Cypress Semiconductor CY7C1361C Specification Sheet

9-mbit (256k x 36/512k x 18) flow-through sram

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9-Mbit (256K x 36/512K x 18) Flow-Through SRAM
Features
• Supports 100, 133-MHz bus operations
• Supports 100-MHz bus operations (Automotive)
• 256K × 36/512K × 18 common I/O
• 3.3V –5% and +10% core power supply (V
• 2.5V or 3.3V I/O power supply (V
• Fast clock-to-output times
— 6.5 ns (133-MHz version)
• Provide high-performance 2-1-1-1 access rate
• User-selectable burst counter supporting Intel
®
Pentium
interleaved or linear burst sequences
• Separate processor and controller address strobes
• Synchronous self-timed write
• Asynchronous output enable
• Available in lead-free 100-Pin TQFP package, lead-free
and non lead-free 119-Ball BGA package and 165-Ball
FBGA package
• TQFP Available with 3-Chip Enable and 2-Chip Enable
• IEEE 1149.1 JTAG-Compatible Boundary Scan
•"ZZ" Sleep Mode option
Selection Guide
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
Notes:
1. For best-practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.
2. CE
is for A version of TQFP (3 Chip Enable Option) and 165 FBGA package only. 119 BGA is offered only in 2 Chip Enable.
3
Cypress Semiconductor Corporation
Document #: 38-05541 Rev. *F
Functional Description
The CY7C1361C/CY7C1363C is a 3.3V, 256K x 36/512K x 18
Synchronous Flow-through SRAMs, respectively designed to
interface with high-speed microprocessors with minimum glue
logic. Maximum access delay from clock rise is 6.5 ns
(133-MHz version). A 2-bit on-chip counter captures the first
)
DD
address in a burst and increments the address automatically
)
DDQ
for the rest of the burst access. All synchronous inputs are
gated by registers controlled by a positive-edge-triggered
Clock Input (CLK). The synchronous inputs include all
addresses, all data inputs, address-pipelining Chip Enable
(CE
®
Control inputs (ADSC, ADSP, and ADV), Write Enables (BW
and BWE), and Global Write (GW). Asynchronous inputs
include the Output Enable (OE) and the ZZ pin.
The CY7C1361C/CY7C1363C allows either interleaved or
linear burst sequences, selected by the MODE input pin. A
HIGH selects an interleaved burst sequence, while a LOW
selects a linear burst sequence. Burst accesses can be
initiated with the Processor Address Strobe (ADSP) or the
cache Controller Address Strobe (ADSC) inputs. Address
advancement is controlled by the Address Advancement
(ADV) input.
Addresses and chip enables are registered at rising edge of
clock when either Address Strobe Processor (ADSP) or
Address Strobe Controller (ADSC) are active. Subsequent
burst addresses can be internally generated as controlled by
the Advance pin (ADV).
The CY7C1361C/CY7C1363C operates from a +3.3V core
power supply while all outputs may operate with either a +2.5
or +3.3V supply. All inputs and outputs are JEDEC-standard
JESD8-5-compatible.
133 MHz
6.5
250
Comm/Ind'l
40
Automotive
198 Champion Court
[1]
), depth-expansion Chip Enables (CE
1
100 MHz
8.5
180
40
60
,
San Jose
CA 95134-1709
Revised September 14, 2006
CY7C1361C
CY7C1363C
[2]
and CE
), Burst
2
3
,
x
Unit
ns
mA
mA
mA
408-943-2600
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  • Page 1 Cypress Semiconductor Corporation Document #: 38-05541 Rev. *F Functional Description The CY7C1361C/CY7C1363C is a 3.3V, 256K x 36/512K x 18 Synchronous Flow-through SRAMs, respectively designed to interface with high-speed microprocessors with minimum glue logic. Maximum access delay from clock rise is 6.5 ns (133-MHz version).
  • Page 2 Logic Block Diagram – CY7C1361C (256K x 36) ADDRESS A0, A1, A REGISTER MODE COUNTER AND LOGIC ADSC ADSP BYTE BYTE WRITE REGISTER WRITE REGISTER BYTE WRITE REGISTER BYTE WRITE REGISTER BYTE WRITE REGISTER ENABLE REGISTER SLEEP CONTROL Logic Block Diagram – CY7C1363C (512K x 18)
  • Page 3: Pin Configurations

