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HP Xw460c - ProLiant - Blade Workstation Overview

Hp bladesystem c7000 enclosure technologies,4th edition.
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Technologies in the HP BladeSystem c7000
Enclosure
technology brief, 4th edition
Abstract .............................................................................................................................................. 3
Overview of HP BladeSystem c7000 Enclosure ....................................................................................... 3
Enclosure management ......................................................................................................................... 5
BladeSystem Onboard Administrator .................................................................................................. 5
Insight Display ............................................................................................................................... 10
HP Insight Control suite ................................................................................................................... 11
Interconnect options and infrastructure.................................................................................................. 12
Interconnect modules ...................................................................................................................... 13
Server blades ................................................................................................................................ 14
Storage options inside the BladeSystem enclosure .............................................................................. 14
Mezzanine cards ........................................................................................................................... 16
Virtual Connect .............................................................................................................................. 16
Fabric connectivity and port mapping ............................................................................................... 17
c7000 bay-to-bay crosslinks ............................................................................................................ 19
HP Thermal Logic technologies ............................................................................................................ 20
Active Cool 200 fans ..................................................................................................................... 20
HP PARSEC architecture .................................................................................................................. 21
Thermal Logic for the server blade .................................................................................................... 24
Power supplies and enclosure power subsystem ................................................................................. 25
Detecting component insertion and removal ..................................................................................... 6
Identifying components ................................................................................................................. 6
Managing power and cooling ....................................................................................................... 6
Controlling components ................................................................................................................. 7
Redundant enclosure management ................................................................................................. 8
User interfaces for the BladeSystem Onboard Administrator .............................................................. 8
Security ....................................................................................................................................... 8
Role-based user accounts............................................................................................................... 9
Enclosure linking .......................................................................................................................... 9
Direct attach storage blades ........................................................................................................ 14
Shared storage .......................................................................................................................... 15
NAS/SAN Gateway .................................................................................................................. 15
Storage server ............................................................................................................................ 15
Device bay crosslinks .................................................................................................................. 19
Interconnect bay crosslinks .......................................................................................................... 19
Parallel ...................................................................................................................................... 21
Redundant ................................................................................................................................. 23
Scalable .................................................................................................................................... 24
Pooled power ............................................................................................................................ 27

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   Summary of Contents for HP Xw460c - ProLiant - Blade Workstation

  • Page 1: Table Of Contents

    Technologies in the HP BladeSystem c7000 Enclosure technology brief, 4th edition Abstract .............................. 3 Overview of HP BladeSystem c7000 Enclosure ..................3 Enclosure management ......................... 5 BladeSystem Onboard Administrator ....................5 Detecting component insertion and removal ..................6 Identifying components ......................... 6 Managing power and cooling .......................
  • Page 2 Dynamic Power Saver mode ......................29 Power Regulator ......................... 30 Basic Power Capping for each server blade .................. 30 HP Dynamic Power Capping ....................... 30 HP BladeSystem Power Sizer ....................... 31 Conclusion ............................31 Appendix: Fan and server population guidelines ................... 32 Fan bay numbering ........................
  • Page 3: Abstract

    Abstract The HP BladeSystem c7000 Enclosure is an evolution of the entire rack-mounted infrastructure. It consolidates and repackages all the supporting infrastructure elements―compute, storage, network, and power―into a single ―infrastructure-in-a-box‖ that accelerates the integration and optimization of the data center. This technology brief provides an overview of the HP BladeSystem c7000 Enclosure, including Thermal Logic power and cooling technologies and interconnect options.
  • Page 4 Figure 1. HP BladeSystem c7000 Enclosure – front view Figure 2. HP BladeSystem c7000 Enclosure – rear view The c7000 enclosure is10U high and includes a shared, 5-terabit-per-second, high-speed NonStop midplane for wire-once connection of server blades to network and shared storage. A pooled-power backplane delivers power and ensures that the full capacity of the power supplies is available to all server blades and interconnects.
  • Page 5: Enclosure Management

    Figure 3. HP BladeSystem c7000 Enclosure – side view Enclosure management The HP BladeSystem c7000 Enclosure has extensive embedded management capabilities based on three management elements: BladeSystem Onboard Administrator or BladeSystem Onboard Administrator with KVM ProLiant Onboard Administrator powered by Integrated Lights-Out 2 (iLO 2) management processors that are integrated on the server blades Interconnect module management processors such as the HP Virtual Connect Manager These integrated management elements provide powerful hardware management for remote...
  • Page 6: Detecting Component Insertion And Removal

    The BladeSystem Onboard Administrator with KVM module adds the ability to directly connect the BladeSystem c7000 enclosure to a keyboard, mouse, monitor, or KVM switch through a VGA port. It provides approximately a 1.7x performance increase over the basic BladeSystem Onboard Administrator module and contains a PowerPC 440EPx 400 MHz processor, 1 Gb Ethernet support, and 512 MB DDR2 memory.
  • Page 7: Controlling Components

