Cypress Semiconductor CY7C1305BV25 Specification Sheet

Cypress Semiconductor CY7C1305BV25 Specification Sheet

Cypress 18-mbit burst of 4 pipelined sram with qdr architecture specification sheet

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Features
• Separate independent Read and Write data ports
• Supports concurrent transactions
• 167-MHz clock for high bandwidth
• 2.5 ns Clock-to-Valid access time
• 4-Word Burst for reducing the address bus frequency
• Double Data Rate (DDR) interfaces on both Read and
Write Ports (data transferred at 333 MHz) @167 MHz
• Two input clocks (K and K) for precise DDR timing
• SRAM uses rising edges only
• Two input clocks for output data (C and C) to minimize
clock-skew and flight-time mismatches.
• Single multiplexed address input bus latches address
inputs for both Read and Write ports
• Separate Port Selects for depth expansion
• Synchronous internally self-timed writes
• 2.5V core power supply with HSTL Inputs and Outputs
• Available in 165-ball FBGA package (13 x 15 x 1.4 mm)
• Variable drive HSTL output buffers
• Expanded HSTL output voltage (1.4V–1.9V)
• JTAG interface
Configurations
• CY7C1305BV25 – 1M x 18
• CY7C1307BV25 – 512K x 36
Cypress Semiconductor Corporation
Document #: 38-05630 Rev. *A
18-Mbit Burst of 4 Pipelined SRAM with
Functional Description
The CY7C1305BV25/CY7C1307BV25 are 2.5V Synchronous
Pipelined SRAMs equipped with QDR architecture. QDR
architecture consists of two separate ports to access the
memory array. The Read port has dedicated Data Outputs to
support Read operations and the Write Port has dedicated
Data Inputs to support Write operations. QDR architecture has
separate data inputs and data outputs to completely eliminate
the need to "turn-around" the data bus required with common
I/O devices. Access to each port is accomplished through a
common address bus. Addresses for Read and Write
addresses are latched on alternate rising edges of the input
(K) clock. Accesses to the device's Read and Write ports are
completely independent of one another. In order to maximize
data throughput, both Read and Write ports are equipped with
Double Data Rate (DDR) interfaces. Each address location is
associated with four 18-bit words (CY7C1305BV25) and four
36-bit words (CY7C1307BV25) that burst sequentially into or
out of the device. Since data can be transferred into and out
of the device on every rising edge of both input clocks (K/K and
C/C) memory bandwidth is maximized while simplifying
system design by eliminating bus "turn-arounds."
Depth expansion is accomplished with Port Selects for each
port. Port selects allow each port to operate independently.
All synchronous inputs pass through input registers controlled
by the K or K input clocks. All data outputs pass through output
registers controlled by the C or C input clocks. Writes are
conducted with on-chip synchronous self-timed write circuitry.
198 Champion Court
CY7C1305BV25
CY7C1307BV25
QDR™ Architecture
,
San Jose
CA 95134-1709
Revised April 3, 2006
408-943-2600
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Summary of Contents for Cypress Semiconductor CY7C1305BV25

  • Page 1 Read and Write ports are equipped with Double Data Rate (DDR) interfaces. Each address location is associated with four 18-bit words (CY7C1305BV25) and four 36-bit words (CY7C1307BV25) that burst sequentially into or out of the device. Since data can be transferred into and out...
  • Page 2: Selection Guide

    Logic Block Diagram (CY7C1305BV25) [17:0] Address Register [17:0] Gen. Vref Control Logic [0:1] Logic Block Diagram (CY7C1307BV25) [35:0] Address Register (16:0) Gen. Vref Control Logic [0:3] Selection Guide Maximum Operating Frequency Maximum Operating Current Document #: 38-05630 Rev. *A Write...
  • Page 3: Pin Configuration

    165-ball FBGA (13 x 15 x 1.4 mm) Pinout GND/ 144M NC/ 36M VREF VDDQ GND/ 288M NC/ 72M VREF VDDQ Document #: 38-05630 Rev. *A CY7C1305BV25 (1M x 18) VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ CY7C1307BV25 (512K x 36)
  • Page 4: Pin Definitions

    Internally, the device is organized as 1M x 18 (4 arrays each of 256K x 18) for CY7C1305BV25 and 512K x 36 (4 arrays each of 128K x 36) for CY7C1307BV25. Therefore, only 18 address inputs for CY7C1305BV25 and 17 address inputs for CY7C1307BV25.
  • Page 5 Address expansion for 36M. This is not connected to the die. Can be connected to any voltage level on CY7C1305BV25/CY7C1307BV25. Address expansion for 72M. This should be tied LOW on the CY7C1305BV25. Address expansion for 72M. This can be connected to any voltage level on CY7C1307BV25.
  • Page 6: Application Example

    Read/Modify/Write operations to a Byte Write operation. Single Clock Mode The CY7C1305BV25 can be used with a single clock that controls both the input and output registers. In this mode the device will recognize only a single pair of input clocks (K and K) that control both the input and output registers.
  • Page 7: Truth Table

