Cypress Semiconductor CY7C1330AV25 Specification Sheet

Cypress 18-mbit (512k x 36/1mbit x 18) pipelined register-register late write specification sheet

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Features
• Fast clock speed: 250, 200 MHz
• Fast access time: 2.0, 2.25 ns
• Synchronous Pipelined Operation with Self-timed Late
Write
• Internally synchronized registered outputs eliminate
the need to control OE
• 2.5V core supply voltage
• 1.4–1.9V V
supply with V
DDQ
— Wide range HSTL I/O Levels
• Single Differential HSTL clock Input K and K
• Single WE (READ/WRITE) control pin
• Individual byte write (BWS
LOW)
• Common I/O
• Asynchronous Output Enable Input
• Programmable Impedance Output Drivers
• JTAG boundary scan for BGA packaging version
• Available in a 119-ball BGA package (CY7C1330AV25
and CY7C1332AV25)
Configuration
CY7C1330AV25 – 512K x 36
CY7C1332AV25 – 1M x 18
Logic Block Diagram
Clock
K,K
Buffer
A
x
CE
WE
BWS
x
ZZ
OE
Cypress Semiconductor Corporation
Document No: 001-07844 Rev. *A
PRELIMINARY
Pipelined Register-Register Late Write
of 0.68–0.95V
REF
) control (may be tied
[a:d]
D
Data-In REG.
CE
512Kx36
CONTROL
1Mx18
and WRITE
LOGIC
MEMORY
ARRAY
198 Champion Court
18-Mbit (512K x 36/1Mbit x 18)
Functional Description
The CY7C1330AV25 and CY7C1332AV25 are high perfor-
mance, Synchronous Pipelined SRAMs designed with late
write operation. These SRAMs can achieve speeds up to 250
MHz. Each memory cell consists of six transistors.
Late write feature avoids an idle cycle required during the
turnaround of the bus from a read to a write.
All synchronous inputs are gated by registers controlled by a
positive-edge-triggered Clock Input (K). The synchronous
inputs include all addresses (A), all data inputs (DQ
Enable (CE), Byte Write Selects (BWS
control (WE). Read or Write Operations can be initiated with
the chip enable pin (CE). This signal allows the user to
select/deselect the device when desired.
Power down feature is accomplished by pulling the
Synchronous signal ZZ HIGH.
Output Enable (OE) is an asynchronous input signal. OE can
be used to disable the outputs at any given time.
Four pins are used to implement JTAG test capabilities. The
JTAG circuitry is used to serially shift data to and from the
device. JTAG inputs use LVTTL/LVCMOS levels to shift data
during this testing mode of operation.
(2stage)
Q
512Kx36
1Mx18
,
San Jose
CA 95134-1709
CY7C1330AV25
CY7C1332AV25
[a:d]
), and read-write
[a:d]
DQ
x
DQ
A
BWS
X
X
X = 18:0
X = a, b, c, d
X = a, b, c, d
X = 19:0
X = a, b
X = a, b
408-943-2600
Revised September 20, 2006
), Chip
X
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Summary of Contents for Cypress Semiconductor CY7C1330AV25

  • Page 1 • Common I/O • Asynchronous Output Enable Input • Programmable Impedance Output Drivers • JTAG boundary scan for BGA packaging version • Available in a 119-ball BGA package (CY7C1330AV25 and CY7C1332AV25) Configuration CY7C1330AV25 – 512K x 36 CY7C1332AV25 – 1M x 18...
  • Page 2: Pin Configurations

    Maximum CMOS Standby Current Pin Configurations Document No: 001-07844 Rev. *A PRELIMINARY CY7C1330AV25-250 CY7C1330AV25-200 CY7C1332AV25-250 CY7C1332AV25- 200 119-Ball BGA (14 x 22 x 2.4 mm) CY7C1330AV25 (512K x 36) CY7C1332AV25 (1M x 18) CY7C1330AV25 CY7C1332AV25 Unit 2.25 Page 2 of 19 [+] Feedback...
  • Page 3: Pin Definitions

    Serial data-in to the JTAG circuit. Sampled on the rising edge of TCK. This pin controls the Test Access Port state machine. Sampled on the rising edge of TCK. Serial clock to the JTAG circuit. No connects. CY7C1330AV25 CY7C1332AV25 controls DQ , BWS controls DQ –DQ...
  • Page 4: Sleep Mode

    Introduction Functional Overview The CY7C1330AV25 and CY7C1332AV25 are synchronous- pipelined Late Write SRAMs running at speeds up to 250 MHz. All synchronous inputs pass through input registers controlled by the rising edge of the clock. All data outputs pass through output registers controlled by the rising edge of the clock.
  • Page 5 DDZZ Device operation to ZZ ZZ recovery time ZZREC [1, 2] Write Cycle Descriptions Function (CY7C1330AV25) Read Write Byte 0 – DQ Write Byte 1 – DQ Write Bytes 1, 0 Write Byte 2 – DQ Write Bytes 2, 0...
  • Page 6 TDI and TDO. During this state, instructions are shifted through the instruction register through the TDI and TDO pins. To execute the instruction once it is shifted in, the TAP controller needs to be moved into the Update-IR state. CY7C1330AV25 CY7C1332AV25 Page 6 of 19 [+] Feedback...
  • Page 7 Reserved These instructions are not implemented but are reserved for future use. Do not use these instructions. CY7C1330AV25 CY7C1332AV25 and t ). The SRAM clock input might not be Page 7 of 19...
  • Page 8: Tap Controller State Diagram

