB RAM Site Planning Manual

Hp bladesystem c-class site planning guide
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HP BladeSystem c-Class

Site Planning Guide

Part Number 443250-002
January 2009 (Second Edition)


Table of Contents

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  • Page 1: Site Planning Guide

    HP BladeSystem c-Class Site Planning Guide Part Number 443250-002 January 2009 (Second Edition)
  • Page 2 © Copyright 2007, 2009 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.
  • Page 3: Table Of Contents

    Contents Introduction ..........................6 About this document ..........................6 Related documentation..........................6 General site preparation guidelines ....................7 ASHRAE guidelines for site planning......................7 HP site planning assistance......................... 7 Site planning considerations ........................8 Computer room preparation ........................8 Cooling requirements..........................9 Basic air conditioning equipment requirements ..................
  • Page 4 Rack placement and arrangement for proper airflow................27 Rack tie-down option kit ......................... 28 Power requirements and considerations..................29 Power requirements ..........................29 Electrical factors ............................29 Power consumption........................30 Electrical load requirements (circuit breaker sizing) ................31 Power quality..........................32 Power considerations ........................
  • Page 5 Formulas ..............................66 Technical support........................67 Before you contact HP..........................67 HP contact information ..........................67 Acronyms and abbreviations......................68 Glossary ............................ 70 Index............................72 Contents 5...
  • Page 6: Introduction

    Introduction About this document This document helps facilities and IT staff plan for the receipt and installation of HP BladeSystem c-Class products in a dedicated computer facility. The document is structured as follows: • General site preparation guidelines (on page 7) This section provides an overview of general site requirements to prepare your computer room facility to accept HP BladeSystem hardware.
  • Page 7: General Site Preparation Guidelines

    General site preparation guidelines ASHRAE guidelines for site planning The American Society of Heating, Refrigerating and Air-Conditioning Engineers has published a common set of guidelines for equipment manufacturers and data center designers to standardize on the following issues relating to a data center site: •...
  • Page 8: Site Planning Considerations

    data center. HP Services professionals recommend changes to optimize climatic conditions and reclaim capacity, postponing or even eliminating the need for costly mechanical upgrades. Choose from three service levels to meet your specific requirements. • HP Datacenter Site Planning Service—Obtain a comprehensive site-preparation audit to help you successfully integrate new equipment into your facility.
  • Page 9: Cooling Requirements

    • Ensure that all ceiling tiles are in place. • Ensure a minimum of 457 mm (18 in) or local code minimum clearance, whichever is larger, from the top of the rack to the fire sprinkler heads. Cooling requirements Air conditioning equipment requirements and recommendations are described in the following sections. Basic air conditioning equipment requirements The cooling capacity of the installed air conditioning equipment for the computer room should be sufficient to offset the computer equipment dissipation loads, as well as any space envelope heat gain.
  • Page 10: Basic Air Distribution Systems

    • Direct-expansion refrigerant-based unit with remote air-cooled condensers • Direct-expansion refrigerant-based unit with glycol cold condensers An increasing number of in-row cooling solutions as well as water-cooled cabinets are available. Basic air distribution systems A basic air distribution system includes supply air and return air. An air distribution system should be zoned to deliver an adequate amount of supply air to the cooling air intake vents of the racks.
  • Page 11: Air Conditioning Ducts

    Air conditioning ducts Use separate computer room air conditioning duct work. If it is not separate from the rest of the building, it might be difficult to control cooling and air pressure levels. Duct work seals are important for maintaining a balanced air conditioning system and high static air pressure. Adequate cooling capacity means little if the direction and rate of air flow cannot be controlled because of poor duct sealing.
  • Page 12: Floor Loading

    Floor loading The computer room floor must be able to support the total weight of the installed components as well as the weight of the individual racks as they are moved into position. Floor loading is usually not an issue in nonraised floor installations. The information presented in this section is directed toward raised floor installations.
  • Page 13: Computer Room Safety

