Cypress Semiconductor CY7C1141V18 Specification Sheet

Cypress 18-mbit qdrtm-ii+ sram 4-word burst architecture (2.0 cycle read latency) specification sheet

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Features
Separate Independent read and write data ports
Supports concurrent transactions
300 MHz to 375 MHz clock for high bandwidth
4-Word Burst for reducing address bus frequency
Double Data Rate (DDR) interfaces on both read and write ports
(data transferred at 750 MHz) at 375 MHz
Read latency of 2.0 clock cycles
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Echo clocks (CQ and CQ) simplify data capture in high speed
systems
Single multiplexed address input bus latches address inputs
for both read and write ports
Separate Port Selects for depth expansion
Data valid pin (QVLD) to indicate valid data on the output
Synchronous internally self-timed writes
Available in x8, x9, x18, and x36 configurations
Full data coherency providing most current data
Core V
= 1.8V ± 0.1V; IO V
DD
Available in 165-Ball FBGA package (13 x 15 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
Variable drive HSTL output buffers
JTAG 1149.1 compatible test access port
Delay Lock Loop (DLL) for accurate data placement
Configurations
With Read Cycle Latency of 2.0 cycles:
CY7C1141V18 – 2M x 8
CY7C1156V18 – 2M x 9
CY7C1143V18 – 1M x 18
CY7C1145V18 – 512K x 36
Selection Guide
Description
Maximum Operating Frequency
Maximum Operating Current
Note
1. The QDR consortium specification for V
= 1.4V to V
.
DD
Cypress Semiconductor Corporation
Document Number: 001-06583 Rev. *D
18-Mbit QDR™-II+ SRAM 4-Word Burst
Architecture (2.0 Cycle Read Latency)
[1]
= 1.4V to V
DDQ
DD
is 1.5V + 0.1V. The Cypress QDR devices exceed the QDR consortium specification and are capable of supporting V
DDQ
198 Champion Court
CY7C1141V18, CY7C1156V18
CY7C1143V18, CY7C1145V18

Functional Description

The CY7C1141V18, CY7C1156V18, CY7C1143V18, and
CY7C1145V18 are 1.8V Synchronous Pipelined SRAMs,
equipped with QDR™-II+ architecture. QDR-II+ architecture
consists of two separate ports to access the memory array. The
read port has dedicated data outputs to support read operations
and the write port has dedicated data inputs to support write
operations. QDR-II+ architecture has separate data inputs and
data outputs to completely eliminate the need to "turn-around"
the data bus required with common IO devices. Access to each
port is accomplished through a common address bus.
Addresses for read and write addresses are latched on alternate
rising edges of the input (K) clock. Accesses to the QDR-II+ read
and write ports are completely independent of one another. To
maximize data throughput, both read and write ports are
equipped with Double Data Rate (DDR) interfaces. Each
address
location
is
associated
(CY7C1141V18), or 9-bit words (CY7C1156V18), or 18-bit words
(CY7C1143V18), or 36-bit words (CY7C1145V18) that burst
sequentially into or out of the device. Because data can be trans-
ferred into and out of the device on every rising edge of both input
clocks K and K, memory bandwidth is maximized while simpli-
fying system design by eliminating bus "turn-arounds".
Depth expansion is accomplished with Port Selects for each port.
Port Selects enable each port to operate independently.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the K or K input clocks. Writes are
conducted with on-chip synchronous self-timed write circuitry.
375 MHz
333 MHz
375
333
1020
920
,
San Jose
CA 95134-1709
with
four
8-bit
words
300 MHz
Unit
300
MHz
850
mA
DDQ
408-943-2600
Revised March 06, 2008
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Summary of Contents for Cypress Semiconductor CY7C1141V18

  • Page 1: Functional Description

    Double Data Rate (DDR) interfaces. Each address location (CY7C1141V18), or 9-bit words (CY7C1156V18), or 18-bit words (CY7C1143V18), or 36-bit words (CY7C1145V18) that burst sequentially into or out of the device. Because data can be trans- ferred into and out of the device on every rising edge of both input clocks K and K, memory bandwidth is maximized while simpli- fying system design by eliminating bus “turn-arounds”.
  • Page 2 Logic Block Diagram (CY7C1141V18) [7:0] Address Register (18:0) Gen. DOFF Control Logic [1:0] Logic Block Diagram (CY7C1156V18) [8:0] Address Register (18:0) Gen. DOFF Control Logic Document Number: 001-06583 Rev. *D CY7C1141V18, CY7C1156V18 CY7C1143V18, CY7C1145V18 Write Write Write Write Address Register...
  • Page 3 Control Logic [1:0] Logic Block Diagram (CY7C1145V18) [35:0] Address Register (16:0) Gen. DOFF Control Logic [3:0] Document Number: 001-06583 Rev. *D CY7C1141V18, CY7C1156V18 CY7C1143V18, CY7C1145V18 Write Write Write Write Address Register Control Logic Read Data Reg. Reg. Reg. Reg. Write...
  • Page 4: Pin Configurations

