Cypress Semiconductor CY7C1310BV18 Specification Sheet

Cypress 18-mbit qdr-ii sram 2-word burst architecture specification sheet

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Features
Separate independent read and write data ports
Supports concurrent transactions
250 MHz clock for high bandwidth
2-word burst on all accesses
Double Data Rate (DDR) interfaces on both read and write ports
(data transferred at 500 MHz) at 250 MHz
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Two input clocks for output data (C and C) to minimize clock
skew and flight time mismatches
Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
Single multiplexed address input bus latches address inputs
for both read and write ports
Separate port selects for depth expansion
Synchronous internally self-timed writes
Available in x8, x9, x18, and x36 configurations
Full data coherency, providing most current data
Core V
= 1.8V (±0.1V); IO V
DD
Available in 165-Ball FBGA package (13 x 15 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
Variable drive HSTL output buffers
JTAG 1149.1 compatible test access port
Delay Lock Loop (DLL) for accurate data placement
Configurations
CY7C1310BV18 – 2M x 8
CY7C1910BV18 – 2M x 9
CY7C1312BV18 – 1M x 18
CY7C1314BV18 – 512K x 36
Selection Guide
Description
Maximum Operating Frequency
Maximum Operating Current
Cypress Semiconductor Corporation
Document #: 38-05619 Rev. *F
= 1.4V to V
DDQ
DD
250 MHz
250
x8
735
x9
735
x18
800
x36
900
198 Champion Court
CY7C1310BV18, CY7C1910BV18
CY7C1312BV18, CY7C1314BV18
18-Mbit QDR™-II SRAM 2-Word

Functional Description

The CY7C1310BV18, CY7C1910BV18, CY7C1312BV18, and
CY7C1314BV18 are 1.8V Synchronous Pipelined SRAMs,
equipped with QDR™-II architecture. QDR-II architecture
consists of two separate ports: the read port and the write port to
access the memory array. The read port has data outputs to
support read operations and the write port has data inputs to
support write operations. QDR-II architecture has separate data
inputs and data outputs to completely eliminate the need to
"turn-around" the data bus required with common IO devices.
Access to each port is accomplished through a common address
bus. The read address is latched on the rising edge of the K clock
and the write address is latched on the rising edge of the K clock.
Accesses to the QDR-II read and write ports are completely
independent of one another. To maximize data throughput, both
read and write ports are provided with DDR interfaces. Each
address
location
is
associated
(CY7C1310BV18), 9-bit words (CY7C1910BV18), 18-bit words
(CY7C1312BV18), or 36-bit words (CY7C1314BV18) that burst
sequentially into or out of the device. Because data can be trans-
ferred into and out of the device on every rising edge of both input
clocks (K and K and C and C), memory bandwidth is maximized
while
simplifying
system
"turn-arounds".
Depth expansion is accomplished with port selects, which
enables each port to operate independently.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
200 MHz
167 MHz
200
630
630
675
750
,
San Jose
CA 95134-1709
Burst Architecture
with
two
8-bit
design
by
eliminating
Unit
167
MHz
550
mA
550
600
650
408-943-2600
Revised June 2, 2008
words
bus
[+] Feedback

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Summary of Contents for Cypress Semiconductor CY7C1310BV18

  • Page 1: Functional Description

    DDR interfaces. Each address location (CY7C1310BV18), 9-bit words (CY7C1910BV18), 18-bit words (CY7C1312BV18), or 36-bit words (CY7C1314BV18) that burst sequentially into or out of the device. Because data can be trans- ferred into and out of the device on every rising edge of both input...
  • Page 2 Logic Block Diagram (CY7C1310BV18) [7:0] Address (19:0) Register Gen. DOFF Control Logic [1:0] Logic Block Diagram (CY7C1910BV18) [8:0] Address (19:0) Register Gen. DOFF Control Logic Document #: 38-05619 Rev. *F CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18 Write Write Address Register Control Logic Read Data Reg.
  • Page 3 Control Logic [1:0] Logic Block Diagram (CY7C1314BV18) [35:0] Address (17:0) Register Gen. DOFF Control Logic [3:0] Document #: 38-05619 Rev. *F CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18 Write Write Address Register Control Logic Read Data Reg. Reg. Reg. Reg. Write Write Address...
  • Page 4: Pin Configuration

