Intel BLKDG965SSCK Technical Product Specification
Intel BLKDG965SSCK Technical Product Specification

Intel BLKDG965SSCK Technical Product Specification

Product specification
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Intel® Desktop Board
DG965SS
Technical Product Specification
®
The Intel
Desktop Board DG965SS may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board DG965SS Specification Update.
August 2006
Order Number: D56010-001US

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Summary of Contents for Intel BLKDG965SSCK

  • Page 1 Order Number: D56010-001US ® The Intel Desktop Board DG965SS may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DG965SS Specification Update.
  • Page 2: Revision History

    Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.
  • Page 3: Intended Audience

    Preface This Technical Product Specification (TPS) specifies the board layout, components, ® connectors, power and environmental requirements, and the BIOS for the Intel Desktop Board DG965SS. It describes the standard product and available manufacturing options. Intended Audience The TPS is intended to provide detailed, technical information about the Desktop Board DG965SS and its components to the vendors, system integrators, and other engineers and technicians who need this level of information.
  • Page 4 Intel Desktop Board DG965SS Technical Product Specification Other Common Notation Used after a signal name to identify an active-low signal (such as USBP0#) Gigabyte (1,073,741,824 bytes) GB/sec Gigabytes per second Gbit Gigabit (1, 073,741,824 bits) Kilobyte (1024 bytes) Kbit Kilobit (1024 bits)
  • Page 5: Table Of Contents

    1.4 System Memory ................16 1.4.1 Memory Configurations ............17 1.5 Intel ® G965 Express Chipset ............. 23 1.5.1 Intel G965 Graphics Subsystem..........23 1.5.2 USB ................... 26 1.5.3 Serial ATA Interfaces ............26 1.5.4 Parallel IDE Interface ............27 1.5.5...
  • Page 6 Intel Desktop Board DG965SS Technical Product Specification 2.6 PCI Interrupt Routing Map ..............47 2.7 Connectors and Headers..............48 2.7.1 Back Panel Connectors ............49 2.7.2 Component-side Connectors and Headers ........ 50 2.8 Jumper Block .................. 59 2.9 Mechanical Considerations ..............60 2.9.1...
  • Page 7 Contents 5.1.2 European Union Declaration of Conformity Statement ....84 5.1.3 Product Ecology Statements........... 86 5.1.4 EMC Regulations ..............90 5.1.5 Product Certification Markings (Board Level)......91 5.2 Battery Disposal Information............. 92 Figures Major Board Components..............12 Block Diagram ................14 Memory Channel Configuration and DIMM Configuration......
  • Page 8 Intel Desktop Board DG965SS Technical Product Specification 14. Interrupts ..................46 15. PCI Interrupt Routing Map ..............47 16. Component-side Connectors and Headers Shown in Figure 16....51 17. High Definition Audio Link Header ............52 18. Serial ATA Connectors ..............52 19.
  • Page 9 Product Description What This Chapter Contains Overview....................10 Online Support ...................15 Processor ....................15 System Memory ..................16 ® Intel G965 Express Chipset................23 Legacy I/O Controller ..................28 Audio Subsystem..................29 LAN Subsystem ..................31 Hardware Management Subsystem ...............33 1.10 Power Management ..................35...
  • Page 10: Overview

    • Four Serial ATA interfaces • One Parallel ATA IDE interface with UDMA 33, ATA-66/100/133 support • One diskette drive interface ® LAN Support Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel 82566DC Gigabit Ethernet Controller ® • Intel BIOS (resident in the SPI Flash device) BIOS •...
  • Page 11: Product Description

    Capabilities • One PCI Express x1 bus add-in card connector • One PCI Express x16 bus add-in card connector ® • Intel Quiet System Technology implemented through ICH8 Hardware Monitor Subsystem • Voltage sense to detect out of range power supply voltages •...
  • Page 12: Board Layout

    Intel Desktop Board DG965SS Technical Product Specification 1.1.2 Board Layout Figure 1 shows the location of the major components. W V U T S OM18462 Figure 1. Major Board Components Table 2 lists the components identified in Figure 1.
  • Page 13: Board Components Shown In Figure 1