    Computer room safety Inside the computer room, fire protection and adequate lighting (for equipment servicing) are important safety considerations. Federal and local safety codes that govern equipment installations. Installation and maintenance precautions To reduce the risk of electric shock or damage to the equipment when installing, maintaining, or servicing Enterprise products, observe the following general precautions: •...
  • Page 14: Lighting Requirements For Equipment Servicing

    Lighting requirements for equipment servicing Adequate lighting and utility outlets in a computer room reduce the possibility of accidents and improve efficiency during equipment servicing. The minimum recommended illumination level is 756 lm/m foot candles) when the light level is measured at 762 mm (30 in) above the floor. Occupancy-controlled lighting, with manual override switches for use during extended occupancy periods or for servicing, is more efficient and less costly.
  • Page 15: Environmental Requirements

    Environmental requirements Environmental elements The following environmental elements can affect HP BladeSystem c-Class product installation. Humidity level Maintaining proper humidity levels in the computer room is essential for reliable equipment performance. Humidity levels outside the recommended range of 25 to 45 percent, especially if these levels are sustained, lead to equipment damage and result in equipment malfunction through several mechanisms.
  • Page 16: Metallic Particulate Contamination

    Smaller particles can pass through some filters, and over time, cause problems in mechanical parts. Selection of the appropriate filter media and maintaining the air conditioning system at a high static air pressure level can prevent small dust particles from entering the computer room. Other dust, metallic, conductive, abrasive, or microscopic particles can result from the following sources: •...
  • Page 17: Electrostatic Discharge Prevention

    Electrostatic discharge prevention Static charges (voltage levels) occur when objects are separated or rubbed together. The voltage level of a static charge is determined by the following factors: • Types of materials • Relative humidity • Rate of change or separation Follow these precautions to minimize possible ESD-induced failures in the computer room: •...
  • Page 18: Recommended Operating Environment

    Recommended operating environment To help ensure continued safe and reliable equipment operation, install or position the rack in a well ventilated, climate-controlled environment. Air inlet temperature to the rack should be between 20 to 25ºC under normal operating conditions in the data center, per ASHRAE standard TG9 HDEC.
  • Page 19: Airflow Requirements

    Airflow requirements HP rack-mountable products typically draw in cool air through the front and exhaust warm air out through the rear of the rack. The front door of the rack must be ventilated adequately to enable ambient room air to enter the rack with as little restriction as possible. Likewise, the rear door must offer as little restriction as possible to the warm air escaping from the rack.
  • Page 20: Delivery Space Requirements

    • At least 762 mm (30 in) of clearance is needed in the rear of the rack to provide access to components. • At least 380 mm (15 in) of clearance is needed around a power supply to facilitate servicing. For more information, see "Working space for component access (on page 14)".
  • Page 21: Floor Plan Grid

    WARNING: When configuring a solution, make sure that the floor loading specifications are followed. Failure to do so can result in physical injury or damage to the equipment and the facility. 10000 and 10000 G2 Series Rack footprint (600 mm [24 in] wide) 10000 Series Rack footprint (800 mm [31.5 in] wide) Floor plan grid A floor plan grid is used to plan the location of equipment in the computer room.
  • Page 22: Hp Bladesystem Enclosure Environmental Specifications

    HP BladeSystem enclosure environmental specifications Specification Value Temperature range* Operating 10°C to 35°C (50°F to 95°F) Non-operating -30°C to 60°C (-22°F to 140°F) Wet bulb temperature Operating 28ºC (82.4ºF) Non-operating 38.7ºC (101.7ºF) Relative humidity (noncondensing)** Operating 20% to 80% Non-operating 5% to 95% * All temperature ratings shown are for sea level.
  • Page 23: Front Door Clearance