    Pin Configurations 165-Ball FBGA (13 x 15 x 1.4 mm) Pinout NC/72M DOFF NC/72M DOFF Document Number: 001-06583 Rev. *D CY7C1141V18, CY7C1156V18 CY7C1143V18, CY7C1145V18 CY7C1141V18 (2M x 8) NC/144M NC/144M NC/288M QVLD CY7C1156V18 (2M x 9) NC/144M NC/288M QVLD NC/36M...
  • Page 5 Document Number: 001-06583 Rev. *D 165-Ball FBGA (13 x 15 x 1.4 mm) Pinout CY7C1143V18 (1M x 18) NC/288M QVLD CY7C1145V18 (512K x 36) QVLD CY7C1141V18, CY7C1156V18 CY7C1143V18, CY7C1145V18 NC/72M NC/36M NC/144M Page 5 of 28 [+] Feedback [+] Feedback...
  • Page 6: Pin Definitions

    These address inputs are multiplexed for both read and write operations. Internally, the device is organized as 2M x 8 (4 arrays each of 512K x 8) for CY7C1141V18, 2M x 9 (4 arrays each of 512K x 9) for CY7C1156V18, 1M x 18 (4 arrays each of 256K x 18) for CY7C1143V18, and 512K x 36 (4 arrays each of 128K x 36) for CY7C1145V18.
  • Page 7 Ground Ground for the Device. Power Supply Power Supply Inputs for the Outputs of the Device. Document Number: 001-06583 Rev. *D CY7C1141V18, CY7C1156V18 CY7C1143V18, CY7C1145V18 Pin Description “Switching Characteristics” output impedance are set to 0.2 x RQ, where RQ is a resistor...
  • Page 8: Functional Overview

    Each access consists of four 8-bit data transfers in the case of CY7C1141V18, four 9-bit data transfers in the case of CY7C1156V18, four 18-bit data transfers in the case of CY7C1143V18, and four 36-bit data transfers in the case of CY7C1145V18 in two clock cycles.
  • Page 9 QDR-II+. CQ is referenced with respect to K and CQ is refer- enced with respect to K. These are free running clocks and are Document Number: 001-06583 Rev. *D CY7C1141V18, CY7C1156V18 CY7C1143V18, CY7C1145V18 synchronized to the input clock of the QDR-II+. The timings for the echo clocks are shown in the AC timing table.
  • Page 10: Application Example

    BUS MASTER (CPU or ASIC) CLKIN/CLKIN Source K Source K Truth Table The truth table for the CY7C1141V18, CY7C1156V18, CY7C1143V18, and CY7C1145V18 follows. Operation RPS WPS Write Cycle: Load address on the rising edge of K; input write data on two consecutive K and...
  • Page 11 Write Cycle Descriptions The write cycle descriptions of CY7C1141V18 and CY7C1143V18 follows. L–H – During the data portion of a write sequence: CY7C1141V18 − both nibbles (D CY7C1143V18 − both bytes (D – L-H During the data portion of a write sequence: CY7C1141V18 −...
  • Page 12 L–H – L–H – L–H – Document Number: 001-06583 Rev. *D CY7C1141V18, CY7C1156V18 CY7C1143V18, CY7C1145V18 [2, 10] Comments – During the data portion of a write sequence, all four bytes (D the device. L–H During the data portion of a write sequence, all four bytes (D the device.
  • Page 13 Data is serially loaded into the TDI pin on the rising edge of TCK. Data is output on the TDO pin on the falling edge of TCK. Document Number: 001-06583 Rev. *D CY7C1141V18, CY7C1156V18 CY7C1143V18, CY7C1145V18 Instruction Register Serially load three-bit instructions into the instruction register.
  • Page 14 TAP into the Shift-DR state. This places the boundary scan register between the TDI and TDO pins. Document Number: 001-06583 Rev. *D CY7C1141V18, CY7C1156V18 CY7C1143V18, CY7C1145V18 PRELOAD enables an initial data pattern to be placed at the latched parallel outputs of the boundary scan register cells before the selection of another boundary scan test operation.
  • Page 15: Tap Controller State Diagram

    RESET TEST-LOGIC/ IDLE Note 11. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document Number: 001-06583 Rev. *D CY7C1141V18, CY7C1156V18 CY7C1143V18, CY7C1145V18 Figure 2. Tap Controller State Diagram SELECT DR-SCAN CAPTURE-DR...
  • Page 16 13. Overshoot: V (AC) < V + 0.35V (Pulse width less than t 14. All voltage refer to ground. Document Number: 001-06583 Rev. *D CY7C1141V18, CY7C1156V18 CY7C1143V18, CY7C1145V18 Figure 3. Tap Controller Block Diagram Bypass Register Instruction Register Identification Register...
  • Page 17 TCK Clock LOW to TDO Valid TDOV TCK Clock LOW to TDO Invalid TDOX TAP Timing and Test Condition The Tap Timing and Test Conditions for the CY7C1141V18, CY7C1156V18, CY7C1143V18, and CY7C1145V18 follows. 0.9V = 50Ω Test Clock Test Mode Select...
  • Page 18: Instruction Codes

