Cypress Semiconductor Perform CY7C1354C Manual

Cypress Semiconductor Perform CY7C1354C Manual

9-mbit (256k x 36/512k x 18) pipelined sram with nobl architecture

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Features
• Pin-compatible and functionally equivalent to ZBT™
• Supports 250-MHz bus operations with zero wait states
— Available speed grades are 250, 200, and 166 MHz
• Internally self-timed output buffer control to eliminate
the need to use asynchronous OE
• Fully registered (inputs and outputs) for pipelined
operation
• Byte Write capability
• Single 3.3V power supply (V
• 3.3V or 2.5V I/O power supply (V
• Fast clock-to-output times
— 2.8 ns (for 250-MHz device)
• Clock Enable (CEN) pin to suspend operation
• Synchronous self-timed writes
• Available in lead-free 100-Pin TQFP package, lead-free
and non lead-free 119-Ball BGA package and 165-Ball
FBGA package
• IEEE 1149.1 JTAG-Compatible Boundary Scan
• Burst capability–linear or interleaved burst order
• "ZZ" Sleep Mode option and Stop Clock option
Logic Block Diagram–CY7C1354C (256K x 36)
A0, A1, A
MODE
CLK
C
CEN
ADV/LD
BW
a
BW
b
BW
c
BW
d
WE
OE
CE1
CE2
CE3
ZZ
Note:
1. For best-practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.
Cypress Semiconductor Corporation
Document #: 38-05538 Rev. *G
Pipelined SRAM with NoBL™ Architecture
)
DD
)
DDQ
ADDRESS
REGISTER 0
A1
A1'
D1
Q1
A0
BURST
A0'
D0
Q0
LOGIC
ADV/LD
C
WRITE ADDRESS
WRITE ADDRESS
REGISTER 1
REGISTER 2
WRITE REGISTRY
AND DATA COHERENCY
CONTROL LOGIC
READ LOGIC
SLEEP
CONTROL
198 Champion Court
9-Mbit (256K x 36/512K x 18)
Functional Description
The CY7C1354C and CY7C1356C are 3.3V, 256K x 36 and
512K x 18 Synchronous pipelined burst SRAMs with No Bus
Latency™ (NoBL™) logic, respectively. They are designed to
support unlimited true back-to-back Read/Write operations
with no wait states. The CY7C1354C and CY7C1356C are
equipped with the advanced (NoBL) logic required to enable
consecutive Read/Write operations with data being trans-
ferred on every clock cycle. This feature dramatically improves
the throughput of data in systems that require frequent
Write/Read transitions. The CY7C1354C and CY7C1356C are
pin compatible and functionally equivalent to ZBT devices.
All synchronous inputs pass through input registers controlled
by the rising edge of the clock. All data outputs pass through
output registers controlled by the rising edge of the clock. The
clock input is qualified by the Clock Enable (CEN) signal,
which when deasserted suspends operation and extends the
previous clock cycle.
Write operations are controlled by the Byte Write Selects
(BW
–BW
for CY7C1354C and BW
a
d
and a Write Enable (WE) input. All writes are conducted with
on-chip synchronous self-timed write circuitry.
Three synchronous Chip Enables (CE
asynchronous Output Enable (OE) provide for easy bank
selection and output tri-state control. In order to avoid bus
contention, the output drivers are synchronously tri-stated
during the data portion of a write sequence.
S
D
E
A
N
T
S
A
E
MEMORY
S
WRITE
ARRAY
A
T
DRIVERS
E
M
E
P
R
S
I
N
E
G
INPUT
INPUT
E
E
REGISTER 1
REGISTER 0
,
San Jose
CA 95134-1709
CY7C1354C
CY7C1356C
[1]
–BW
for CY7C1356C)
a
b
, CE
, CE
) and an
1
2
3
O
U
T
P
U
T
B
DQs
U
DQP
a
F
DQP
b
F
DQP
E
c
R
DQP
d
S
E
408-943-2600
Revised September 14, 2006
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Summary of Contents for Cypress Semiconductor Perform CY7C1354C

  • Page 1 Features • Pin-compatible and functionally equivalent to ZBT™ • Supports 250-MHz bus operations with zero wait states — Available speed grades are 250, 200, and 166 MHz • Internally self-timed output buffer control to eliminate the need to use asynchronous OE •...
  • Page 2: Selection Guide

    Logic Block Diagram–CY7C1356C (512K x 18) A0, A1, A MODE WRITE ADDRESS REGISTER 1 ADV/LD Selection Guide Maximum Access Time Maximum Operating Current Maximum CMOS Standby Current Document #: 38-05538 Rev. *G ADDRESS REGISTER 0 BURST LOGIC ADV/LD WRITE ADDRESS REGISTER 2 WRITE REGISTRY MEMORY...
  • Page 3: Pin Configurations