    Footprint for a 600 mm rack configuration with an extension and standard stabilizer kit installed (1001.5 mm wide x 1390.0 mm deep): Footprint for a 600 mm rack configuration with an extension and heavy duty stabilizer kit installed (1001.5 mm wide x 1414.7 mm deep): Front door clearance When racks are bayed together, the design of the front door limits the extent to which the rack door on the right can open.
  • Page 24 • 90º access with one door closed • 120º access with both doors open Front door clearance for 10000 Series Racks configured with 24-in baying brackets is: • 102º access with one door closed Environmental requirements 24...
  • Page 25 • 120º access with both doors open Front door clearance for 10000 G2 Series Racks configured with 600 mm baying brackets is: • 95º access with one door closed • 118º access with both doors open Front door clearance for 10000 G2 Series Racks configured with 24 in baying brackets is: Environmental requirements 25...
  • Page 26: Best Practices For Deployment In Rows

    • 108º access with one door closed • 118º access with both doors open Best practices for deployment in rows Baying kits are used to physically connect adjacent racks to create a row of two or more units. Racks that are bayed together with a baying kit are more stable and reduce the potential tipping of the rack.
  • Page 27: Rack Placement And Arrangement For Proper Airflow

    Rack placement and arrangement for proper airflow Racks must be placed and arranged properly in the data center to provide sufficient airflow and clearance for access to the rack. In the front of the rack, a clearance of 1219 mm (48 in) is required. This requirement applies to individual rack installations as well as when aligning rack rows so that the front doors are facing each other.
  • Page 28: Rack Tie-Down Option Kit

    • Rear door: The clearance between the rear of the enclosure and the rear rack door must be a minimum of 175 mm (6.9 in) to accommodate system cabling. • Side: The clearance between the installed rack component and the side panels of the rack must be a minimum of 70 mm (2.75 in).
  • Page 29: Power Requirements And Considerations

    Power requirements and considerations Power requirements When planning power distribution requirements, observe the following: • The power load must be balanced between available AC supply branch circuits. • The AC current load attached to a branch circuit must not exceed 80 percent of that branch circuit current rating.
  • Page 30: Power Consumption

    Power consumption Power consumption can be divided into two broad categories: • Marked electrical amperage, which is listed on the required safety and regulatory labels, generally represents the maximum current draw that the marked device could achieve. Safety and regulatory labels on computer equipment list the ratings for maximum power consumption conditions.
  • Page 31: Electrical Load Requirements (Circuit Breaker Sizing)

    • Use power sizing tools to calculate the infrastructure required as configured and allow some flexibility for growth. HP provides power sizing tools for all its current industry standard servers. These calculators can be found at the following locations: For ML and DL products, on the HP website ( For BladeSystem products, on the HP website (
  • Page 32: Power Quality

    Power quality Most HP products are designed to operate over a wide range of voltages and frequencies. The products are tested and shown to comply with certain EMC Specifications. However, damage can occur if these ranges are exceeded. Severe electrical disturbances can exceed the design specifications of the equipment.
  • Page 33: Power Options

    Connect each PDU to a dedicated (unshared) branch circuit that is rated for the continuous measured load of all the equipment connected to it. The total power load for a PDU should not exceed 80 percent of the branch circuit rating. If a PDU is not used, connect each piece of equipment within the rack to a dedicated branch circuit.
  • Page 34: Distribution Hardware

    • N+N design: N power supplies can be provided where N/2 power supplies are capable of sustaining the associated equipment's power demand. For the c7000 enclosure, this quantity is typically a 2+2 or 3+3 power supply configuration. • N+1 design: Typically four power supplies are provided, requiring at least three to handle the equipment's power demand.
  • Page 35: Grounding Requirements

    Raceway systems (electrical conduits) (LAHJ) Raceways (electrical conduits) form part of the protective ground path for personnel and equipment. Raceways protect the wiring from accidental damage and also provide a heatsink for the wires. Any of the following types may be used: •...
  • Page 36: Main Building Electrical Ground

    • For UPS products and PDUs that have permanently attached AC power cords or are directly wired to the building power, the total combined leakage current should not exceed 5 percent of the total input current required for the connected products. •...
  • Page 37 measured above 3.0 V might be hazardous to personnel or cause equipment performance issues and must be corrected before placing the equipment in service. Cabinet performance grounding (high frequency ground) Some safety power distribution wires are too long and too inductive to provide adequate high-frequency return paths.
  • Page 38: System Installation Guidelines