    Diskette drive connector Main Power connector Battery Front chassis fan header Chassis intrusion header Intel 82801HB I/O Controller Hub (ICH8) BIOS Setup configuration jumper block Auxiliary front panel power LED header Front panel header Serial ATA connectors [4] Front panel USB header...
  • Page 14: Block Diagram

    Intel Desktop Board DG965SS Technical Product Specification 1.1.3 Block Diagram Figure 2 is a block diagram of the major functional areas. Gigabit Ethernet PCI Express x1 Interface Controller Connector PCI Express x1 Slot 1 Back Panel/Front Panel USB Ports Parallel ATA...
  • Page 15: Online Support

    Processor The board is designed to support the following processors: • Intel Core 2 Duo processor in an LGA775 socket with a 1066 or 800 MHz system bus • Intel Pentium D processor in an LGA775 processor socket with an 800 or 533 MHz system bus •...
  • Page 16: System Memory

    Intel Desktop Board DG965SS Technical Product Specification System Memory The board has four DIMM sockets and supports the following memory features: • 1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts • Unbuffered, single-sided or double-sided DIMMs with the following restriction: Double-sided DIMMS with x16 organization are not supported.
  • Page 17: Memory Configurations

    800 MHz 1.4.1 Memory Configurations The Intel 82G965 GMCH supports the following types of memory organization: • Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal.
  • Page 18: Memory Channel Configuration And Dimm Configuration

    Intel Desktop Board DG965SS Technical Product Specification Figure 3 illustrates the memory channel and DIMM configuration. NOTE The DIMM0 sockets of both channels are blue. The DIMM1 sockets of both channels are black. Figure 3. Memory Channel Configuration and DIMM Configuration INTEGRATOR’S NOTE...
  • Page 19: Dual Channel (Interleaved) Mode Configuration With Two Dimms

    Product Description 1.4.1.1 Dual Channel (Interleaved) Mode Configurations Figure 4 shows a dual channel configuration using two DIMMs. In this example, the DIMM0 (blue) sockets of both channels are populated with identical DIMMs. Channel A, DIMM 0 1 GB Channel A, DIMM 1 Channel B, DIMM 0 1 GB Channel B, DIMM 1...
  • Page 20: Dual Channel (Interleaved) Mode Configuration With Four Dimms

    Intel Desktop Board DG965SS Technical Product Specification Figure 6 shows a dual channel configuration using four DIMMs. In this example, the combined capacity of the two DIMMs in Channel A equal the combined capacity of the two DIMMs in Channel B. Also, the DIMMs are matched between DIMM0 and DIMM1 of both channels.
  • Page 21: Single Channel (Asymmetric) Mode Configuration With One Dimm

    Product Description 1.4.1.2 Single Channel (Asymmetric) Mode Configurations NOTE Dual channel (Interleaved) mode configurations provide the highest memory throughput. Figure 7 shows a single channel configuration using one DIMM. In this example, only the DIMM0 (blue) socket of Channel A is populated. Channel B is not populated. Channel A, DIMM 0 1 GB Channel A, DIMM 1...
  • Page 22: Flex Mode Configuration With Two Dimms

    Intel Desktop Board DG965SS Technical Product Specification 1.4.1.3 Flex Mode Configuration NOTE The use of flex mode requires DIMMs to be installed in both channels. Figure 9 shows a flex mode configuration using two DIMMs. The operation is as follows: •...
  • Page 23: Intel ® G965 Express Chipset

    G965 Express Chipset ® The Intel G965 Express chipset consists of the following devices: • Intel 82G965 Graphics and Memory Controller Hub (GMCH) with Direct Media Interface (DMI) interconnect • Intel 82801HB I/O Controller Hub (ICH8) with DMI interconnect The GMCH component provides interfaces to the CPU, memory, PCI Express, and the DMI interconnect.
  • Page 24 Intel Desktop Board DG965SS Technical Product Specification • 3D Graphics Rendering enhancements ⎯ 1.3 dual texture GigaPixel/sec fill rate ⎯ 16 and 32 bit color ⎯ Maximum 3D supported resolution of 1600 x 1200 x 32 at 85 Hz ⎯ Vertex cache ⎯...
  • Page 25: Configuration Modes