    Pin Configurations DQPc CY7C1354C (256K × 36) DQPd Document #: 38-05538 Rev. *G 100-Pin TQFP Pinout DQPb CY7C1356C (512K × 18) DQPb DQPa CY7C1354C CY7C1356C DQPa Page 3 of 28 [+] Feedback...
  • Page 4 Pin Configurations (continued) NC/576M NC/1G NC/144M NC/576M NC/1G NC/144M NC/72M Document #: 38-05538 Rev. *G 119-Ball BGA Pinout CY7C1354C (256K × 36) NC/18M ADV/LD MODE NC/72M CY7C1356C (512K x 18) NC/18M ADV/LD MODE NC/36M CY7C1354C CY7C1356C NC/288M NC/36M NC/288M Page 4 of 28 [+] Feedback...
  • Page 5 Pin Configurations (continued) NC/576M NC/1G NC/144M NC/72M MODE NC/36M NC/576M NC/1G NC/144M NC/72M MODE NC/36M Document #: 38-05538 Rev. *G 165-Ball FBGA Pinout CY7C1354C (256K × 36) CY7C1356C (512K × 18) CY7C1354C CY7C1356C ADV/LD NC/18M NC/288M ADV/LD NC/18M NC/288M Page 5 of 28 [+] Feedback...
  • Page 6: Pin Definitions

    Pin Definitions Pin Name I/O Type A0, A1 Input- Address Inputs used to select one of the address locations. Sampled at the rising edge of Synchronous the CLK. Input- Byte Write Select Inputs, active LOW. Qualified with WE to conduct writes to the SRAM. Synchronous Sampled on the rising edge of CLK.
  • Page 7: Functional Overview

    Pin Definitions (continued) Pin Name I/O Type – No connects. This pin is not connected to the die. NC (18, 36, – These pins are not connected. They will be used for expansion to the 18M, 36M, 72M, 144M 72, 144, 288, 288M, 576M and 1G densities.
  • Page 8: Truth Table

    Because the CY7C1354C and CY7C1356C are common I/O devices, data should not be driven into the device while the outputs are active. The Output Enable (OE) can be deasserted HIGH before presenting data /DQP for CY7C1354C and DQ a,b,c,d a,b,c,d CY7C1356C) inputs.
  • Page 9: Sleep Mode

    [2, 3, 4, 5, 6, 7, 8] Truth Table Operation NOP/WRITE ABORT (Begin Burst) WRITE ABORT (Continue Burst) IGNORE CLOCK EDGE (Stall) SLEEP MODE Partial Write Cycle Description Function (CY7C1354C) Read Write –No bytes written Write Byte a – (DQ and DQP Write Byte b –...
  • Page 10: Tap Controller State Diagram

    IEEE 1149.1 Serial Boundary Scan (JTAG) The CY7C1354C/CY7C1356C incorporates a serial boundary scan test access port (TAP) in the BGA package only. The TQFP package does not offer this functionality. This part operates in accordance with IEEE Standard 1149.1-1900, but doesn’t have the set of functions required for full 1149.1 compliance.
  • Page 11 TDI and TDO balls as shown in the Tap Controller Block Diagram. Upon power-up, the instruction register is loaded with the IDCODE instruction. It is also loaded with the IDCODE instruction if the controller is placed in a reset state as described in the previous section.
  • Page 12 PRELOAD allows an initial data pattern to be placed at the latched parallel outputs of the boundary scan register cells prior to the selection of another boundary scan test operation. The shifting of data for the SAMPLE and PRELOAD phases can occur concurrently when required—that is, while data captured is shifted out, the preloaded data can be shifted in.
  • Page 13 3.3V TAP AC Test Conditions Input pulse levels ... V Input rise and fall times ... 1 ns Input timing reference levels ...1.5V Output reference levels...1.5V Test load termination supply voltage...1.5V 3.3V TAP AC Output Load Equivalent 1.5V Z = 50Ω TAP DC Electrical Characteristics And Operating Conditions (0°C <...
  • Page 14: Identification Codes

    Scan Register Sizes Register Name Instruction Bypass Boundary Scan Order (119-ball BGA package) Boundary Scan Order (165-ball FBGA package) Identification Codes Instruction Code EXTEST 000 Captures the Input/Output ring contents. Places the boundary scan register between the TDI and TDO. Forces all SRAM outputs to High-Z state. IDCODE 001 Loads the ID register with the vendor ID code and places the register between TDI and TDO.
  • Page 15 Boundary Scan Exit Order (256K × 36) Bit # 119-ball ID Document #: 38-05538 Rev. *G Boundary Scan Exit Order (256K × 36) 165-ball ID Bit # CY7C1354C CY7C1356C (continued) 119-ball ID 165-ball ID Not Bonded Not Bonded (Preset to 1) (Preset to 1) Page 15 of 28 [+] Feedback...
  • Page 16 Boundary Scan Exit Order (512K × 18) Bit # 119-ball ID Not Bonded (Preset to 0) Not Bonded (Preset to 0) Not Bonded (Preset to 0) Not Bonded (Preset to 0) Not Bonded (Preset to 0) Not Bonded (Preset to 0) Not Bonded (Preset to 0) Not Bonded...
  • Page 17: Maximum Ratings

