Cypress Semiconductor NoBL CY7C1371D Specification Sheet

Cypress Semiconductor NoBL CY7C1371D Specification Sheet

18-mbit (512k x 36/1m x 18) flow-through sram with nobl architecture

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Features
• No Bus Latency™ (NoBL™) architecture eliminates dead
cycles between write and read cycles
• Supports up to 133-MHz bus operations with zero wait
states
— Data is transferred on every clock
• Pin-compatible and functionally equivalent to ZBT™
devices
• Internally self-timed output buffer control to eliminate the
need to use OE
• Registered inputs for flow through operation
• Byte Write capability
• 3.3V/2.5V IO power supply (V
• Fast clock-to-output times
— 6.5 ns (for 133-MHz device)
• Clock Enable (CEN) pin to enable clock and suspend
operation
• Synchronous self-timed writes
• Asynchronous Output Enable
• Available in JEDEC-standard Pb-free 100-pin TQFP,
Pb-free and non-Pb-free 119-Ball BGA and 165-Ball FBGA
package.
• Three chip enables for simple depth expansion
• Automatic Power down feature available using ZZ mode or
CE deselect
• IEEE 1149.1 JTAG-Compatible Boundary Scan
• Burst Capability — linear or interleaved burst order
• Low standby power
Selection Guide
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
Note:
1. For best-practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.
Cypress Semiconductor Corporation
Document #: 38-05556 Rev. *F
Flow-Through SRAM with NoBL™ Architecture
)
DDQ
198 Champion Court
18-Mbit (512K x 36/1M x 18)
Functional Description
The CY7C1371D/CY7C1373D is a 3.3V, 512K x 36/1M x 18
Synchronous flow through Burst SRAM designed specifically
to support unlimited true back-to-back Read/Write operations
with no wait state insertion. The CY7C1371D/CY7C1373D is
equipped with the advanced No Bus Latency (NoBL) logic
required to enable consecutive Read/Write operations with
data being transferred on every clock cycle. This feature
dramatically improves the throughput of data through the
SRAM, especially in systems that require frequent Write-Read
transitions.
All synchronous inputs pass through input registers controlled
by the rising edge of the clock. The clock input is qualified by
the Clock Enable (CEN) signal, which when deasserted
suspends operation and extends the previous clock cycle.
Maximum access delay from the clock rise is 6.5 ns (133-MHz
device).
Write operations are controlled by the two or four Byte Write
Select (BW
) and a Write Enable (WE) input. All writes are
X
conducted with on-chip synchronous self-timed write circuitry.
Three synchronous Chip Enables (CE
asynchronous Output Enable (OE) provide for easy bank
selection and output tri-state control. To avoid bus contention,
the output drivers are synchronously tri-stated during the data
portion of a write sequence.
133 MHz
6.5
210
70
,
San Jose
CA 95134-1709
CY7C1371D
CY7C1373D
[1]
, CE
, CE
) and an
1
2
3
100 MHz
Unit
8.5
ns
175
mA
70
mA
408-943-2600
Revised July 09, 2007
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Summary of Contents for Cypress Semiconductor NoBL CY7C1371D

  • Page 1 Flow-Through SRAM with NoBL™ Architecture Features • No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles • Supports up to 133-MHz bus operations with zero wait states — Data is transferred on every clock • Pin-compatible and functionally equivalent to ZBT™ devices •...
  • Page 2 Logic Block Diagram – CY7C1371D (512K x 36) ADDRESS A0, A1, A REGISTER MODE WRITE ADDRESS ADV/LD READ LOGIC SLEEP CONTROL Logic Block Diagram – CY7C1373D (1M x 18) ADDRESS A0, A1, A REGISTER MODE WRITE ADDRESS ADV/LD READ LOGIC SLEEP CONTROL Document #: 38-05556 Rev.
  • Page 3: Pin Configurations

    Pin Configurations BYTE C BYTE D Document #: 38-05556 Rev. *F 100-Pin TQFP Pinout CY7C1371D CY7C1371D CY7C1373D BYTE B BYTE A Page 3 of 29 [+] Feedback...
  • Page 4 Pin Configurations (continued) BYTE B Document #: 38-05556 Rev. *F 100-Pin TQFP Pinout CY7C1373D CY7C1371D CY7C1373D BYTE A Page 4 of 29 [+] Feedback...
  • Page 5 Pin Configurations (continued) NC/576M NC/1G NC/144M NC/576M NC/1G NC/144M NC/72M Document #: 38-05556 Rev. *F 119-Ball BGA Pinout CY7C1371D (512K x 36) ADV/LD MODE NC/72M CY7C1373D (1Mx 18) ADV/LD MODE NC/36M CY7C1371D CY7C1373D NC/288M NC/36M NC/288M Page 5 of 29 [+] Feedback...
  • Page 6 Pin Configurations (continued) NC/576M NC/1G NC/144M NC/72M MODE NC/36M NC/576M NC/1G NC/144M NC/72M MODE NC/36M Document #: 38-05556 Rev. *F 165-Ball FBGA Pinout CY7C1371D (512K x 36) CY7C1373D (1M x 18) CY7C1371D CY7C1373D ADV/LD NC/288M ADV/LD NC/288M Page 6 of 29 [+] Feedback...
  • Page 7: Pin Definitions

