Contents
Product EMC Compliance .............................................................................................. 5
ICES-003 (Canada)........................................................................................................ 8
VCCI (Japan).................................................................................................................. 8
BSMI (Taiwan)................................................................................................................ 8
RRL (Korea) ................................................................................................................... 9
Conventions....................................................................................................... 10
1 System Description...................................................................................... 23
External Chassis Features .................................................................................................... 25
Chassis Front ............................................................................................................... 25
Front Panel .................................................................................................... 26
Peripheral Bay ............................................................................................... 27
Chassis Rear................................................................................................................ 32
Internal Chassis Features ..................................................................................................... 33
Electronics Bay............................................................................................................. 33
Cooling Subsystem ...................................................................................................... 34
Power Subsystem ........................................................................................................ 38
Power Supply Modules.................................................................................. 38
Processor Power Pods .................................................................................. 38
Main Board............................................................................................................................ 41
Processor Sockets ....................................................................................................... 42
Memory Subsystem...................................................................................................... 42
SCSI Controller ............................................................................................................ 43
Video Controller............................................................................................................ 44
IDE Controller............................................................................................................... 44
PCI Riser Board .................................................................................................................... 46
SCSI Backplane Board ......................................................................................................... 46
11