    Maximum Ratings (Above which the useful life may be impaired. For user guide- lines, not tested.) Storage Temperature ... –65°C to +150°C Ambient Temperature with Power Applied... –55°C to +125°C Supply Voltage on V Relative to GND... –0.5V to +4.6V Supply Voltage on V Relative to GND ...
  • Page 18 [16] Capacitance Parameter Description Input Capacitance Clock Input Capacitance Input/Output Capacitance [16] Thermal Resistance Parameter Description Θ Thermal Resistance (Junction to Ambient) Θ Thermal Resistance (Junction to Case) AC Test Loads and Waveforms 3.3V I/O Test Load OUTPUT = 50Ω = 50Ω...
  • Page 19: Switching Characteristics

    Switching Characteristics Over the Operating Range Parameter Description [17] (typical) to the First Access Read or Write Power Clock Clock Cycle Time Maximum Operating Frequency Clock HIGH Clock LOW OE LOW to Output Valid [20, 21, 22] Clock to Low-Z Output Times Data Output Valid after CLK Rise OE LOW to Output Valid...
  • Page 20: Switching Waveforms

    Switching Waveforms [23, 24, 25] Read/Write Timing t CYC CENS CENH ADV/LD ADDRESS Data n-Out (DQ) WRITE WRITE D(A1) D(A2) D(A2+1) Notes: 23. For this waveform ZZ is tied low. 24. When CE is LOW, CE is LOW, CE is HIGH and CE 25.
  • Page 21 Switching Waveforms (continued) NOP,STALL and DESELECT Cycles ADV/LD ADDRESS Data In-Out (DQ) WRITE READ STALL D(A1) Q(A2) Note: 26. The IGNORE CLOCK EDGE or STALL cycle (Clock 3) illustrated CEN being used to create a pause. A write is not performed during this cycle. Document #: 38-05538 Rev.
  • Page 22 Switching Waveforms (continued) [27, 28] ZZ Mode Timing SUPPLY DDZZ ALL INPUTS (except ZZ) Outputs (Q) 27. Device must be deselected when entering ZZ mode. See cycle description table for all possible signal conditions to deselect the device. 28. I/Os are in High-Z when exiting ZZ sleep mode. Document #: 38-05538 Rev.
  • Page 23: Ordering Information

    Ordering Information Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit Speed Package (MHz) Ordering Code Diagram CY7C1354C-166AXC 51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free CY7C1356C-166AXC CY7C1354C-166BGC 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm)
  • Page 24 Ordering Information (continued) Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit CY7C1354C-250AXC 51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free CY7C1356C-250AXC CY7C1354C-250BGC 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) CY7C1356C-250BGC CY7C1354C-250BGXC 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) Lead-Free CY7C1356C-250BGXC...
  • Page 25: Package Diagrams

    Package Diagrams 100-Pin Thin Plastic Quad Flatpack (14 x 20 x 1.4 mm) (51-85050) R 0.08 MIN. 0° MIN. 0.20 MAX. 0.25 GAUGE PLANE R 0.08 MIN. 0°-7° 0.20 MAX. 0.60±0.15 0.20 MIN. 1.00 REF. DETAIL Document #: 38-05538 Rev. *G 16.00±0.20 14.00±0.10 0.30±0.08...
  • Page 26 Package Diagrams (continued) 119-Ball BGA (14 x 22 x 2.4 mm) (51-85115) A1 CORNER 0.70 REF. 12.00 30° TYP. SEATING PLANE Document #: 38-05538 Rev. *G Ø1.00(3X) REF. 0.15(4X) CY7C1354C CY7C1356C Ø0.05 M C Ø0.25 M C A B Ø0.75±0.15(119X) 1.27 3.81 7.62...
  • Page 27 Package Diagrams (continued) 165 FBGA 13 x 15 x 1.40 MM BB165D/BW165D TOP VIEW TOP VIEW PIN 1 CORNER PIN 1 CORNER 13.00±0.10 13.00±0.10 SEATING PLANE SEATING PLANE NoBL and No Bus Latency are trademarks of Cypress Semiconductor Corporation. ZBT is a trademark of Integrated Device Technology, Inc.
  • Page 28 Document History Page Document Title: CY7C1354C/CY7C1356C 9-Mbit (256K x 36/512K x 18) Pipelined SRAM with NoBL™ Architecture Document Number: 38-05538 REV. ECN No. Issue Date 242032 See ECN 278130 See ECN 284431 See ECN 320834 See ECN 351895 See ECN 377095 See ECN 408298...

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