    Controlling components The BladeSystem Onboard Administrator uses embedded management interfaces to provide detailed information and health status for all bays in the enclosure (Figure 4). The BladeSystem Onboard Administrator also reports firmware versions for most components in the enclosure and can be used to update those components.
  • Page 8: Redundant Enclosure Management

    are connected to the management network, providing redundant management network connections to each enclosure. A serial port on each BladeSystem Onboard Administrator module provides full out-of-band CLI access to the BladeSystem Onboard Administrator and is used for BladeSystem Onboard Administrator firmware flash recovery. USB ports on the BladeSystem Onboard Administrator are used to connect DVD drives to support the DVD feature in the c7000 enclosure.
  • Page 9: Role-based User Accounts

    Role-based user accounts The BladeSystem Onboard Administrator provides configurable user accounts that can provide complete isolation of multiple administrative roles such as server, LAN, and SAN. User accounts are configured with specific device bay or interconnect bay permissions and one of three privilege levels: administrator, operator, or user.
  • Page 10: Proliant Onboard Administrator (integrated Lights-out 2) For Proliant Server Blades

    ProLiant Onboard Administrator (Integrated Lights-Out 2) for ProLiant server blades HP BladeSystem c-Class employs ProLiant Onboard Administrator (iLO 2) to configure, update, and operate individual server blades remotely. The c7000 enclosure includes an Ethernet management network to aggregate all ProLiant Onboard Administrator (iLO 2) management communications across the entire enclosure.
  • Page 11: Hp Insight Control Suite

    the Device Error screen, suggestions for corrective action appear (in this case an animation indicating the proper positions when replacing power supplies in the c7000 enclosure). Figure 6. BladeSystem c-Class Insight Display diagnostic screens indicating an error and suggested corrective action More information about the Insight Display is available in the technology brief titled ―Managing the HP BladeSystem c-Class‖:...
  • Page 12: Interconnect Options And Infrastructure

    Interconnect options and infrastructure A key component of the c7000 enclosure is the I/O infrastructure—essentially, a NonStop signal midplane that provides the internal wiring between the server or storage blades and the interconnect modules. The NonStop signal midplane is an entirely passive board that takes advantage of serializer/deserializer (SerDes) technology to support multiple protocols and provide point-to-point connectivity between device bays and interconnect bays.
  • Page 13: Interconnect Modules

    Figure 8 illustrates how the physical lanes can be logically overlaid onto sets of four traces. Interfaces such as Gigabit Ethernet (1000-base-KX) or Fibre Channel need only a 1x lane, or a single set of four traces. Higher bandwidth interfaces, such as InfiniBand DDR, use up to four lanes. Figure 8.
  • Page 14: Server Blades

    Each interconnect module also provides external connectors that vary based on its particular design. In the c7000 enclosure, pairs of single-wide interconnect modules installed in adjacent horizontal bays provide redundant connectivity for dual-port interfaces in each device bay. Adjacent interconnect modules also have high-speed cross-connect capability through the enclosure’s NonStop signal midplane.
  • Page 15: Shared Storage

    performance storage access without any additional cables. The SB40c Storage Blade features an onboard Smart Array P400 controller with 256 MB battery-backed write cache, for increased performance and data protection. For mechanical compatibility, storage blades use the same half- height form factor as server blades. The SB40c direct attach storage blade must be paired with an adjacent server blade in the same cooling zone.
  • Page 16: Mezzanine Cards

    storage and file serving inside the BladeSystem enclosure. The X1800sb can also be used as a low cost gateway to external FC, SAS, or iSCSI storage. For the most up-to-date information about HP StorageWorks storage blade solutions, go to the HP website: www.hp.com/go/storageblades Mezzanine cards...
  • Page 17: Fabric Connectivity And Port Mapping

    Connect Ethernet module, because the Virtual Connect Manager software runs on a processor that resides on the Ethernet module. When the LAN and SAN connections are made to the pool of servers, the server administrator uses Virtual Connect Manager to define a server connection profile for each server. Instead of using the default media access control (MAC) addresses for all network interface controllers (NICs) and default World Wide Names (WWNs) for all host bus adapters (HBAs), the Virtual Connect Manager creates bay-specific profiles, assigns unique MAC addresses and WWNs to these profiles, and administers...
  • Page 18 Connecting the ports of embedded devices to the interconnect bays in the c7000 enclosure is relatively simple. For port mapping purposes, it does not matter in which bay a server blade is installed. The mezzanine connectors always connect to the same interconnect bays. Figure 9 shows BladeSystem c7000 port mapping of half-height server blades to interconnect bays.
  • Page 19: C7000 Bay-to-bay Crosslinks

    in the HP BladeSystem Onboard Administrator User Guide available at this website: http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00705292/c00705292.pdf c7000 bay-to-bay crosslinks Four-trace SerDes signals between adjacent bays in the c7000 midplane permit horizontal bay-to-bay communications. Device bay crosslinks Device bay crosslinks are wired between adjacent device bay pairs as indicated by the arrows in the c7000 enclosure front view (Figure 11).
  • Page 20: Hp Thermal Logic Technologies

