Cypress Semiconductor MoBL CY62146ESL Specification Sheet

4-mbit (256k x 16) static ram

Advertisement

Quick Links

Features
Very high speed: 45 ns
Wide voltage range: 2.2V–3.6V and 4.5V–5.5V
Ultra low standby power
Typical Standby current: 1 μA
Maximum Standby current: 7 μA
Ultra low active power
Typical active current: 2 mA at f = 1 MHz
Easy memory expansion with CE and OE features
Automatic power down when deselected
CMOS for optimum speed and power
Available in Pb-free 44-pin TSOP II package

Functional Description

The CY62146ESL is a high performance CMOS static RAM
organized as 256K words by 16 bits. This device features
advanced circuit design to provide ultra low active current. This
is ideal for providing More Battery Life™ (MoBL
applications such as cellular telephones. The device also has an
automatic power down feature that reduces power consumption
when addresses are not toggling. Placing the device into standby
Logic Block Diagram
Cypress Semiconductor Corporation
Document #: 001-43142 Rev. **
®
) in portable
DATA IN DRIVERS
A
10
A
9
A
8
A
7
A
256K x 16
6
A
5
A
RAM Array
4
A
3
A
2
A
1
A
0
COLUMN DECODER
198 Champion Court
CY62146ESL MoBL
4-Mbit (256K x 16) Static RAM
mode reduces power consumption by more than 99% when
deselected (CE HIGH). The input and output pins (IO
IO
) are placed in a high impedance state when:
15
Deselected (CE HIGH)
Outputs are disabled (OE HIGH)
Both Byte High Enable and Byte Low Enable are disabled
(BHE, BLE HIGH)
Write operation is active (CE LOW and WE LOW)
To write to the device, take Chip Enable (CE) and Write Enable
(WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data
from IO pins (IO
through IO
0
specified on the address pins (A
Enable (BHE) is LOW, then data from IO pins (IO
is written into the location specified on the address pins (A
through A
).
17
To read from the device, take Chip Enable (CE) and Output
Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If
Byte Low Enable (BLE) is LOW, then data from the memory
location specified by the address pins appears on IO
Byte High Enable (BHE) is LOW, then data from memory
appears on IO
to IO
. See the
8
15
complete description of read and write modes.
For best practice recommendations, refer to the Cypress
application note
AN1064, SRAM System
IO
–IO
0
IO
–IO
8
,
San Jose
CA 95134-1709
through
0
) is written into the location
7
through A
). If Byte High
0
17
through IO
8
to IO
0
"Truth Table" on page 10
for a
Guidelines.
7
15
BHE
WE
CE
OE
BLE
408-943-2600
Revised January 04, 2008
®
)
15
0
. If
7
[+] Feedback
[+] Feedback

Advertisement

Table of Contents
loading
Need help?

Need help?

Do you have a question about the MoBL CY62146ESL and is the answer not in the manual?

Questions and answers

Summary of Contents for Cypress Semiconductor MoBL CY62146ESL

  • Page 1: Functional Description

    Features ■ Very high speed: 45 ns ■ Wide voltage range: 2.2V–3.6V and 4.5V–5.5V ■ Ultra low standby power Typical Standby current: 1 μA ❐ Maximum Standby current: 7 μA ❐ ■ Ultra low active power ❐ Typical active current: 2 mA at f = 1 MHz ■...
  • Page 2: Pin Configuration

    Pin Configuration Product Portfolio Product Range CY62146ESL Industrial 2.2V–3.6V and 4.5V–5.5V Notes 1. NC pins are not connected on the die. 2. Datasheet specifications are not guaranteed for V 3. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at V Document #: 001-43142 Rev.
  • Page 3: Maximum Ratings

    Maximum Ratings Exceeding the maximum ratings may impair the useful life of the device. These user guidelines are not tested. Storage Temperature ... –65°C to +150°C Ambient Temperature with Power Applied ... –55°C to +125°C Supply Voltage to Ground Potential...–0.5V to 6.0V DC Voltage Applied to Outputs [4, 5] in High-Z State...
  • Page 4: Thermal Resistance

    Capacitance Tested initially and after any design or process changes that may affect these parameters. Parameter Description Input Capacitance Output Capacitance Thermal Resistance Tested initially and after any design or process changes that may affect these parameters. Parameter Description Θ Thermal Resistance (Junction to Ambient) Θ...
  • Page 5 Data Retention Characteristics Over the Operating Range Parameter Description for Data Retention Data Retention Current CCDR Chip Deselect to Data Retention Time Operation Recovery Time Data Retention Waveform Notes 7. Tested initially and after any design or process changes that may affect these parameters. 8.
  • Page 6: Switching Characteristics

    Switching Characteristics Over the Operating Range Parameter Read Cycle Read Cycle Time Address to Data Valid Data Hold from Address Change CE LOW to Data Valid OE LOW to Data Valid [10] OE LOW to LOW-Z LZOE [10, 11] OE HIGH to High-Z HZOE [10] CE LOW to Low-Z...
  • Page 7: Switching Waveforms

    Switching Waveforms Figure 2. Read Cycle No.1: Address Transition Controlled. ADDRESS DATA OUT PREVIOUS DATA VALID Figure 3. Read Cycle No. 2: OE Controlled ADDRESS LZOE BHE/BLE LZBE HIGH IMPEDANCE DATA OUT LZCE SUPPLY CURRENT Notes 13. The device is continuously selected. OE, CE = V 14.
  • Page 8 Switching Waveforms (continued) Figure 4. Write Cycle No 1: WE Controlled ADDRESS BHE/BLE NOTE 18 DATA IO HZOE Figure 5. Write Cycle 2: CE Controlled ADDRESS BHE/BLE DATA IO NOTE 18 HZOE Notes 16. Data IO is high impedance if OE = V 17.
  • Page 9 Switching Waveforms (continued) Figure 6. Write Cycle 3: WE controlled, OE LOW ADDRESS BHE/BLE DATA IO NOTE 18 Figure 7. Write Cycle 4: BHE/BLE Controlled, OE LOW ADDRESS BHE/BLE NOTE 18 DATA IO Document #: 001-43142 Rev. ** DATA HZWE HZWE DATA ®...
  • Page 10: Truth Table

    Truth Table Ordering Information Speed Ordering Code (ns) CY62146ESL-45ZSXI Document #: 001-43142 Rev. ** Inputs/Outputs High-Z Deselect/Power down High-Z Output Disabled Data Out (IO –IO Read Data Out (IO –IO Read –IO in High-Z Data Out (IO –IO Read –IO in High-Z High-Z Output Disabled...
  • Page 11: Package Diagrams

    Package Diagrams Document #: 001-43142 Rev. ** Figure 8. 44-Pin TSOP II, 51-85087 ® CY62146ESL MoBL 51-85087-*A Page 11 of 12 [+] Feedback [+] Feedback...
  • Page 12 Document History Page ® Document Title: CY62146ESL MoBL Document Number: 001-43142 REV. ECN NO. Issue Date 1875228 See ECN VKN/AESA New Data Sheet © Cypress Semiconductor Corporation, 2008. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product.

Table of Contents

Save PDF