Cypress Semiconductor CY7C1303BV25 Specification Sheet

Cypress Semiconductor CY7C1303BV25 Specification Sheet

Cypress 18-mbit burst of 2 pipelined sram with qdr architecture specification sheet

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Features
• Separate independent Read and Write data ports
— Supports concurrent transactions
• 167-MHz Clock for high bandwidth
— 2.5 ns Clock-to-Valid access time
• 2-Word Burst on all accesses
• Double Data Rate (DDR) interfaces on both Read and
Write Ports (data transferred at 333 MHz) @167 MHz
• Two input clocks (K and K) for precise DDR timing
— SRAM uses rising edges only
• Two input clocks for output data (C and C) to minimize
clock-skew and flight-time mismatches.
• Single multiplexed address input bus latches address
inputs for both Read and Write ports
• Separate Port Selects for depth expansion
• Synchronous internally self-timed writes
• 2.5V core power supply with HSTL Inputs and Outputs
• Available in 165-ball FBGA package (13 x 15 x 1.4 mm)
• Variable drive HSTL output buffers
• Expanded HSTL output voltage (1.4V–1.9V)
• JTAG Interface
• Variable Impedance HSTL
Configurations
CY7C1303BV25 – 1M x 18
CY7C1306BV25 – 512K x 36
Cypress Semiconductor Corporation
Document #: 38-05627 Rev. *A
18-Mbit Burst of 2 Pipelined SRAM with
Functional Description
The
CY7C1303BV25
Synchronous Pipelined SRAMs equipped with QDR™ archi-
tecture. QDR architecture consists of two separate ports to
access the memory array. The Read port has dedicated Data
Outputs to support Read operations and the Write Port has
dedicated Data inputs to support Write operations. Access to
each port is accomplished through a common address bus.
The Read address is latched on the rising edge of the K clock
and the Write address is latched on the rising edge of K clock.
QDR has separate data inputs and data outputs to completely
eliminate the need to "turn-around" the data bus required with
common I/O devices. Accesses to the CY7C1303BV25/
CY7C1306BV25 Read and Write ports are completely
independent of one another. All accesses are initiated
synchronously on the rising edge of the positive input clock
(K). In order to maximize data throughput, both Read and
Write ports are equipped with Double Data Rate (DDR) inter-
faces. Therefore, data can be transferred into the device on
every rising edge of both input clocks (K and K) and out of the
device on every rising edge of the output clock (C and C, or K
and K when in single clock mode) thereby maximizing perfor-
mance while simplifying system design. Each address location
is associated with two 18-bit words (CY7C1303BV25) or two
36-bit words (CY7C1306BV25) that burst sequentially into or
out of the device.
Depth expansion is accomplished with a Port Select input for
each port. Each Port Selects allow each port to operate
independently.
All synchronous inputs pass through input registers controlled
by the K or K input clocks. All data outputs pass through output
registers controlled by the C or C input clocks. Writes are
conducted with on-chip synchronous self-timed write circuitry.
198 Champion Court
CY7C1303BV25
CY7C1306BV25
QDR™ Architecture
and
CY7C1306BV25
,
San Jose
CA 95134-1709
Revised April 3, 2006
are
2.5V
408-943-2600
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Summary of Contents for Cypress Semiconductor CY7C1303BV25

  • Page 1 (C and C, or K and K when in single clock mode) thereby maximizing perfor- mance while simplifying system design. Each address location is associated with two 18-bit words (CY7C1303BV25) or two 36-bit words (CY7C1306BV25) that burst sequentially into or out of the device.
  • Page 2: Selection Guide

    Logic Block Diagram (CY7C1303BV25) [17:0] Address Register (18:0) Gen. Vref Control Logic Logic Block Diagram (CY7C1306BV25) [35:0] Address Register (17:0) Gen. Vref Control Logic Selection Guide Maximum Operating Frequency Maximum Operating Current Document #: 38-05627 Rev. *A Write Write Data Reg...
  • Page 3: Pin Configuration

    165-ball FBGA (13 x 15 x 1.4 mm) Pinout Gnd/ 144M NC/ 36M VREF VDDQ Gnd/ 288M NC/72M VREF VDDQ Document #: 38-05627 Rev. *A CY7C1303BV25 (1M x 18) VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ CY7C1306BV25 (512K x 36)
  • Page 4: Pin Definitions

    Write operations. Internally, the device is organized as 1M x 18 (2 arrays each of 512K x 18) for CY7C1303BV25 and 512K x 36 (2 arrays each of 256K x 36) for CY7C1306BV25. Therefore, only 19 address inputs are needed to access the entire memory array of CY7C1303BV25 and 18 address inputs for CY7C1306BV25.
  • Page 5 Address expansion for 36M. This pin is not connected to the die and so can be tied to any voltage level on CY7C1303BV25/CY7C1306BV25. GND/72M Input Address expansion for 72M. This pin has to be tied to GND on CY7C1303BV25. NC/72M Address expansion for 72M. This pin can be tied to any voltage level on CY7C1306BV25. GND/144M Input Address expansion for 144M.
  • Page 6: Application Example