    ) are written into the device. [17:0] ) is written into the [8:0] ) is written into the [8:0] ) is written into [17:9] ) is written into [17:9] in the case of CY7C1305BV25 and BWS and BWS Page 7 of 21 [+] Feedback...
  • Page 8 – No data is written into the device during this portion of a Write operation. – No data is written into the device during this portion of a write operation. CY7C1305BV25 CY7C1307BV25 Comments will remain [35:9] will remain [35:9]...
  • Page 9 It also places the instruction register between the TDI and TDO pins and allows the IDCODE to be shifted out of the device when the TAP controller enters the Shift-DR state. The IDCODE instruction CY7C1305BV25 CY7C1307BV25 Page 9 of 21 [+] Feedback...
  • Page 10 The shifting of data for the SAMPLE and PRELOAD phases can occur concurrently when required—that is, while data captured is shifted out, the preloaded data can be shifted in. Document #: 38-05630 Rev. *A CY7C1305BV25 CY7C1307BV25 BYPASS When the BYPASS instruction is loaded in the instruction register and the TAP is placed in a Shift-DR state, the bypass register is placed between the TDI and TDO pins.
  • Page 11: Tap Controller State Diagram

    11. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document #: 38-05630 Rev. *A SELECT DR-SCAN CAPTURE-DR SHIFT-DR EXIT1-DR PAUSE-DR EXIT2-DR UPDATE-DR CY7C1305BV25 CY7C1307BV25 SELECT IR-SCAN CAPTURE-IR SHIFT-IR EXIT1-IR PAUSE-IR EXIT2-IR UPDATE-IR...
  • Page 12 Test Conditions = −2.0 mA = −100 µA = 2.0 mA = 100 µA GND ≤ V ≤ V [13, 14] Over the Operating Range Description = 1 ns. CY7C1305BV25 CY7C1307BV25 Selection Circuitry Min. Max. Unit + 0.3 –0.3 −5 µA Min.
  • Page 13 = 20 pF Test Clock Test Mode Select Test Data-In Test Data-Out Identification Register Definitions Instruction Field CY7C1305BV25 Revision Number (31:29) Cypress Device ID (28:12) 01011010011010101 01011010011100101 Defines the type of SRAM. Cypress JEDEC ID (11:1) 00000110100 ID Register Presence (0) Document #: 38-05630 Rev.
  • Page 14: Instruction Codes

    Do Not Use: This instruction is reserved for future use. BYPASS Places the bypass register between TDI and TDO. This operation does not affect SRAM operation. Document #: 38-05630 Rev. *A Bit Size Description CY7C1305BV25 CY7C1307BV25 Page 14 of 21 [+] Feedback...
  • Page 15 Boundary Scan Order Bit # Bump ID Bit # Document #: 38-05630 Rev. *A Bump ID Bit # Bump ID Internal CY7C1305BV25 CY7C1307BV25 Bit # Bump ID Page 15 of 21 [+] Feedback...
  • Page 16: Maximum Ratings

    /2)/(RQ/5) for values of 175 <= RQ <= 350 Ω Ω <= RQ <= 350 (Max.) = V – 0.2V. (Max.) = 0.95V or 0.54V , whichever is smaller. CY7C1305BV25 CY7C1307BV25 Ambient [16] [16] 2.5 ± 0.1V 1.4V to 1.9V Min. Typ.
  • Page 17 = 2.5V. = 1.5V = 0.75V 0.75V R = 50Ω OUTPUT Device 0.25V 5 pF Under Test RQ = 250Ω CY7C1305BV25 CY7C1307BV25 Max. Unit [23] ALL INPUT PULSES 1.25V 0.75V Slew Rate = 2 V/ns Page 17 of 21 [+] Feedback...
  • Page 18: Switching Characteristics

    [25] [25, 26] [25, 26] and load capacitance shown in (a) of AC Test Loads. is the time power needs to be supplied above V Power and, t less than t CY7C1305BV25 CY7C1307BV25 167 MHz Min. Max. Unit µs Ω...
  • Page 19: Switching Waveforms

    KHKH t HC t HD t HD t SD t SD t CO t DOH t CLZ t CO t DOH t KHKH CY7C1305BV25 CY7C1307BV25 t CHZ t KH t KL DON’T CARE UNDEFINED Page 19 of 21 [+] Feedback...
  • Page 20: Ordering Information

    “Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit Speed Package (MHz) Ordering Code Diagram CY7C1305BV25-167BZC 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) CY7C1307BV25-167BZC CY7C1305BV25-167BZXC CY7C1307BV25-167BZXC CY7C1305BV25-167BZI CY7C1307BV25-167BZI...
  • Page 21 Document History Page Document Title: CY7C1305BV25/CY7C1307BV25 18-Mbit Burst of Four Pipelined SRAM with QDR™ Architecture Document Number: 38-05630 REV. ECN NO. Issue Date 253049 See ECN 436864 See ECN Document #: 38-05630 Rev. *A Orig. of Change Description of Change New Data Sheet Converted from Preliminary to Final.

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