    Pin Configuration The pin configuration for CY7C1310BV18, CY7C1910BV18, CY7C1312BV18, and CY7C1314BV18 follow. NC/72M DOFF NC/72M DOFF Note 1. NC/36M, NC/72M, NC/144M, and NC/288M are not connected to the die and can be tied to any voltage level. Document #: 38-05619 Rev. *F...
  • Page 5 Pin Configuration (continued) The pin configuration for CY7C1310BV18, CY7C1910BV18, CY7C1312BV18, and CY7C1314BV18 follow. NC/144M NC/36M DOFF NC/288M NC/72M DOFF Document #: 38-05619 Rev. *F CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18 165-Ball FBGA (13 x 15 x 1.4 mm) Pinout CY7C1312BV18 (1M x 18)
  • Page 6: Pin Definitions

    Synchronous Internally, the device is organized as 2M x 8 (2 arrays each of 1M x 8) for CY7C1310BV18, 2M x 9 (2 arrays each of 1M x 9) for CY7C1910BV18, 1M x 18 (2 arrays each of 512K x 18) for CY7C1312BV18 and 512K x 36 (2 arrays each of 256K x 36) for CY7C1314BV18.
  • Page 7 Power Supply Power Supply Inputs to the Core of the Device. Ground Ground for the Device. Power Supply Power Supply Inputs for the Outputs of the Device. Document #: 38-05619 Rev. *F CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18 Pin Description Switching Characteristics on page 23.
  • Page 8: Functional Overview

    Each access consists of two 8-bit data transfers in the case of CY7C1310BV18, two 9-bit data transfers in the case of CY7C1910BV18, two 18-bit data transfers in the case of CY7C1312BV18, and two 36-bit data transfers in the case of CY7C1314BV18 in one clock cycle.
  • Page 9: Application Example

    Delayed K Delayed K# R = 50ohms Document #: 38-05619 Rev. *F CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18 synchronized to the output clock (C/C) of the QDR-II. In single clock mode, CQ is generated with respect to K and CQ is generated with respect to K. The timing for the echo clocks is...
  • Page 10: Truth Table

    Truth Table The truth table for CY7C1310BV18, CY7C1910BV18, CY7C1312BV18, and CY7C1314BV18 follows. Operation Write Cycle: Load address on the rising edge of K; input write data on K and K rising edges. Read Cycle: Load address on the rising edge of K;...
  • Page 11 L–H – L–H – L–H – L–H – Document #: 38-05619 Rev. *F CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18 [2, 8] Comments [2, 8] Comments – During the data portion of a write sequence, all four bytes (D the device. L–H During the data portion of a write sequence, all four bytes (D the device.
  • Page 12 TDI pin on the rising edge of TCK. Data is output on the TDO pin on the falling edge of TCK. Document #: 38-05619 Rev. *F CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18 Instruction Register Three-bit instructions can be serially loaded into the instruction register.
  • Page 13 Document #: 38-05619 Rev. *F CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18 BYPASS When the BYPASS instruction is loaded in the instruction register and the TAP is placed in a Shift-DR state, the bypass register is placed between the TDI and TDO pins.
  • Page 14: Tap Controller State Diagram

    The state diagram for the TAP controller follows. TEST-LOGIC RESET TEST-LOGIC/ IDLE Note 9. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document #: 38-05619 Rev. *F CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18 SELECT DR-SCAN CAPTURE-DR SHIFT-DR EXIT1-DR PAUSE-DR...
  • Page 15 10. These characteristics pertain to the TAP inputs (TMS, TCK, TDI and TDO). Parallel load levels are specified in the 11. Overshoot: V (AC) < V + 0.85V (Pulse width less than t 12. All Voltage referenced to Ground. Document #: 38-05619 Rev. *F CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18 Bypass Register Instruction Register Identification Register Boundary Scan Register...
  • Page 16 14. Test conditions are specified using the load in TAP AC Test Conditions. t Document #: 38-05619 Rev. *F CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18 Description [14] Figure 2.
  • Page 17: Instruction Codes