    NOTE The use of DVMT requires operating system driver support. 1.5.1.3 Configuration Modes A list of supported modes for the Intel GMA X3000 graphics controller is available as a downloadable document. For information about Refer to Supported video modes for the board Section 1.2, page 15...
  • Page 26: Usb

    Intel Desktop Board DG965SS Technical Product Specification 1.5.2 The board supports up to 10 USB 2.0 ports, supports UHCI and EHCI, and uses UHCI- and EHCI-compatible drivers. The ICH8 provides the USB controller for all ports. The port arrangement is as follows: •...
  • Page 27: Parallel Ide Interface

    Product Description 1.5.4 Parallel IDE Interface The Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface. The Parallel ATA IDE interface supports the following modes: • Programmed I/O (PIO): processor controls data transfer. • 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to 16 MB/sec.
  • Page 28: Legacy I/O Controller

    Intel Desktop Board DG965SS Technical Product Specification Legacy I/O Controller The I/O controller provides the following features: • One serial port • One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port (EPP) support • Serial IRQ interface compatible with serialized IRQ support for PCI systems •...
  • Page 29: Audio Subsystem

    Back panel – Blue Back panel – Green Back panel – Pink 1.7.1 Audio Subsystem Software Audio software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining audio software and drivers Section 1.2, page 15...
  • Page 30: Audio Connectors And Headers

    Intel Desktop Board DG965SS Technical Product Specification 1.7.2 Audio Connectors and Headers The board contains audio connectors and headers on both the back panel and the component side of the board. The front panel audio header provides mic in and line out signals for the front panel.
  • Page 31: Lan Subsystem

    • PCI Conventional bus power management ⎯ Supports ACPI technology ⎯ Supports LAN wake capabilities ⎯ LAN Subsystem Software LAN software and drivers are available from Intel’s World Wide Web site. ® 1.8.1 Intel 82566DC Gigabit Ethernet Controller The Intel 82566DC Gigabit Ethernet Controller supports the following features: •...
  • Page 32: Lan Subsystem Software

    Intel Desktop Board DG965SS Technical Product Specification 1.8.2 LAN Subsystem Software LAN software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining LAN software and drivers Section 1.2, page 15 1.8.3 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 11 below).
  • Page 33: Hardware Management Subsystem

    Thermally monitored closed-loop fan control, for all three fans, that can adjust the fan speed or switch the fans on or off as needed 1.9.2 Fan Monitoring Fan monitoring can be implemented using Intel Desktop Utilities or third-party software. For information about Refer to The functions of the fan headers Section 1.10.2.2, page 38...
  • Page 34: Thermal Monitoring

    Intel Desktop Board DG965SS Technical Product Specification 1.9.4 Thermal Monitoring Figure 12 shows the locations of the thermal sensors and fan headers. OM18464 Item Description Thermal diode, located on processor die Thermal diode, located on the GMCH die Thermal diode, located on the ICH8 die...
  • Page 35: 1.10 Power Management

    Product Description 1.10 Power Management Power management is implemented at several levels, including: • Software support through Advanced Configuration and Power Interface (ACPI) • Hardware support: ⎯ Power connector ⎯ Fan headers ⎯ LAN wake capabilities ⎯ Instantly Available PC technology ⎯...
  • Page 36: Power States And Targeted System Power

    Intel Desktop Board DG965SS Technical Product Specification 1.10.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications.
  • Page 37: Hardware Support

    Product Description 1.10.1.2 Two-Watt Standby In 2001, the U.S. government issued an executive order requiring a reduction in power for appliances and personal computers. This board meets that requirement by operating at 1.5 W (or less) in S5 (Standby) mode. Two-Watt operation applies only to the S5 state when the computer is turned off, but still connected to AC power.
  • Page 38: Power Connector

    Intel Desktop Board DG965SS Technical Product Specification • LAN wake capabilities • Instantly Available PC technology • Resume on Ring • Wake from USB • Wake from PS/2 keyboard • PME# signal wake-up support • WAKE# signal wake-up support LAN wake capabilities and Instantly Available PC technology require power from the +5 V standby line.
  • Page 39: Lan Wake Capabilities

