Cypress Semiconductor CY7C1310AV18 Specification Sheet

Cypress 18-mb qdr-ii sram 2-word burst architecture specification sheet

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18-Mb QDR™-II SRAM 2-Word Burst Architecture
Features
• Separate independent Read and Write data ports
— Supports concurrent transactions
• 167-MHz clock for high bandwidth
• 2-Word Burst on all accesses
• Double Data Rate (DDR) interfaces on both Read and
Write ports (data transferred at 333 MHz) @ 167MHz
• Two input clocks (K and K) for precise DDR timing
— SRAM uses rising edges only
• Two output clocks (C and C) account for clock skew
and flight time mismatching
• Echo clocks (CQ and CQ) simplify data capture in high
speed systems
• Single multiplexed address input bus latches address
inputs for both Read and Write ports
• Separate Port Selects for depth expansion
• Synchronous internally self-timed writes
• Available in x8, x18, and x36 configurations
• Full data coherancy , providing most current data
• Core Vdd=1.8V(+/-0.1V);I/O Vddq=1.4V to Vdd
• 13 x 15 x 1.4 mm 1.0-mm pitch FBGA package, 165 ball
(11x15 matrix)
• Variable drive HSTL output buffers
• JTAG 1149.1 compatible test access port
• Delay Lock Loop (DLL) for accurate data placement
Configurations
CY7C1310AV18 – 2M x 8
CY7C1312AV18 – 1M x 18
CY7C1314AV18 – 512K x 36
Logic Block Diagram (CY7C1310AV18)
D
[7:0]
A
(19:0)
20
K
K
DOFF
V
REF
WPS
BWS
[1:0]
Cypress Semiconductor Corporation
Document #: 38-05497 Rev. *A
PRELIMINARY
8
Write
Reg
Address
Register
CLK
Gen.
Read Data Reg.
Control
Logic
3901 North First Street

Functional Description

The CY7C1310AV18/CY7C1312AV18/CY7C1314AV18 are
1.8V Synchronous Pipelined SRAMs, equipped with QDR-II
architecture. QDR-II architecture consists of two separate
ports to access the memory array. The Read port has
dedicated Data Outputs to support Read operations and the
Write Port has dedicated Data Inputs to support Write opera-
tions. QDR-II architecture has separate data inputs and data
outputs to completely eliminate the need to "turn-around" the
data bus required with common I/O devices. Access to each
port is accomplished through a common address bus. The
Read address is latched on the rising edge of the K clock and
the Write address is latched on the rising edge of the K clock.
Accesses to the QDR-II Read and Write ports are completely
independent of one another. In order to maximize data
throughput, both Read and Write ports are equipped with
Double Data Rate (DDR) interfaces. Each address location is
associated with two 8-bit words (CY7C1310AV18) or 18-bit
words (CY7C1312AV18) or 36-bit words (CY7C1314AV18)
that burst sequentially into or out of the device. Since data can
be transferred into and out of the device on every rising edge
of both input clocks (K and K and C and C), memory bandwidth
is maximized while simplifying system design by eliminating
bus "turn-arounds."
Depth expansion is accomplished with Port Selects for each
port. Port selects allow each port to operate independently.
All synchronous inputs pass through input registers controlled
by the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
Write
Address
Reg
Register
Control
Logic
16
8
Reg.
Reg.
8
Reg.
,
San Jose
CA 95134
CY7C1310AV18
CY7C1312AV18
CY7C1314AV18
A
(19:0)
20
RPS
C
CQ
C
CQ
8
8
Q
[7:0]
8
408-943-2600
Revised June 1, 2004
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Summary of Contents for Cypress Semiconductor CY7C1310AV18

  • Page 1: Functional Description

    Read and Write ports are equipped with Double Data Rate (DDR) interfaces. Each address location is associated with two 8-bit words (CY7C1310AV18) or 18-bit words (CY7C1312AV18) or 36-bit words (CY7C1314AV18) that burst sequentially into or out of the device. Since data can...
  • Page 2: Selection Guide

    Address Register Control Logic Read Data Reg. Reg. Reg. Write Write Address Register Control Logic Read Data Reg. Reg. Reg. 167 MHz 133 MHz CY7C1310AV18 CY7C1312AV18 CY7C1314AV18 (18:0) Reg. [17:0] (17:0) Reg. [35:0] Unit Page 2 of 21 [+] Feedback...
  • Page 3: Pin Configurations

    Pin Configurations /72M DOFF /144M NC/36M DOFF Document #: 38-05497 Rev. *A PRELIMINARY CY7C1310AV18 (2M × 8) – 11 × 15 BGA NC/144M NC/288M CY7C1312AV18 (1M × 18) – 11 × 15 BGA NC/288M CY7C1310AV18 CY7C1312AV18 CY7C1314AV18 /36M /72M Page 3 of 21...
  • Page 4: Pin Definitions

    Read and Write operations. Internally, the device is organized as 2M x 8 (2 arrays each of 1M x 8) for CY7C1310AV18, 1M x 18 (2 arrays each of 512K x 18) for CY7C1312AV18 and 512K x 36 (2 arrays each of 256K x 36) for CY7C1314AV18.
  • Page 5 Valid data is driven out on the rising edge of both the C and C clocks during Read operations or K and K when in single clock mode. When the Read port is deselected, CY7C1310AV18 − Q CY7C1312AV18 − Q CY7C1314AV18 −...
  • Page 6 Each access consists of two 8-bit data transfers in the case of CY7C1310AV18, two 18-bit data transfers in the case of CY7C1312AV18 and two 36-bit data transfers in the case of CY7C1314AV18, in one clock cycles.
  • Page 7: Truth Table

