HP BL680c - ProLiant - G5 Configuration
Technologies in hp proliant g5 c-class server blades
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Technologies in HP ProLiant G5 c-Class
server blades
technology brief
Abstract.............................................................................................................................................. 2
Introduction......................................................................................................................................... 2
ProLiant c-Class server blade architecture................................................................................................ 2
Processor technologies ......................................................................................................................... 5
Intel processors ................................................................................................................................ 5
AMD Opteron™ quad-core processors ............................................................................................... 7
Thermal Logic technologies ................................................................................................................... 8
Processor socket technology .................................................................................................................. 8
Memory technologies ........................................................................................................................... 9
I/O technologies ................................................................................................................................. 9
PCI Express technology..................................................................................................................... 9
Serial Attached SCSI technology...................................................................................................... 10
SAS and SATA Small Form Factor hard drives ................................................................................... 10
Solid state drives............................................................................................................................ 11
Optional mezzanine cards .............................................................................................................. 11
Networking technologies ................................................................................................................ 11
Configuration and management technologies ....................................................................................... 14
BladeSystem Onboard Administrator ................................................................................................ 14
ProLiant Onboard Administrator (Integrated Lights-Out 2) for ProLiant server blades ............................... 15
HP Insight Control suite ................................................................................................................... 15
Power management technologies......................................................................................................... 15
Power meter .................................................................................................................................. 16
HP Power Regulator for ProLiant....................................................................................................... 16
HP Dynamic Power Capping and HP Power Capping ........................................................................ 16
Data security technology with the Trusted Platform Module ..................................................................... 17
Conclusion........................................................................................................................................ 17
For more information.......................................................................................................................... 18
Call to action .................................................................................................................................... 18
Xeon 5200, 5300 and 5400 Series processors ............................................................................... 5
Xeon 7300 and 7400 Series processors ......................................................................................... 6
TCP/IP Offload Engine................................................................................................................ 12
Receive-side Scaling (RSS) ........................................................................................................... 12
iSCSI Acceleration...................................................................................................................... 12
iSCSI boot for Linux .................................................................................................................... 12
Virtual Connect .......................................................................................................................... 13
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Table of Contents
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Summary of Contents for HP BL680c - ProLiant - G5
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Page 1: Table Of Contents
Technologies in HP ProLiant G5 c-Class server blades technology brief Abstract.............................. 2 Introduction............................2 ProLiant c-Class server blade architecture....................2 Processor technologies ......................... 5 Intel processors ..........................5 Xeon 5200, 5300 and 5400 Series processors ................5 Xeon 7300 and 7400 Series processors ..................6 AMD Opteron™... -
Page 2: Abstract
Abstract This technology brief describes the architecture and the implementation of major technologies in HP ProLiant G5 c-Class server blades based on Intel® Xeon® and AMD Opteron™ processors. These technologies include processors, memory, connections, power, management, and the latest serial input/output (I/O) technologies. - Page 3 • Power management With the exception of the BL2x220c G5 double-dense server blade, half-height server blades support up to two processors, six to sixteen DIMM slots, up to two hot-plug or non hot-plug drives, one or two integrated Ethernet adapters, and up to two mezzanine slots. Optional mezzanine cards provide a variety of different I/O fabric connectivity to the interconnect bays (Figure 1).
- Page 4 Example Figure 2. of a full-height HP BladeSystem Server Blade (an HP BL685c G5 server) The BladeSystem BL2x220c G5 double-dense server blade is two server nodes in a half-height server blade form factor. It is designed for data centers where extreme density, compute performance, and power efficiency are essential.