    Pin Definitions Name Input- Address Inputs used to select one of the address locations. Sampled at the rising edge of the Synchronous CLK. A [1:0] Input- Byte Write Inputs, Active LOW. Qualified with WE to conduct writes to the SRAM. Sampled on , BW Synchronous the rising edge of CLK.
  • Page 8: Functional Overview

    Pin Definitions (continued) Name JTAG serial Serial data-out to the JTAG circuit. Delivers data on the negative edge of TCK. If the JTAG output feature is not being used, this pin must be left unconnected. This pin is not available on TQFP Synchronous packages.
  • Page 9 details) inputs is latched into the device and the write is complete. Additional accesses (Read/Write/Deselect) can be initiated on this cycle. The data written during the Write operation is controlled by signals. The CY7C1371D/CY7C1373D provides byte write capability that is described in the truth table. Asserting the Write Enable input (WE) with the selected Byte Write Select input selectively writes to only the desired bytes.
  • Page 10: Truth Table

    Truth Table [2, 3, 4, 5, 6, 7, 8] Address Operation Used Deselect Cycle None Deselect Cycle None Deselect Cycle None Continue Deselect Cycle None Read Cycle (Begin Burst) External Read Cycle (Continue Burst) Next NOP/Dummy Read (Begin Burst) External Dummy Read (Continue Burst) Next Write Cycle (Begin Burst)
  • Page 11: Tap Controller State Diagram

    IEEE 1149.1 Serial Boundary Scan (JTAG) The CY7C1371D/CY7C1373D incorporates a serial boundary scan test access port (TAP).This part is fully compliant with 1149.1. The TAP operates using JEDEC-standard 3.3V or 2.5V IO logic levels. The CY7C1371D/CY7C1373D contains a TAP controller, instruction register, boundary scan register, bypass register, and ID register.
  • Page 12 instruction if the controller is placed in a reset state as described in the previous section. When the TAP controller is in the Capture-IR state, the two least significant bits are loaded with a binary “01” pattern to allow for fault isolation of the board level serial test data path. Bypass Register To save time when serially shifting data through registers, it is sometimes advantageous to skip certain chips.
  • Page 13 boundary scan path when multiple devices are connected together on a board. EXTEST Output Bus Tri-State IEEE Standard 1149.1 mandates that the TAP controller be able to put the output bus into a tri-state mode. The boundary scan register has a special bit located at bit #85 (for 119-BGA package) or bit #89 (for 165-fBGA package).
  • Page 14 TAP AC Switching Characteristics Parameter Clock TCK Clock Cycle Time TCYC TCK Clock Frequency TCK Clock HIGH time TCK Clock LOW time Output Times TCK Clock LOW to TDO Valid TDOV TCK Clock LOW to TDO Invalid TDOX Setup Times TMS Setup to TCK Clock Rise TMSS TDI Setup to TCK Clock Rise...
  • Page 15 3.3V TAP AC Test Conditions Input pulse levels ..V Input rise and fall times ... 1 ns Input timing reference levels ...1.5V Output reference levels...1.5V Test load termination supply voltage...1.5V 3.3V TAP AC Output Load Equivalent Z = 50Ω TAP DC Electrical Characteristics And Operating Conditions (0°C <...
  • Page 16: Identification Codes

    Identification Register Definitions Instruction Field Revision Number (31:29) Device Depth (28:24) Device Width (23:18) Cypress Device ID (17:12) Cypress JEDEC ID Code (11:1) ID Register Presence Indicator (0) Scan Register Sizes Register Name Instruction Bypass Boundary Scan Order (119-Ball BGA package) Boundary Scan Order (165-Ball FBGA package) Identification Codes Instruction...
  • Page 17 119-Ball BGA Boundary Scan Order Bit # Ball ID Bit # Notes: 13. Balls which are NC (No Connect) are pre-set LOW. 14. Bit# 85 is pre-set HIGH. Document #: 38-05556 Rev. *F [13, 14] Ball ID Bit # Ball ID CY7C1371D CY7C1373D Bit #...
  • Page 18 165-Ball BGA Boundary Scan Order Bit # Ball ID Note: 15. Bit# 89 is pre-set HIGH. Document #: 38-05556 Rev. *F [13, 15] Bit # Ball ID CY7C1371D CY7C1373D Bit # Ball ID Internal Page 18 of 29 [+] Feedback...
  • Page 19: Maximum Ratings

