1.10 Hardware Management Subsystem; Hardware Monitoring - Intel BOXD2700DC Specification

Technical product specification
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1.10 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
Thermal monitoring
Voltage monitoring
1.10.1

Hardware Monitoring

The hardware monitoring and fan control subsystem is based on the Winbond
W83627DHG-P device, which supports the following:
System ambient temperature monitoring
System fan speed monitoring
Power monitoring of +12 V, +5 V, +5 Vstdby, +3.3 V, and +VCCP
SMBus interface
Product Description
27

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