    • Add a grounding grid made of copper strips mounted to the subfloor. The strips should be 0.8 mm (0.032 in) thick and a minimum of 76 mm (3.0 in) wide. Connect each pedestal to four strips using 6-mm (0.25-in) bolts tightened to the manufacturer’s torque recommendation. Equipment grounding implementation details Connect all HP equipment cabinets to the site ground grid as follows: Attach one end of each ground strap to the applicable cabinet ground lug.
  • Page 39: Power Configuration

    Wiring connections must be properly torqued. Many equipment manufacturers specify the proper connection torque values for their hardware. Ground connections must only be made on a conductive, nonpainted surface. When equipment vibration is present, lock washers must be used on all connections to prevent connection hardware from working loose.
  • Page 40 • HP BladeSystem c3000 Enclosure • HP BladeSystem c3000 Tower Enclosure Power requirements and considerations 40...
  • Page 41 • HP BladeSystem c7000 Enclosure To cable the enclosure using a single-phase AC configuration: Connect the AC power cables to the power connectors on the rear of the enclosure corresponding to the power supply that was populated on the front of the enclosure. Connect the AC power cables to the AC power source or to an installed PDU.
  • Page 42 Slide the power cord retention bracket until the bracket touches the enclosure. Insert the power cord retention tabs into the slots on the enclosure until they snap into place. Slide each snap clamp over the end of each power cord overmold, and then squeeze each snap clamp closed.
  • Page 43 PDU installation The PDU can be installed in either a 1U or a 0U configuration. For specific details on installing the PDU in the rack, see the installation instructions that came with the PDU For technical specifications on HP Modular and Monitored PDUs, see the HP website (
  • Page 44 Enclosure/switch Power supply Load segment Port 2 = uppermost 1 = bottommost Switch A Single Right extension bar — Top - 1 Enclosure C Left Enclosure C Left Enclosure C Left Enclosure C Right Enclosure C Right Enclosure C Right Enclosure B Left Enclosure B...
  • Page 45: Hp Bladesystem C7000 Enclosure Three-Phase Ac Configuration

    • N+N redundant, 5kVA enclosure configuration with 24A single-phase PDU HP BladeSystem c7000 Enclosure three-phase AC configuration To cable the enclosure using a three-phase AC configuration: The AC power cables are already attached to the enclosure. Connect the AC power cables to the AC power source. Turn on the AC circuit breakers that power the power cables installed in the enclosure.
  • Page 46: Hp Bladesystem Enclosure Dc Power Configuration

    When first initialized, the Onboard Administrator programs the mezzanine cards on the server blades during discovery. After the mezzanine cards are programmed, powering up the enclosure takes only 1 to 2 minutes. The enclosure and the Insight Display now have power. Configure the enclosure using the Insight Display. HP BladeSystem enclosure DC power configuration For telco or other environments that have -48V DC available, DC-powered HP BladeSystem enclosures can be purchased through the HP Configure To Order process.
  • Page 47: Power Supply Specifications

    HP BladeSystem c3000 Enclosure DC configuation HP BladeSystem c3000 Enclosure HP BladeSystem c3000 Tower Enclosure Power supply specifications Single-phase HP 2250W Power Supply specification Specification Value Power cord IEC-320 C19-C20 1.22 m (4 ft) Output 2250 W per power supply Input requirements Power requirements and considerations 47...
  • Page 48: Single-Phase Hp 2400W High Efficiency Power Supply Specification

    Specification Value Rated input voltage 100 VAC to 124 VAC 200 VAC to 240 VAC Rated input frequency 50 Hz to 60 Hz Rated input current per power 11.7 A at 100 VAC supply (maximum) 10.6 A at 110 VAC 10.1 A at 115 VAC 9.7 A at 120 VAC 13.1 A at 200 VAC...
  • Page 49: Three-Phase Hp 2400W High Efficiency Power Supply Specification (North America/Japan)