    6. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document No: 001-07844 Rev. *A PRELIMINARY SELECT DR-SCAN CAPTURE-DR SHIFT-DR EXIT1-DR PAUSE-DR EXIT2-DR UPDATE-DR CY7C1330AV25 CY7C1332AV25 SELECT IR-SCAN CAPTURE-IR SHIFT-IR EXIT1-IR PAUSE-IR EXIT2-IR UPDATE-IR Page 8 of 19...
  • Page 9 Test Conditions = −2.0 mA = −100 µA = 2.0 mA = 100 µA GND ≤ V ≤ V [10, 11] Over the Operating Range Description = 1 ns. CY7C1330AV25 CY7C1332AV25 Selection Circuitry Min. Max. Unit + 0.3 –0.3 µA –5 Min.
  • Page 10 = 20 pF Test Clock Test Mode Select Test Data-In Test Data-Out Identification Register Definitions Instruction Field CY7C1330AV25 Revision Number (31:29) Cypress Device ID (28:12) 01011110101100101 01011110101010101 Defines the type of SRAM. Cypress JEDEC ID (11:1) 00000110100 ID Register Presence (0) Document No: 001-07844 Rev.
  • Page 11: Instruction Codes

    Bit # Bump ID Document No: 001-07844 Rev. *A PRELIMINARY Bit Size—CY7C1330AV25 Description Captures the Input/Output ring contents. Loads the ID register with the vendor ID code and places the register between TDI and TDO. This operation does not affect SRAM operation.
  • Page 12 Boundary Scan Order (512K x 36) Bit # Bump ID Document No: 001-07844 Rev. *A PRELIMINARY Bit # Bump ID CY7C1330AV25 CY7C1332AV25 Bit # Bump ID Page 12 of 19 [+] Feedback...
  • Page 13: Maximum Ratings

    = f = 1/t Test Conditions through RQ. or V (min.) within 200 ms. During this time V < V and V CY7C1330AV25 CY7C1332AV25 ... –0.5V to V + 0.5V 2.37V to 2.63V 1.4V to 1.9V Min. Max. Unit 2.37...
  • Page 14 = 0.75V 0.75V R = 50Ω OUTPUT Device 0.25V 5 pF Under Test RQ = 250Ω and load capacitance shown in (a) of AC Test Loads. CY7C1330AV25 CY7C1332AV25 Max. Unit BGA Typ. Unit 19.7 °C/W °C/W [18] ALL INPUT PULSES 1.25V 0.75V...
  • Page 15: Switching Characteristics

    [18, 19, 21] [18, 19, 21] and t is less than t to eliminate bus contention between SRAMs when sharing the same EOLZ is the time power needs to be supplied above V Power CY7C1330AV25 CY7C1332AV25 Max. Min. Max. Unit 2.25 2.25 2.25...
  • Page 16: Switching Waveforms

    25. RAx stands for Read Address X, WAx Write Address X, Dx stands for Data-in for location X, Qx stands for Data-out for location X. 26. CE held LOW. Document No: 001-07844 Rev. *A PRELIMINARY [23, 24, 25, 26] EOHZ EOLZ = DON’T CARE = UNDEFINED CY7C1330AV25 CY7C1332AV25 EOHZ Page 16 of 19 [+] Feedback...
  • Page 17 Switching Waveforms (continued) READ/WRITE/DESELECT Sequence (CE Controlled) ADDRESS Data In/Out Device originally deselected Document No: 001-07844 Rev. *A PRELIMINARY = UNDEFINED = DON’T CARE CY7C1330AV25 CY7C1332AV25 Page 17 of 19 [+] Feedback...
  • Page 18: Ordering Information

    Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit Speed Package (MHz) Ordering Code Diagram CY7C1330AV25-250BGC 51-85115 119-ball Fine-Pitch Ball Grid Array (14 x 22 x 2.4 mm) CY7C1332AV25-250BGC CY7C1330AV25-250BGXC 51-85115 119-ball Fine-Pitch Ball Grid Array (14 x 22 x 2.4 mm) Lead-Free CY7C1332AV25-250BGXC CY7C1330AV25-200BGC 51-85115 119-ball Fine-Pitch Ball Grid Array (14 x 22 x 2.4 mm)
  • Page 19 Document History Page Document Title: CY7C1330AV25/CY7C1332AV25 18-Mbit (512K x 36/1Mbit x 18) Pipelined Register-Register Late Write SRAM Document Number: 001-07844 Orig. of REV. ECN No. Issue Date Change 469811 See ECN 503690 See ECN Document No: 001-07844 Rev. *A PRELIMINARY...

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