Electrical Considerations; Fan Header Current Capability; Add-In Board Considerations; Thermal Considerations - Intel BOXD2700DC Specification

Technical product specification
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2.5

Electrical Considerations

2.5.1

Fan Header Current Capability

Table 22 lists the current capability of the fan header.
Table 22. Fan Header Current Capability
Fan Header
System fan
2.5.2

Add-in Board Considerations

The board is designed to provide 2 A (average) of +5 V current for the Conventional
PCI slot. The total +5 V current draw for the Conventional PCI expansion slot (total
load) must not exceed 2 A.
2.6

Thermal Considerations

CAUTION
A chassis with a maximum internal ambient temperature of 38
inlet is a requirement. Whenever possible, use of a processor heat sink that provides
omni-directional airflow to maintain required airflow across the processor voltage
regulator area is recommended.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board. For a
list of chassis that have been tested with Intel Desktop Boards please refer to the
following website:
http://www3.intel.com/cd/channel/reseller/asmo-na/eng/tech_reference/53211.htm
All responsibility for determining the adequacy of any thermal or system design
remains solely with the system integrator. Intel makes no warranties or
representations that merely following the instructions presented in this document will
result in a system with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board's maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.9.
Maximum Available Current
1.5 A
Technical Reference
o
C at the processor fan
53

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