    RESERVED Do not use: This instruction is reserved for future use. BYPASS Places the bypass register between TDI and TDO. This operation does not affect SRAM operation. Document #: 38-05619 Rev. *F CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18 Value CY7C1910BV18 CY7C1312BV18 11010011010001101...
  • Page 18 Boundary Scan Order Bit # Bump ID Bit # Document #: 38-05619 Rev. *F CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18 Bump ID Bit # Bump ID Internal Bit # Bump ID Page 18 of 29 [+] Feedback...
  • Page 19 DLL. Unstable Clock Clock Start (Clock Starts after DOFF Document #: 38-05619 Rev. *F CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18 DLL Constraints ■ DLL uses K clock as its synchronizing input. The input must have low phase jitter, which is specified as t ■...
  • Page 20: Maximum Ratings

    , whichever is larger, V 19. The operation current is calculated with 50% read cycle and 50% write cycle. Document #: 38-05619 Rev. *F CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18 Current into Outputs (LOW) ... 20 mA Static Discharge Voltage (MIL-STD-883, M. 3015).. > 2001V Latch up Current...
  • Page 21 Current AC Electrical Characteristics [11] Over the Operating Range Parameter Description Input HIGH Voltage Input LOW Voltage Document #: 38-05619 Rev. *F CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18 Test Conditions Max V 250 MHz (x8) Both Ports Deselected, (x9) ≥ V ≤ V...
  • Page 22: Thermal Resistance

    20. Unless otherwise noted, test conditions are based on signal transition time of 2V/ns, timing reference levels of 0.75V, Vref = 0.75V, RQ = 250Ω, V pulse levels of 0.25V to 1.25V, and output loading of the specified I Document #: 38-05619 Rev. *F CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18 Test Conditions = 25°C, f = 1 MHz, V...
  • Page 23: Switching Characteristics

    24. t , are specified with a load capacitance of 5 pF as in part (b) of 25. At any voltage and temperature t is less than t Document #: 38-05619 Rev. *F CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18 Description [22] , BWS...
  • Page 24: Switching Waveforms

    28. In this example, if address A0 = A1, then data Q00 = D10 and Q01 = D11. Write data is forwarded immediately as read results. This note applies to the whole diagram. Document #: 38-05619 Rev. *F CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18...
  • Page 25: Ordering Information

    CY7C1314BV18-200BZI CY7C1310BV18-200BZXI CY7C1910BV18-200BZXI CY7C1312BV18-200BZXI CY7C1314BV18-200BZXI Document #: 38-05619 Rev. *F CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18 Package Diagram Package Type 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
  • Page 26 CY7C1314BV18-167BZI CY7C1310BV18-167BZXI CY7C1910BV18-167BZXI CY7C1312BV18-167BZXI CY7C1314BV18-167BZXI Document #: 38-05619 Rev. *F CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18 Package Diagram Package Type 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
  • Page 27: Package Diagram

    Figure 6. 165-Ball FBGA (13 x 15 x 1.4 mm), 51-85180 TOP VIEW PIN 1 CORNER 13.00±0.10 SEATING PLANE Document #: 38-05619 Rev. *F CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18 0.15(4X) BOTTOM VIEW PIN 1 CORNER Ø0.05 M C Ø0.25 M C A B -0.06...
  • Page 28 Document History Page Document Title: CY7C1310BV18/CY7C1910BV18/CY7C1312BV18/CY7C1314BV18, 18-Mbit QDR™-II SRAM 2-Word Burst Architecture Document Number: 38-05619 Submission Orig, of Rev. ECN No. Date Change 252474 See ECN 325581 See ECN 413997 See ECN 423334 See ECN 472384 See ECN Document #: 38-05619 Rev. *F...
  • Page 29 Document History Page Document Title: CY7C1310BV18/CY7C1910BV18/CY7C1312BV18/CY7C1314BV18, 18-Mbit QDR™-II SRAM 2-Word Burst Architecture Document Number: 38-05619 1274723 See ECN 2511674 06/03/08 VKN/PYRS Updated Logic Block diagrams Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at cypress.com/sales.

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