    Product Description 1.10.2.3 LAN Wake Capabilities CAUTION For LAN wake capabilities, the +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing LAN wake capabilities can damage the power supply.
  • Page 40: Location Of The Standby Power Indicator Led

    Intel Desktop Board DG965SS Technical Product Specification 1.10.2.6 Wake from USB USB bus activity wakes the computer from ACPI S3 state. NOTE Wake from USB requires the use of a USB peripheral that supports Wake from USB. 1.10.2.7 Wake from PS/2 Devices PS/2 device activity wakes the computer from an ACPI S3 state.
  • Page 41: Technical Reference

    Technical Reference What This Chapter Contains Memory Map ....................41 DMA Channels....................43 Fixed I/O Map ....................44 PCI Configuration Space Map ...............45 Interrupts....................46 PCI Interrupt Routing Map ................47 Connectors and Headers................48 Jumper Block .....................59 Mechanical Considerations ................60 2.10 Electrical Considerations ................62 2.11 Thermal Considerations ................64 2.12 Reliability ....................66 2.13 Environmental....................67 Memory Map...
  • Page 42: Detailed System Memory Address Map

    Intel Desktop Board DG965SS Technical Product Specification The amount of installed memory that can be used will vary based on add-in cards and BIOS settings. Figure 14 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses.
  • Page 43: Dma Channels

    Technical Reference Table 10 lists the system memory map. Table 10. System Memory Map Address Range Address Range (decimal) (hex) Size Description 1024 K - 8388608 K 100000 - 1FFFFFFFF 8191 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K...
  • Page 44: Fixed I/O Map

    Intel Desktop Board DG965SS Technical Product Specification Fixed I/O Map Table 12. I/O Map Address (hex) Size Description 0000 - 00FF 256 bytes Used by the Desktop Board DG965SS. Refer to the ICH8 data sheet for dynamic addressing information. 01F0 - 01F7...
  • Page 45: Pci Configuration Space Map

    Table 13. PCI Configuration Space Map Device Function Number (hex) Number (hex) Number (hex) Description Memory controller of Intel 82G965 component (Note 1) PCI Express x16 graphics port Integrated graphics controller Intel High Definition Audio Controller PCI Express port 1...
  • Page 46: Interrupts

    Intel Desktop Board DG965SS Technical Product Specification Interrupts The interrupts can be routed through either the Programmable Interrupt Controller (PIC) or the Advanced Programmable Interrupt Controller (APIC) portion of the ICH8 component. The PIC is supported in Windows 98 SE and Windows ME and uses the first 16 interrupts.
  • Page 47: Pci Interrupt Routing Map

    Technical Reference PCI Interrupt Routing Map This section describes interrupt sharing and how the interrupt signals are connected between the PCI bus connectors and onboard PCI devices. The PCI specification specifies how interrupts can be shared between devices attached to the PCI bus. In most cases, the small amount of latency added by interrupt sharing does not affect the operation or throughput of the devices.
  • Page 48: Connectors And Headers

    Intel Desktop Board DG965SS Technical Product Specification Connectors and Headers CAUTION Only the following connectors have overcurrent protection: Back panel and front panel USB, PS/2, and VGA. The other internal connectors/headers are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals.
  • Page 49: Back Panel Connectors

    Technical Reference 2.7.1 Back Panel Connectors Figure 15 shows the locations of the back panel connectors. OM18439 Item Description PS/2 mouse port PS/2 keyboard port Parallel port VGA port IEEE-1394a USB ports [4] USB ports [2] Audio line in Mic in Audio line out Figure 15.
  • Page 50: Component-Side Connectors And Headers

    Intel Desktop Board DG965SS Technical Product Specification 2.7.2 Component-side Connectors and Headers Figure 16 shows the locations of the component-side connectors and headers. OM18465 Figure 16. Component-side Connectors and Headers...
  • Page 51: Component-Side Connectors And Headers Shown In Figure 16