    Pin Configurations 100-Pin TQFP Pinout (3 Chip Enables) (A version) /DNU CY7C1361C (256K x 36) Document #: 38-05541 Rev. *F /DNU CY7C1363C (512K x 18) CY7C1361C CY7C1363C Page 3 of 31 [+] Feedback...
  • Page 4 Pin Configurations (continued) 100-Pin TQFP Pinout (2 Chip Enables) (AJ Version) /DNU CY7C1361C (256K x 36) Document #: 38-05541 Rev. *F /DNU CY7C1363C (512K x 18) CY7C1361C CY7C1363C Page 4 of 31 [+] Feedback...
  • Page 5 Pin Configurations (continued) 119-Ball BGA Pinout (2 Chip Enables with JTAG) NC/288M NC/144M NC/288M NC/144M NC/72M Document #: 38-05541 Rev. *F CY7C1361C (256K x 36) ADSP ADSC MODE NC/72M CY7C1363C (512K x 18) ADSP ADSC MODE NC/36M CY7C1361C CY7C1363C NC/512M...
  • Page 6 165-Ball FBGA Pinout (3 Chip Enable) NC/288M NC/144M NC/72M MODE NC/36M NC/288M NC/144M NC/72M MODE NC/36M Document #: 38-05541 Rev. *F CY7C1361C (256K x 36) NC/18M CY7C1363C (512K x 18) NC/18M CY7C1361C CY7C1363C ADSC ADSP NC/576M NC/1G ADSC ADSP NC/576M...
  • Page 7: Pin Definitions

    When ADSP and ADSC are both [1:0] are also loaded into the burst counter. When ADSP and ADSC are both [1:0] and DQP is controlled by BW CY7C1361C CY7C1363C , CE , and CE are sampled and BWE).
  • Page 8 Ground/DNU This pin can be connected to Ground or should be left floating. Document #: 38-05541 Rev. *F Description . This pin is not available on TQFP packages. CY7C1361C CY7C1363C through a pull . This pin Page 8 of 31...
  • Page 9: Functional Overview

    Maximum access delay from the clock rise (t ) is 6.5 ns (133-MHz device). The CY7C1361C/CY7C1363C supports secondary cache in systems utilizing either a linear or interleaved burst sequence. The interleaved burst order supports Pentium and i486™...
  • Page 10: Truth Table

    ZZ > V – 0.2V Comm/ind’l Automotive ZZ > V – 0.2V ZZ < 0.2V This parameter is sampled This parameter is sampled ADSP ADSC CY7C1361C CY7C1363C Min. Max. Unit ADV WRITE OE CLK Tri-state Tri-state Tri-state Tri-state Tri-state Tri-state...
  • Page 11 Partial Truth Table for Read/Write Function (CY7C1361C) Read Read Write Byte (A, DQP Write Byte (B, DQP Write Bytes (B, A, DQP , DQP Write Byte (C, DQP Write Bytes (C, A, DQP , DQP Write Bytes (C, B, DQP...
  • Page 12: Tap Controller State Diagram

    IEEE 1149.1 Serial Boundary Scan (JTAG) The CY7C1361C/CY7C1363C incorporates a serial boundary scan test access port (TAP) in the BGA package only. The TQFP package does not offer this functionality. This part operates in accordance with IEEE Standard 1149.1-1900, but doesn’t have the set of functions required for full 1149.1...
  • Page 13 Once the data is captured, it is possible to shift out the data by putting the TAP into the Shift-DR state. This places the bound- ary scan register between the TDI and TDO pins. CY7C1361C CY7C1363C Unlike SAMPLE/PRELOAD...
  • Page 14 TH t CYC t TMSS t TMSH t TDIS t TDIH t TDOX DON’T CARE UNDEFINED [9, 10] Over the Operating Range Parameter = 1 ns. CY7C1361C CY7C1363C t TDOV Min. Max. Unit Page 14 of 31 [+] Feedback...
  • Page 15 = 2.5V = 100 µA = 3.3V = 2.5V = 3.3V = 2.5V = 3.3V = 2.5V GND < V < V CY7C1361C CY7C1363C (256K x36) (512K x18) Describes the version number. 01011 01011 Reserved for Internal Use 101001 101001...
  • Page 16: Identification Codes

    Do Not Use: This instruction is reserved for future use. BYPASS Places the bypass register between TDI and TDO. This operation does not affect SRAM operations. Document #: 38-05541 Rev. *F CY7C1361C CY7C1363C Bit Size (x 36) Bit Size (x 18) Description...
  • Page 17 119-Ball BGA Boundary Scan Order CY7C1361C (256K x 36) Signal Bit # ball ID Name Bit # ball ID ADSC ADSP Internal Internal Document #: 38-05541 Rev. *F CY7C1363C (512K x 18) Signal Signal Name Bit # ball ID Name...
  • Page 18 165-Ball FBGA Boundary Scan Order CY7C1361C (256K x 36) Signal Bit # ball ID Name Bit # ball ID ADSC ADSP Internal Document #: 38-05541 Rev. *F Signal Name Bit # ball ID MODE Internal Internal Internal Internal Internal Internal...
  • Page 19: Maximum Ratings