    Specification Value Rated input voltage 200 VAC to 220 VAC line-to-line 3-phase Delta Rated input frequency 50 Hz to 60 Hz Rated input power per power 7836VA cord (maximum) Three-phase HP 2400W High Efficiency Power Supply specification (North America/Japan) Specification Value Power cords (2) NEMA L15-30p...
  • Page 50: Three-Phase Hp 2400W Power Supply Specification (International)

    Three-phase HP 2400W Power Supply specification (International) Specification Value Power cords (2) IEC-309 200/346-V to 240/415-V, 5-pin, 16-A 2.44 m (10 ft) Max input current per line cord 12.6 A at 220 VAC 11.5 A at 240 VAC Max input power per line cord 8340 VA Maximum Input requirements Rated input voltage...
  • Page 51: Hardware Specifications And Requirements

    Hardware specifications and requirements Enclosure specifications The HP ProLiant c-Class enclosure specifications are provided for site planning purposes. For the latest specfications, see the HP website ( HP BladeSystem c7000 Enclosure specifications Specification Value Product dimensions Height 442.0 mm (17.4 in) Depth 813.0 mm (32.0 in) Width...
  • Page 52: Hp 10000 G2 Rack Specifications

    Specification Value Height 584.00 mm (23.00 in) Depth 1013.00 mm (39.88 in) Width 607.00 mm (23.88 in) Standard enclosure weight * Unboxed 65.80 kg (145.00 lb) Shipping 88.50 kg (195.00 lb) Maximum enclosure weight Unboxed 136.00 kg (300.00 lb) Shipping 158.80 kg (350.00 lb) * Includes two power supplies, four fans, and one Onboard Administrator.
  • Page 53: Rack-Free Environment Requirements

    • Front door: The clearance from face of rack to inside of the front door must be a minimum of 77 mm (3 in). • Rear door: The clearance between the rear of the enclosure and the rear rack door must be a minimum of 175 mm (6.9 in) to accommodate system cabling.
  • Page 54: Configuration Scenarios

    Configuration scenarios Example configurations The following configuration examples were calculated using the HP Blade Power Sizer Tool. This tool is designed for facilities planning purposes only. Values obtained from the tool are based on worst case loads. Whenever possible, actual measurements are recommended. Measurements should be made with the intended configuration, application loading, and ambient environment.
  • Page 55: Example Maximum Configuration

    • HP ProLiant BL465c Server Blades (16) 2.8-GHz AMD Opteron™ Model 2220 processor (2 per server blade) 8GB (4 x 2GB) RAM per server blade 72GB 15,000-rpm SAS hard drives (2 per server blade) QLogic Dual-Port Fibre Channel Mezzanine (1 per server blade) Total system leakage current per branch 0 mA Total system inrush current per branch (2 mS)
  • Page 56: Estimating Power And Cooling

    Power credentials Idle 100% utilization Circuit sizing Total airflow (CMM) 7.652 10.203 15.019 Estimating power and cooling Power consumed by a c-Class BladeSystem solution is converted to heat, which is expressed in British thermal units per hour (BTU/h). You can calculate the heat load for a system by using the following equation: Heat Load = Power (Watts) x 3.413 BTU/h.
  • Page 57: Estimating Total Weight

    Component Quantity Watts BTUs Total c7000 enclosure (configured) Other rack options Option A Option B Total power Estimating total weight You might need to determine the total weight of custom configurations if any of the following considerations apply: • Variations in flooring support when moving the solution during installation •...
  • Page 58: Preparing For Installation

    Preparing for installation Warning, caution, and important messages WARNING: To reduce the risk of personal injury or damage to equipment, heed all warnings and cautions throughout the installation instructions. WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that: The leveling jacks are extended to the floor.
  • Page 59 WARNING: Before installing an enclosure in the rack, be sure that all hot-plug power supplies, server blades, and interconnects are removed from the enclosure. Blanks can be left in the enclosure. WARNING: Be sure to install enclosures starting from the bottom of the rack and work your way up the rack.
  • Page 60: Additional Rack Considerations