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Page 5: Processor Technologies
Processor technologies HP BladeSystem ProLiant G5 c-Class server blades use multi-core technologies from Intel and AMD. A multi-core processor has two or more separate execution cores on one or more physical dies so that it can perform more work within a given clock cycle. To take advantage of multi-core processing, software must be multi-threaded to distribute the work across multiple execution cores. -
Page 6: Xeon 7300 And 7400 Series Processors
Figure 4. Major components of Intel Xeon 5300 and 5400 Series processors Xeon 7300 and 7400 Series processors The Intel Xeon 7300 and 7400 Series processors use the Intel 7300 chipset, which features Dedicated High-Speed Interconnects (DHSI). DHSI is an independent, point-to-point interface between the chipset and each processor that allows full front-side-bus bandwidth to each processor (Figure 5). -
Page 7: Amd Opteron™ Quad-Core Processors
share a 16 MB L3 cache (Figure 6). Intel Xeon 7300 and 7400 Series processors are available on the ProLiant BL680 G5 server blade. Figure 6. Major components of Intel Xeon 7300 and 7400 Series processors AMD Opteron™ quad-core processors Third generation, quad-core AMD Opteron 2300 and 8300 Series processors feature HyperTransport™... -
Page 8: Thermal Logic Technologies
Thermal Logic technologies For ProLiant c-Class server blades, HP designed smaller heat sinks than rack-mount servers use. The server blade heat sinks have vapor chamber bases, thinner fins, and tighter fin pitch than previous designs to achieve the largest possible heat transfer surface in the smallest possible package (Figure 8). -
Page 9: Memory Technologies
Figure 9. Diagram showing how the processor installation tool simplifies installation Memory technologies Depending on the model, HP ProLiant c-Class G5 Server Blades support the following memory technologies: • Registered PC2 (DDR2) DIMMs • Fully buffered PC2 (DDR2) DIMMs DDR2 memory devices operate at 1.8V. DDR2 devices use high clock frequencies to increase data transfer rates and on-die termination control to improve signal quality. -
Page 10: Serial Attached Scsi Technology
x8 link has an effective bandwidth of 4 GB/s. This flexibility allows slower devices to transmit on a single lane with a relatively small number of pins while faster devices can transmit on more lanes as required. Figure 10. PCI Express bandwidth Link Max. -
Page 11: Solid State Drives
SFF drives provide higher performance than large form factor drives. The smaller SFF platters reduce seek times because the heads have a shorter distance to travel. RAID performance improves by increasing the numbers of spindles. Solid state drives HP server solid state drives (SSD) were introduced in late 2008 for use in specific BladeSystem environments. -
Page 12: Tcp/Ip Offload Engine
• iSCSI boot for Linux® makes it possible to boot the server from a storage area network (SAN) and eliminates the need for disk drives in a server. • HP Virtual Connect (VC) and Flex 10 provide up to 16 FlexNICs across 4 ports to simplify server connection setup and administration. -
Page 13: Virtual Connect
Virtual Connect Virtual Connect technology is a set of interconnect modules and embedded software for c-Class enclosures that simplifies the setup and administration of server connections. HP Virtual Connect includes the following components: • HP 1/10 Gb Virtual Connect Ethernet Module •... -
Page 14: Configuration And Management Technologies
Full details about Virtual Connect technology are available in the technology brief titled “HP Virtual Connect technology implementation for the HP BladeSystem c-Class” on the HP technology website: http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00814156/c00814156.pdf Configuration and management technologies The HP BladeSystem c-Class provides an intelligent infrastructure through extensive integrated management capabilities. -
Page 15: Proliant Onboard Administrator (Integrated Lights-Out 2) For Proliant Server Blades
ProLiant Onboard Administrator (Integrated Lights-Out 2) for ProLiant server blades HP BladeSystem c-Class Server Blades include the ProLiant Onboard Administrator powered by iLO 2 to configure, update, and operate individual server blades remotely. The c-Class enclosure includes an Ethernet management network to aggregate all ProLiant Onboard Administrator (iLO 2) management communications across the entire enclosure. -
Page 16: Power Meter
Power meter An integrated power meter in HP ProLiant c-Class server blades provides analysis of actual server power use. The BladeSystem Onboard Administrator can access the power meter through the ProLiant Onboard Administrator powered by iLO 2 or through external power management software such as HP Insight Power Manager (IPM). -
Page 17: Data Security Technology With The Trusted Platform Module
For detailed information about HP Power Capping technologies and capabilities, refer to the HP technology brief titled “HP Power Capping and HP Dynamic Power Capping for ProLiant servers”: http://h20000.www2.hp.com/bc/docs/support/SupportManual/c01549455/c01549455.pdf. Data security technology with the Trusted Platform Module The Trusted Platform Module (TPM) is a hardware-based system security feature that can securely store information such as passwords and encryption keys to authenticate the platform. -
Page 18: For More Information
Send comments about this paper to TechCom@HP.com. © 2007, 2008, 2009 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services.
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