    Maximum Ratings Exceeding maximum ratings may impair the useful life of the device. These user guidelines are not tested. Storage Temperature ... –65°C to +150°C Ambient Temperature with Power Applied... –55°C to +125°C Supply Voltage on V Relative to GND... –0.5V to +4.6V Supply Voltage on V Relative to GND ...
  • Page 20: Thermal Resistance

    Capacitance [18] Parameter Description Input Capacitance Clock Input Capacitance Input/Output Capacitance Thermal Resistance [18] Parameter Description Θ Thermal Resistance (Junction to Ambient) Θ Thermal Resistance (Junction to Case) AC Test Loads and Waveforms 3.3V IO Test Load OUTPUT = 50Ω = 50Ω...
  • Page 21: Switching Characteristics

    Switching Characteristics Over the Operating Range Parameter Description [19] POWER Clock Clock Cycle Time Clock HIGH Clock LOW Output Times Data Output Valid After CLK Rise Data Output Hold After CLK Rise [20, 21, 22] Clock to Low-Z [20, 21, 22] Clock to High-Z OE LOW to Output Valid OE LOW to Output Low-Z...
  • Page 22: Switching Waveforms

    Switching Waveforms [25, 26, 27] Read/Write Waveforms t CYC t CENS t CENH t CL t CH t CES t CEH ADV/LD ADDRESS t AS t AH D(A1) t DS t DH COM M AND W RITE W RITE D(A1) D(A2) D(A2+1) Notes:...
  • Page 23 Switching Waveforms (continued) [25, 26, 28] NOP, STALL AND DESELECT Cycles ADV/LD [A:D] ADDRESS D(A1) COMMAND WRITE READ D(A1) Q(A2) Note: 28. The IGNORE CLOCK EDGE or STALL cycle (Clock 3) illustrates CEN being used to create a pause. A write is not performed during this cycle. Document #: 38-05556 Rev.
  • Page 24 Switching Waveforms (continued) [29, 30] ZZ Mode Timing t ZZI SUPPLY I DDZZ ALL INPUTS (except ZZ) Outputs (Q) Notes: 29. Device must be deselected when entering ZZ mode. See truth table for all possible signal conditions to deselect the device. 30.
  • Page 25: Ordering Information

    Ordering Information Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit www.cypress.com for actual products offered. Speed Package (MHz) Ordering Code Diagram CY7C1371D-133AXC 51-85050 100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Pb-Free CY7C1373D-133AXC CY7C1371D-133BGC 51-85115 119-Ball Grid Array (14 x 22 x 2.4 mm)
  • Page 26: Package Diagrams

    Package Diagrams Figure 1. 100-Pin Thin Plastic Quad Flatpack (14 x 20 x 1.4 mm), 51-85050 R 0.08 MIN. 0° MIN. 0.20 MAX. 0.25 GAUGE PLANE R 0.08 MIN. 0°-7° 0.20 MAX. 0.60±0.15 0.20 MIN. 1.00 REF. DETAIL Document #: 38-05556 Rev. *F 16.00±0.20 14.00±0.10 0.30±0.08...
  • Page 27 Package Diagrams (continued) Figure 2. 119-Ball BGA (14 x 22 x 2.4 mm) (51-85115) A1 CORNER 0.70 REF. 12.00 30° TYP. SEATING PLANE Document #: 38-05556 Rev. *F Ø1.00(3X) REF. 0.15(4X) CY7C1371D CY7C1373D Ø0.05 M C Ø0.25 M C A B Ø0.75±0.15(119X) 1.27 3.81...
  • Page 28 Package Diagrams (continued) Figure 3. 165-Ball FBGA (13 x 15 x 1.4 mm) (51-85180) TOP VIEW PIN 1 CORNER 13.00±0.10 SEATING PLANE NoBL and No Bus Latency are trademarks of Cypress Semiconductor Corporation. ZBT is a trademark of Integrated Device Technology, Inc.
  • Page 29 Document History Page Document Title: CY7C1371D/CY7C1373D 18-Mbit (512K x 36/1 Mbit x 18) flow through SRAM with NoBL™ Architecture Document Number: 38-05556 Issue Orig. of REV. ECN NO. Date Change 254513 See ECN 288531 See ECN 326078 See ECN 345117 See ECN 416321 See ECN...

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