    Technical Reference Table 16 lists the component-side connectors and headers identified in Figure 16. Table 16. Component-side Connectors and Headers Shown in Figure 16 Item/callout from Figure 16 Description IEEE-1394a front panel header Front panel audio header PCI Conventional bus add-in card connector 1 PCI Express x1 connector PCI Express x16 connector Processor core power connector...
  • Page 52: High Definition Audio Link Header

    Intel Desktop Board DG965SS Technical Product Specification Table 17. High Definition Audio Link Header Signal Name Signal Name BCLK Ground 3.3 V/1.5 V I/O SYNC Ground 3.3V_CORE +12 V No connect Key (no pin) No connect 3.3 V/1.5V STBY No connect Ground Table 18.
  • Page 53: Front And Rear Chassis Fan Headers

    Technical Reference Table 21. Front and Rear Chassis Fan Headers Signal Name Control +12 V Tach Table 22. Processor Fan Header Signal Name Ground +12 V FAN_TACH FAN_CONTROL Table 23. Front Panel Audio Header Signal Name Signal Name [Port 1] Left channel Ground [Port 1] Right channel PRESENCE# (Dongle present)
  • Page 54: Add-In Card Connectors

    Intel Desktop Board DG965SS Technical Product Specification 2.7.2.1 Add-in Card Connectors The board has the following add-in card connectors: • PCI Express x16: one connector supporting simultaneous transfer speeds up to 4 GBytes/sec of peak bandwidth per direction and up to 8 GBytes/sec concurrent bandwidth •...
  • Page 55: Processor Core Power Connector

    Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When...
  • Page 56: Connection Diagram For Front Panel Header

    Intel Desktop Board DG965SS Technical Product Specification 2.7.2.3 Front Panel Header This section describes the functions of the front panel header. Table 26 lists the signal names of the front panel header. Figure 17 is a connection diagram for the front panel header.
  • Page 57: States For A One-Color Power Led

    Technical Reference 2.7.2.3.2 Reset Switch Header Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST. 2.7.2.3.3 Power/Sleep LED Header Pins 2 and 4 can be connected to a one- or two-color LED.
  • Page 58: Connection Diagram For Front Panel Usb Headers

    Intel Desktop Board DG965SS Technical Product Specification 2.7.2.5 Front Panel USB Headers Figure 18 is a connection diagram for the front panel USB headers. INTEGRATOR’S NOTES • The +5 V DC power on the front panel USB headers is fused.
  • Page 59: Jumper Block

    Technical Reference Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 20 shows the location of the jumper block. The jumper determines the BIOS Setup program’s mode.
  • Page 60: Mechanical Considerations

    Intel Desktop Board DG965SS Technical Product Specification Mechanical Considerations 2.9.1 Form Factor The board is designed to fit into an ATX- or microATX-form-factor chassis. Figure 21 illustrates the mechanical form factor of the board. Dimensions are given in inches [millimeters]. The outer dimensions are 9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters].
  • Page 61: I/O Shield

    Technical Reference 2.9.2 I/O Shield The back panel I/O shield for the board must meet specific dimension and material requirements. Systems based on this board need the back panel I/O shield to pass certification testing. Figure 22 shows the I/O shield. Dimensions are given in inches [millimeters].
  • Page 62: 2.10 Electrical Considerations

    Intel Desktop Board DG965SS Technical Product Specification 2.10 Electrical Considerations 2.10.1 DC Loading Table 31 lists the DC loading characteristics of the board. This data is based on a DC analysis of all active components within the board that impact its power delivery subsystems.
  • Page 63: Add-In Board Considerations

    Technical Reference 2.10.3 Add-in Board Considerations The board is designed to provide 2 A (average) of +5 V current for each add-in board. The total +5 V current draw for add-in boards for a fully loaded board (all three expansion slots and the PCI Express x16 connector filled) must not exceed 8 A. 2.10.4 Power Supply Considerations CAUTION...
  • Page 64: 2.11 Thermal Considerations

    Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://developer.intel.com/design/motherbd/cooling.htm...
  • Page 65: Localized High Temperature Zones