    Figure 12. HP BladeSystem c7000 interconnect bay crosslinks as indicated by the arrows HP Thermal Logic technologies The HP BladeSystem c7000 Enclosure incorporates a variety of HP Thermal Logic technologies, including mechanical design, built-in power and thermal monitoring, and control capabilities. Thermal Logic technologies can provide significant power and cooling savings compared to traditional rack and tower based servers.
  • Page 21: Hp Parsec Architecture

    To overcome these issues in the c7000 enclosure, HP engineers designed a new type of fan that delivers high airflow and high pressure in a small form factor that can scale to meet future cooling needs. HP has 20 patents pending for its Active Cool fan technology and implementation. HP Active Cool 200 fans can cool 16 server blades using as little as 150 watts of power.
  • Page 22 docking collar, and the server shut-off door opens to allow airflow across that server blade. Similarly, the fan seals into the center air plenum docking collar. Each fan bay includes louvers that automatically open when a fan is installed. If a fan is not installed or is not functional, the pressure distribution around the fan changes.
  • Page 23: Redundant

    Figure 15. Airflow through the HP BladeSystem c7000 Enclosure – side view Redundant As illustrated in Figure 16, fans located in each of four cooling zones provide direct cooling for server blades in their respective zones and redundant cooling for adjacent zones. Each zone can contain four server blades.
  • Page 24: Scalable

    minimizes fan noise. HP recommends using at least eight fans. Using ten fans optimizes power and cooling. See the appendix for more detailed fan and server population guidelines. Scalable Operating c-Class server blades requires installing a minimum of four fans at the rear of the c7000 enclosure.
  • Page 25: Power Supplies And Enclosure Power Subsystem

    Figure 18. Processor heat sink using fully ducted design (left) versus traditional heat sink in a 1U rack-mount server (right) Top view Side view Instant thermal monitoring provides a real-time view of heat, power, and cooling data. The BladeSystem Onboard Administrator retrieves thermal information from all server blades, storage blades, and interconnect modules in the enclosure to ensure an optimal balance between cooling, acoustic levels, and power consumption.
  • Page 26 Figure 19 illustrates the c7000 enclosure power options. Figure 19. c7000 enclosure power options Moving the power supplies into the enclosure reduces the transmission distance for DC power distribution and employs an industry-standard 12V infrastructure for the enclosure. By using a 12V infrastructure, HP eliminated several power-related components and improved power efficiency on the server blades and in the infrastructure.
  • Page 27: Pooled Power

    load. They also lower standby power for reduced power consumption when servers are idle. The HP 2400W high efficiency power supplies operate at 200-240V high line only and require BladeSystem Onboard Administrator firmware version 2.40 or later. The high efficiency 2400W power supplies do not interoperate with existing 2250W power supplies.
  • Page 28 The c7000 enclosure has three redundancy modes: AC or DC redundant, power supply redundant, and no redundancy mode. The BladeSystem Onboard Administrator or the Insight Display can be used to select the power redundancy mode. For more information, the HP BladeSystem Onboard Administrator User Guide is available at this website: http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00705292/c00705292.pdf Since all the power supplies share in delivering pooled power to the entire enclosure, the...
  • Page 29: Dynamic Power Saver Mode

    available in the technology brief entitled ―Managing the HP BladeSystem c-Class‖: http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00814176/c00814176.pdf Dynamic Power Saver mode Most power supplies operate more efficiently when heavily loaded and less efficiently when lightly loaded. Dynamic Power Saver mode provides power load shifting for maximum efficiency and reliability.
  • Page 30: Power Regulator

    NOTE In redundant environments, at least two power supplies are always active, and the maximum load that can be reached on any power supply is 50%. Once the 50% load is reached, another two power supplies are activated to ensure that redundancy is maintained at all times.
  • Page 31: Hp Bladesystem Power Sizer

    HP BladeSystem Power Sizer The HP BladeSystem Power Sizer is a tool that assists facilities teams and IT staff in sizing their power and cooling infrastructures to meet the needs of an HP BladeSystem solution. The BladeSystem Power Sizer is based on actual component-level power measurements of a system stressed to maximum capability.
  • Page 32: Appendix: Fan And Server Population Guidelines

    Appendix: Fan and server population guidelines For correct operation, fans and server blades must be installed in the correct bays of the HP BladeSystem c7000 Enclosure. The BladeSystem Onboard Administrator ensures that fans and blades are correctly placed before allowing systems to power on. Fan bay numbering Figure A-1 indicates the location of the ten fan bays in the back of the enclosure.
  • Page 33: Enclosure Blade Zones

    Figure A-2. Numbering of half-height server bays in the HP BladeSystem c7000 Enclosure Enclosure blade zones The c7000 enclosure is divided into four zones by vertical support metalwork. These are not the same as the cooling zones referred to above. Within each zone a removable divider is used to support half-height devices.
  • Page 34 position adjacent to the full-height server blade. The storage blade requires an HP SB40c PCIe pass- thru mezzanine card in the mezzanine 3 connector. To maintain proper airflow, either a half-height server blade or a blade blank must be installed in the half-height position above the SB40c.
  • Page 35: For More Information

    Send comments about this paper to TechCom@HP.com © 2006, 2008, 2009 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services.

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