    10-ns cycle,100 MHz (Automotive) /2), undershoot: V (AC) > –2V (Pulse width less than t (min.) within 200ms. During this time V < V and V CY7C1361C CY7C1363C Ambient Temperature 0°C to +70°C 3.3V – 5%/+10% 2.5V – 5% to V Min.
  • Page 20 5 pF R = 351Ω INCLUDING JIG AND SCOPE R = 1667Ω 2.5V OUTPUT 5 pF R = 1538Ω INCLUDING JIG AND SCOPE CY7C1361C CY7C1363C 119 BGA 165 FBGA Max. Max. Max. Unit 119 BGA 165 FBGA Package Package Unit 34.1...
  • Page 21: Switching Characteristics

    Hold After CLK Rise is the time that the power needs to be supplied above V and t is less than t to eliminate bus contention between SRAMs when sharing the same OELZ = 2.5V. CY7C1361C CY7C1363C –100 Max. Min. Max. Unit...
  • Page 22: Timing Diagrams

    Q(A2 + 1) Q(A2 + 2) BURST READ DON’T CARE UNDEFINED is HIGH and CE is LOW. When CE is HIGH: CE CY7C1361C CY7C1363C Deselect Cycle t CHZ Q(A2 + 3) Q(A2) Q(A2 + 1) Q(A2 + 2) Burst wraps around...
  • Page 23 ADV suspends burst D(A2) D(A2 + 1) D(A2 + 1) D(A2 + 2) D(A2 + 3) BURST WRITE DON’T CARE UNDEFINED LOW. CY7C1361C CY7C1363C t ADS t ADH t WES t WEH t ADVS t ADVH D(A3) D(A3 + 1)
  • Page 24 25. GW is HIGH. Document #: 38-05541 Rev. *F t DS t DH t OELZ D(A3) t CDV Q(A4) Q(A4+1) Single WRITE BURST READ DON’T CARE UNDEFINED CY7C1361C CY7C1363C D(A5) D(A6) Q(A4+2) Q(A4+3) Back-to-Back WRITEs Page 24 of 31 [+] Feedback...
  • Page 25 26. Device must be deselected when entering ZZ mode. See Cycle Descriptions table for all possible signal conditions to deselect the device. 27. DQs are in high-Z when exiting ZZ sleep mode. Document #: 38-05541 Rev. *F t ZZREC t RZZI DESELECT or READ Only High-Z DON’T CARE CY7C1361C CY7C1363C Page 25 of 31 [+] Feedback...
  • Page 26: Ordering Information

    Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit Speed Package (MHz) Ordering Code Diagram CY7C1361C-133AXC 51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free CY7C1363C-133AXC CY7C1361C-133AJXC 51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free CY7C1363C-133AJXC CY7C1361C-133BGC 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm)
  • Page 27 CY7C1363C-100BGI CY7C1361C-100BGXI 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) Lead-Free CY7C1363C-100BGXI CY7C1361C -100BZI 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) CY7C1363C-100BZI CY7C1361C-100BZXI 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free...
  • Page 28: Package Diagrams

    2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 3. DIMENSIONS IN MILLIMETERS CY7C1361C CY7C1363C 1.40±0.05 12°±1°...
  • Page 29 A1 CORNER 0.70 REF. 12.00 30° TYP. SEATING PLANE Document #: 38-05541 Rev. *F 119-Ball BGA (14 x 22 x 2.4 mm) (51-85115) Ø1.00(3X) REF. 0.15(4X) CY7C1361C CY7C1363C Ø0.05 M C Ø0.25 M C A B Ø0.75±0.15(119X) 1.27 3.81 7.62 14.00±0.20...
  • Page 30 SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD) JEDEC REFERENCE : MO-216 / DESIGN 4.6C PACKAGE WEIGHT : 0.475g PACKAGE CODE : BB0AC JEDEC REFERENCE : MO-216 / DESIGN 4.6C PACKAGE CODE : BB0AC CY7C1361C CY7C1363C BOTTOM VIEW PIN 1 CORNER BOTTOM VIEW PIN 1 CORNER Ø0.05 M C...
  • Page 31 Document History Page Document Title: CY7C1361C/CY7C1363C 9-Mbit (256K x 36/512K x 18) Flow-Through SRAM Document Number: 38-05541 REV. ECN NO. Issue Date 241690 See ECN 278969 See ECN 332059 See ECN 377095 See ECN 408298 See ECN 433033 See ECN...

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