    Technical Reference Figure 23 shows the locations of the localized high temperature zones. OM18468 Item Description Processor voltage regulator area Processor Intel 82G965 GMCH Intel 82801HB ICH8 Figure 23. Localized High Temperature Zones...
  • Page 66: 2.12 Reliability

    Intel Desktop Board DG965SS Technical Product Specification Table 33 provides maximum case temperatures for the board components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board.
  • Page 67: 2.13 Environmental

    Technical Reference 2.13 Environmental Table 34 lists the environmental specifications for the board. Table 34. Desktop Board DG965SS Environmental Specifications Parameter Specification Temperature Non-Operating -40 ° C to +70 ° C Operating 0 ° C to +55 ° C Shock Unpackaged 50 g trapezoidal waveform Velocity change of 170 inches/second²...
  • Page 68 Intel Desktop Board DG965SS Technical Product Specification...
  • Page 69: Overview Of Bios Features

    3.10 BIOS Security Features ................76 Introduction The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, and Plug and Play support.
  • Page 70: Bios Flash Memory Organization

    Intel Desktop Board DG965SS Technical Product Specification Table 35 lists the BIOS Setup program menu features. Table 35. BIOS Setup Program Menu Bar Maintenance Main Advanced Security Power Boot Exit Configures Selects Saves or Clears Displays Configures Sets passwords and...
  • Page 71: Pci Ide Support

    Overview of BIOS Features 3.3.2 PCI IDE Support If you select Auto in the BIOS Setup program, the BIOS automatically sets up the PCI IDE connector with independent I/O channel support. The IDE interface supports hard drives up to ATA-66/100/133 and recognizes any ATAPI compliant devices, including CD-ROM drives, tape drives, and Ultra DMA drives.
  • Page 72: Legacy Usb Support

    Intel Desktop Board DG965SS Technical Product Specification Legacy USB Support Legacy USB support enables USB devices to be used even when the operating system’s USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating system that supports USB. By default, Legacy USB support is set to Enabled.
  • Page 73: Language Support

    The Integrator’s Toolkit that is available from Intel can be used to create a custom splash screen. NOTE If you add a custom splash screen, it will share space with the Intel branded logo. Refer to For information about The Intel World Wide Web site Section 1.2, page 15...
  • Page 74: Boot Options

    Intel Desktop Board DG965SS Technical Product Specification Boot Options In the BIOS Setup program, the user can choose to boot from a diskette drive, hard drives, CD-ROM, or the network. The default setting is for the diskette drive to be the first boot device, the hard drive second, and the ATAPI CD-ROM third.
  • Page 75: Adjusting Boot Speed

    It is possible to optimize the boot process to the point where the system boots so quickly that the Intel logo screen (or a custom logo splash screen) will not be seen. Monitors and hard disk drives with minimum initialization times can also contribute to a boot time that might be so fast that necessary logo screens and POST messages cannot be seen.
  • Page 76: 3.10 Bios Security Features

    Intel Desktop Board DG965SS Technical Product Specification 3.10 BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: •...
  • Page 77: Error Messages And Beep Codes

    Error Messages and Beep Codes What This Chapter Contains Speaker ....................77 BIOS Beep Codes ..................77 BIOS Error Messages ..................77 Port 80h POST Codes ..................78 Speaker The board-mounted speaker provides audible error code (beep code) information during POST. For information about Refer to The location of the onboard speaker Figure 1, page 12...
  • Page 78: 4.4 Port 80H Post Codes

    Intel Desktop Board DG965SS Technical Product Specification 4.4 Port 80h POST Codes During the POST, the BIOS generates diagnostic progress codes (POST-codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h.
  • Page 79: Port 80H Post Codes