    Additional rack considerations Consider the following additional specifications and components, with regard to your specific rack configuration: • Power—If a UPS is installed, do not exceed its output rating. Be sure to review the installation instructions provided with each component for important cautions and warnings. •...
  • Page 61: Rack Configuration Software

    WARNING: To reduce the risk of personal injury or damage to the equipment, always load the heaviest item first from the bottom of the rack up. This makes the rack bottom-heavy and helps prevent the rack from becoming unstable. Refer to Configuration Factors. WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that: The leveling feet are extended to the floor.
  • Page 62: Sample Installation Schedule

    • 60 days before installation Floor plan design completed and sent to Hewlett-Packard (if required to be an HP task) • 30 days before installation Primary power and air conditioning installation completed...
  • Page 63 Is there a completed floor plan? Is there adequate space for maintenance needs? Minimum recommended clearances, front and rear: 914 mm (36 in). Is access to the site or computer room restricted? Is the computer room structurally complete? Is a raised floor installed and in good condition? Is the raised floor adequate for equipment loading? Are there channels or cutouts for cable routing? Is there a remote console telephone line available with an...
  • Page 64: Delivery Survey

    28. Can cooling be maintained between 20ºC and 55ºC (up to 5000 ft)? Derate 1º C/1000 ft above 5000 ft and up to 10,000 ft. 29. Can temperature changes be held to 10ºC/h with tape media? Can temperature changes be held to 20ºC/h without tape media? 30.
  • Page 65 Elevator Capacity (kg or lb): Depth: Height: Width: Stairs Number of flights: Width: Preparing for installation 65...
  • Page 66: Conversion Factors And Formulas

    Conversion factors and formulas Conversion factors The conversion factors provided here are intended to help in data calculation for systems that do not conform to the specific configurations listed in this guide. Listed below are the conversion factors used in this document, as well as additional conversion factors that can be helpful in determining those factors required for site planning.
  • Page 67: Technical Support

    Technical support Before you contact HP Be sure to have the following information available before you call HP: • Technical support registration number (if applicable) • Product serial number • Product model name and number • Product identification number • Applicable error messages •...
  • Page 68: Acronyms And Abbreviations

    Acronyms and abbreviations ASHRAE American Society of Heating, Refrigerating and Air-Conditioning Engineers CPRA ceiling plenum return air ducted return air electromagnetic interference electrical metallic tubing electrostatic discharge LAHJ local authority has jurisdiction power distribution unit radio frequency interference root-mean-square signal reference grid TMRA recommended ambient operating temperature Acronyms and abbreviations 68...
  • Page 69 uninterruptible power system Acronyms and abbreviations 69...
  • Page 70: Glossary

    Glossary apparent power A value of power for AC circuits that is calculated as the product of RMS current times RMS voltage, without taking the power factor into account. ASHRAE Standard 52-76 Industry standard for air filtration efficiency set forth by the American Society of Heating, Refrigerating, and Air-Conditioning Engineers, Inc.
  • Page 71 The abbreviation for kilovolt-amperes. (1000 x 1 volt-amperes). live load The load that the floor system can safely support. Expressed in kg/m (lb/ft maximum input current The operating current of the product equal to the maximum load divided by the minimum input voltage. Root-mean-square (RMS) refers to the most common mathematical method of defining the effective voltage current of an AC wave.
  • Page 72: Index

    Index Dynamic Power Cap 39 AC power configurations 39 acoustic noise specification 17 earth leakage current 35 air conditioning ducts 11 electrical conduits 35 air conditioning equipment requirements, basic 9 electrical factors 29 air conditioning system guidelines 9 electrical load requirements 31 air conditioning system specifications 10 electrical requirements 29, 31 air conditioning system types 9...
  • Page 73 requirements, space 58 line voltage 34 safety considerations 58 safety, computer room 13 main building electrcial ground 36 single-phase AC configuration 39 maintenance precautions 13 site planning assistance from HP 7 metallic particular contamination 16 site planning considerations 8, 62 space requirements 19 space requirements, delivery 20 space requirements, operational 20...