    CY7C1303BV25 CY7C1306BV25 Depth Expansion The CY7C1303BV25 has a Port Select input for each port. This allows for easy depth expansion. Both Port Selects are sampled on the rising edge of the Positive Input Clock only (K). Each port select input can deselect the specified port.
  • Page 7 No data is written into the device during this portion of a Write operation. No data is written into the device during this portion of a Write operation. , BWS , in the case of CY7C1303BV25 and also BWS CY7C1303BV25 CY7C1306BV25 ) are written into the device.
  • Page 8 It also places the instruction register between the TDI and TDO pins and allows the IDCODE to be shifted out of the device when the TAP controller enters the Shift-DR state. The IDCODE instruction CY7C1303BV25 CY7C1306BV25 Page 8 of 19 [+] Feedback...
  • Page 9 The shifting of data for the SAMPLE and PRELOAD phases can occur concurrently when required—that is, while data captured is shifted out, the preloaded data can be shifted in. Document #: 38-05627 Rev. *A CY7C1303BV25 CY7C1306BV25 BYPASS When the BYPASS instruction is loaded in the instruction register and the TAP is placed in a Shift-DR state, the bypass register is placed between the TDI and TDO pins.
  • Page 10: Tap Controller State Diagram

    9. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document #: 38-05627 Rev. *A SELECT DR-SCAN CAPTURE-DR SHIFT-DR EXIT1-DR PAUSE-DR EXIT2-DR UPDATE-DR CY7C1303BV25 CY7C1306BV25 SELECT IR-SCAN CAPTURE-DR SHIFT-IR EXIT1-IR PAUSE-IR EXIT2-IR UPDATE-IR...
  • Page 11 Test Conditions = −2.0 mA = −100 µA = 2.0 mA = 100 µA GND ≤ V ≤ V [11, 12] Over the Operating Range Description = 1 ns. CY7C1303BV25 CY7C1306BV25 Selection Circuitry Min. Max. Unit + 0.3 –0.3 −5 µA Min.
  • Page 12 = 20 pF Test Clock Test Mode Select Test Data-In Test Data-Out Identification Register Definitions Instruction Field CY7C1303BV25 Revision Number (31:29) Cypress Device ID (28:12) 01011010010010101 Cypress JEDEC ID (11:1) 00000110100 ID Register Presence (0) Document #: 38-05627 Rev. *A...
  • Page 13: Instruction Codes

    Do Not Use: This instruction is reserved for future use. Do Not Use: This instruction is reserved for future use. Places the bypass register between TDI and TDO. This operation does not affect SRAM operation. CY7C1303BV25 CY7C1306BV25 Description Page 13 of 19...
  • Page 14 Boundary Scan Order Bit # Bump ID Bit # Document #: 38-05627 Rev. *A Bump ID Bit # Bump ID Internal CY7C1303BV25 CY7C1306BV25 Bit # Bump ID Page 14 of 19 [+] Feedback...
  • Page 15: Maximum Ratings

    < V and V /2), Undershoot: V (AC) > –1.5V (Pulse width less than t (Max.) = V – 0.2V. (Max.) = 0.95V or 0.54V , whichever is smaller. CY7C1303BV25 CY7C1306BV25 [17] ... –0.5V to V + 0.5V Ambient [13] [13] 2.5 ±...
  • Page 16: Switching Characteristics

    [23, 24] [23, 24] and load capacitance shown in (a) of AC test loads. is the time power needs to be supplied above V Power and, t less than t CY7C1303BV25 CY7C1306BV25 Max. Unit [21] ALL INPUT PULSES 1.25V 0.75V...
  • Page 17: Switching Waveforms

    Document #: 38-05627 Rev. *A WRITE READ WRITE t CYC t KHKH t SD t HD t DOH t DOH t CO t CO t KHKH tCYC CY7C1303BV25 CY7C1306BV25 WRITE t HD t CHZ DON’T CARE UNDEFINED Page 17 of 19 [+] Feedback...
  • Page 18: Ordering Information

    “Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit Speed Package (MHz) Ordering Code Diagram CY7C1303BV25-167BZC 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) CY7C1306BV25-167BZC CY7C1303BV25-167BZXC CY7C1306BV25-167BZXC CY7C1303BV25-167BZI CY7C1306BV25-167BZI...
  • Page 19 Document History Page Document Title: CY7C1303BV25/CY7C1306BV25 18-Mbit Burst of 2 Pipelined SRAM with QDR™ Architecture Document Number: 38-05627 REV. ECN NO. Issue Date 253010 See ECN 436864 See ECN Document #: 38-05627 Rev. *A Orig. of Change Description of Change New Data Sheet Converted from Preliminary to Final.

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