    Error Messages and Beep Codes Table 43. Port 80h POST Codes POST Code Description of POST Operation Host Processor Power-on initialization of the host processor (Boot Strap Processor) Host processor Cache initialization (including APs) Starting Application processor initialization SMM initialization Chipset Initializing a chipset component Memory...
  • Page 80 Intel Desktop Board DG965SS Technical Product Specification Table 43. Port 80h POST Codes (continued) POST Code Description of POST Operation Keyboard (PS2 or USB) Resetting keyboard Disabling keyboard Detecting presence of keyboard Enabling the keyboard Clearing keyboard input buffer Instructing keyboard controller to run Self Test (PS2 only)
  • Page 81 Error Messages and Beep Codes Table 43. Port 80h POST Codes (continued) POST Code Description of POST Operation DXE Drivers Waiting for user input Checking password Entering BIOS setup Calling Legacy Option ROMs Runtime Phase/EFI OS Boot Entering Sleep state Exiting Sleep state EFI boot service ExitBootServices ( ) has been called EFI runtime service SetVirtualAddressMap ( ) has been called...
  • Page 82: Typical Port 80H Post Sequence

    Intel Desktop Board DG965SS Technical Product Specification Table 44. Typical Port 80h POST Sequence POST Code Description Initializing a chipset component Reading SPD from memory DIMMs Detecting presence of memory DIMMs Configuring memory Testing memory Loading recovery capsule Entered DXE phase...
  • Page 83: Regulatory Compliance And Battery Disposal Information

    Regulatory Compliance and Battery Disposal Information What This Chapter Contains Regulatory Compliance................83 Battery Disposal Information ................92 Regulatory Compliance This section contains the following regulatory compliance information for Desktop Board DG965SS: • Safety regulations • European Union Declaration of Conformity statement •...
  • Page 84: European Union Declaration Of Conformity Statement

    European Union Declaration of Conformity Statement We, Intel Corporation, declare under our sole responsibility that the product Intel ® Desktop Board DG965SS is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 89/336/EEC (EMC Directive) and Council Directive 73/23/EEC (Safety/Low Voltage Directive).
  • Page 85 Regulatory Compliance and Battery Disposal Information Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej 89/336/EEC u 73/23/EEC. Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet 89/336/ EEC & 73/23/EEC. Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej 89/336/EWG i 73/23/EWG.
  • Page 86: Product Ecology Statements

    请参考 了解此计划的详情,包括涉及产品之范围、回收地点、运送指导、条款和条件等。 Deutsch Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für ordnungsgemäßes Recycling zurückzugeben. Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte, verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der...
  • Page 87 Regulatory Compliance and Battery Disposal Information Français Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis en œuvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits usés en les retournant à...
  • Page 88 Intel Desktop Board DG965SS Technical Product Specification Russian В качестве части своих обязательств к окружающей среде, в Intel создана программа утилизации продукции Intel (Product Recycling Program) для предоставления конечным пользователям марок продукции Intel возможности возврата используемой продукции в специализированные пункты для должной...
  • Page 89: Lead-Free Board Markings

    Regulatory Compliance and Battery Disposal Information 5.1.3.3 Lead Free Desktop Board This desktop board is lead free although certain discrete components used on the board contain a small amount of lead which is necessary for component performance and/or reliability. This desktop board is referred to as “Lead-free second level interconnect.”...
  • Page 90: Emc Regulations

    Intel Desktop Board DG965SS Technical Product Specification 5.1.4 EMC Regulations Desktop Board DG965SS complies with the EMC regulations stated in Table 47 when correctly installed in a compatible host system. Table 47. EMC Regulations Regulation Title FCC Class B Title 47 of the Code of Federal Regulations, Parts 2 and 15, Subpart B, Radio Frequency Devices.
  • Page 91: Product Certification Markings (Board Level)

    Description Mark UL joint US/Canada Recognized Component mark. Includes adjacent UL file number for Intel desktop boards: E210882. FCC Declaration of Conformity logo mark for Class B equipment. Includes Intel name and DG965SS model designation. CE mark. Declaring compliance to European Union (EU) EMC directive (89/336/EEC) and Low Voltage directive (73/23/EEC).
  • Page 92: Battery Disposal Information

    Intel Desktop Board DG965SS Technical Product Specification Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations.
  • Page 93 Regulatory Compliance and Battery Disposal Information PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.
  • Page 94 Intel Desktop Board DG965SS Technical Product Specification AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii.
  • Page 95 Regulatory Compliance and Battery Disposal Information...
  • Page 96 Intel Desktop Board DG965SS Technical Product Specification...

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