    SRAM #1 CQ/CQ# C C# Vt = Vddq/2 Stopped ↑ represents rising edge. , BWS , BWS CY7C1310AV18 CY7C1312AV18 CY7C1314AV18 SRAM #4 R = 250ohms CQ/CQ# C C# D(A + 0)at K(t) ↑ D(A + 1) at K(t) ↑ Q(A + 0) at C(t + 1)↑ Q(A + 1) at C(t + 2) ↑...
  • Page 8 CY7C1312AV18 − both bytes (D During the Data portion of a Write sequence : – CY7C1310AV18 − only the lower nibble (D CY7C1312AV18 − only the lower byte (D L-H During the Data portion of a Write sequence : –...
  • Page 9: Maximum Ratings

    (AC) > -1.5V (Pulse width less than t (Max.) = V – 0.2V. (min.) within 200ms. During this time V < V and V (Max.) = 0.95V or 0.54V , whichever is smaller. CY7C1310AV18 CY7C1312AV18 CY7C1314AV18 Ambient [14] [14] 1.8 ± 0.1 V 1.4V to V Min.
  • Page 10: Switching Characteristics

    , BWS , BWS , BWS , BWS [18,19] [18,19] Test Conditions and load capacitance shown in (a) of AC test loads. and t less than t CY7C1310AV18 CY7C1312AV18 CY7C1314AV18 167 MHz 133 MHz Min. Max. Min. Max. Unit –...
  • Page 11 R = 50Ω OUTPUT Device 0.25V 5 pF Under Test RQ = 250Ω INCLUDING JIG AND SCOPE CY7C1310AV18 CY7C1312AV18 CY7C1314AV18 Max. Unit [12] ALL INPUT PULSES 1.25V 0.75V Slew Rate = 2V / ns Page 11 of 21 [+] Feedback...
  • Page 12: Switching Waveforms

    WRITE t KHKH t HD t SD t DOH t DOH t CQD t CO t CO t CYC t CCQO t CQOH CY7C1310AV18 CY7C1312AV18 CY7C1314AV18 WRITE t HD t CHZ DON’T CARE UNDEFINED Page 12 of 21 [+] Feedback...
  • Page 13 It also places the instruction register between the TDI and TDO pins and allows the IDCODE to be shifted out of the device when the TAP controller enters the Shift-DR state. The IDCODE instruction CY7C1310AV18 CY7C1312AV18 CY7C1314AV18 Page 13 of 21...
  • Page 14 HIGH to enable the output when the device is powered-up, and also when the TAP controller is in the "Test-Logic-Reset" state. Reserved These instructions are not implemented but are reserved for future use. Do not use these instructions. CY7C1310AV18 CY7C1312AV18 CY7C1314AV18 Page 14 of 21 [+] Feedback...
  • Page 15 24. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document #: 38-05497 Rev. *A PRELIMINARY SELECT DR-SCAN CAPTURE-DR SHIFT-DR EXIT1-DR PAUSE-DR EXIT2-DR UPDATE-DR CY7C1310AV18 CY7C1312AV18 CY7C1314AV18 SELECT IR-SCAN CAPTURE-IR SHIFT-IR EXIT1-IR PAUSE-IR EXIT2-IR UPDATE-IR...
  • Page 16: Tap Controller

    Boundary Scan Register TAP Controller [9,12,25] Over the Operating Range Test Conditions = −2.0 mA = −100 µA = 2.0 mA = 100 µA GND ≤ V ≤ V CY7C1310AV18 CY7C1312AV18 CY7C1314AV18 Selection Circuitry Min. Max. Unit 0.65V + 0.3 –0.3 0.35V...
  • Page 17 Document #: 38-05497 Rev. *A PRELIMINARY [26, 27] Over the Operating Range Description [27] ALL INPUT PULSES 1.8V TMSS TMSH TDIS TDIH TDOV = 1 ns. CY7C1310AV18 CY7C1312AV18 CY7C1314AV18 Min. Max. Unit 0.9V TCYC TDOX Page 17 of 21 [+] Feedback...
  • Page 18: Instruction Codes

    Identification Register Definitions CY7C1310AV18 Instruction Field 2M x 8 Revision Number (31:29) Cypress Device ID (28:12) 11010011010000101 11010011010010101 11010011010100101 Defines the type of SRAM. Cypress JEDEC ID (11:1) 00000110100 ID Register Presence (0) Scan Register Sizes Register Name Instruction Bypass...
  • Page 19 Boundary Scan Order (continued) Bit # Bump ID Internal Document #: 38-05497 Rev. *A PRELIMINARY Boundary Scan Order Bit # CY7C1310AV18 CY7C1312AV18 CY7C1314AV18 (continued) Bump ID Page 19 of 21 [+] Feedback...
  • Page 20: Ordering Information

    Ordering Information Speed (MHz) Ordering Code CY7C1310AV18-167BZC CY7C1312AV18-167BZC CY7C1314AV18-167BZC CY7C1310AV18-133BZC CY7C1312AV18-133BZC CY7C1314AV18-133BZC Package Diagram QDR SRAMs and Quad Data Rate SRAMs comprise a new family of products developed by Cypress, Hitachi, IDT, NEC and Samsung technology. All product and company names mentioned in this document are the trademarks of their respective holders.
  • Page 21 Document History Page Document Title: CY7C1310AV18/CY7C1312AV18/CY7C1314AV18 18-Mb QDR™-II SRAM 2-Word Burst Architecture Document Number: 38-05497 REV. ECN No. Issue Date 208405 see ECN 230396 see ECN Document #: 38-05497 Rev. *A PRELIMINARY Orig. of Change Description of Change New Data Sheet...

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