    EXTEST IDCODE SAMPLE Z RESERVED SAMPLE/PRELOAD RESERVED RESERVED BYPASS Document Number: 001-06583 Rev. *D CY7C1141V18, CY7C1156V18 CY7C1143V18, CY7C1145V18 Value CY7C1156V18 CY7C1143V18 00000110100 00000110100 Description Captures the input and output ring contents. Loads the ID register with the vendor ID code and places the register between TDI and TDO.
  • Page 19 Boundary Scan Order Bit # Bump ID Bit # Document Number: 001-06583 Rev. *D CY7C1141V18, CY7C1156V18 CY7C1143V18, CY7C1145V18 Bump ID Bit # Bump ID Internal Bit # Bump ID Page 19 of 28 [+] Feedback [+] Feedback...
  • Page 20: Power-Up Sequence

    Figure 5. Power Up Waveforms > 2048 Stable Clock V DD /V DDQ Stable (< + 0.1V DC per 50 ns) Fix HIGH (tie to V DDQ ) CY7C1141V18, CY7C1156V18 CY7C1143V18, CY7C1145V18 KC Var Start Normal Operation...
  • Page 21: Maximum Ratings

    (min) within 200 ms. During this time V < V and V /2)/(RQ/5) for values of 175Ω <= RQ <= 350Ω. (max) = 0.95V or 0.54 V , whichever is smaller. CY7C1141V18, CY7C1156V18 CY7C1143V18, CY7C1145V18 Ambient [17] Temperature (T 0°C to +70°C 1.8 ±...
  • Page 22: Thermal Resistance

    22. Unless otherwise noted, test conditions are based on signal transition time of 2V/ns, timing reference levels of 0.75V, Vref = 0.75V, RQ = 250Ω, V pulse levels of 0.25V to 1.25V, and output loading of the specified I Document Number: 001-06583 Rev. *D CY7C1141V18, CY7C1156V18 CY7C1143V18, CY7C1145V18 Test Conditions = 25°C, f = 1 MHz,...
  • Page 23: Switching Characteristics

    – 250 ps, where 250 ps is the internal jitter. An input jitter of 200 ps (t KHKH AC Test Loads and Waveforms and t less than t CY7C1141V18, CY7C1156V18 CY7C1143V18, CY7C1145V18 375 MHz 333 MHz 300 MHz Min Max Min Max Min Max –...
  • Page 24 WRITE t KHKH t HD t SD t QVLD t DOH CCQO t CQOH CCQO t CQOH CY7C1141V18, CY7C1156V18 CY7C1143V18, CY7C1145V18 [30, 31, 32] t QVLD t CQDOH t CHZ DON’T CARE UNDEFINED Page 24 of 28 [+] Feedback [+] Feedback...
  • Page 25: Ordering Information

    CY7C1145V18-333BZI CY7C1141V18-333BZXI CY7C1156V18-333BZXI CY7C1143V18-333BZXI CY7C1145V18-333BZXI Document Number: 001-06583 Rev. *D CY7C1141V18, CY7C1156V18 CY7C1143V18, CY7C1145V18 Package Diagram Package Type 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
  • Page 26 CY7C1145V18-300BZI CY7C1141V18-300BZXI CY7C1156V18-300BZXI CY7C1143V18-300BZXI CY7C1145V18-300BZXI Document Number: 001-06583 Rev. *D CY7C1141V18, CY7C1156V18 CY7C1143V18, CY7C1145V18 Package Diagram Package Type 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
  • Page 27: Package Diagram

    Figure 8. 165-Ball FBGA (13 x 15 x 1.4 mm), 51-85180 TOP VIEW PIN 1 CORNER 13.00±0.10 SEATING PLANE Document Number: 001-06583 Rev. *D 0.15(4X) CY7C1141V18, CY7C1156V18 CY7C1143V18, CY7C1145V18 BOTTOM VIEW PIN 1 CORNER Ø0.05 M C Ø0.25 M C A B 0.06 Ø0.50...
  • Page 28 Document History Page Document Title: CY7C1141V18/CY7C1156V18/CY7C1143V18/CY7C1145V18, 18-Mbit QDR™-II+ SRAM 4-Word Burst Archi- tecture (2.0 Cycle Read Latency) Document Number: 001-06583 Orig. of REV. ECN No. Issue Date Change 430351 See ECN 461654 See ECN 497629 See ECN 1167806 See ECN VKN/KKVTMP Converted from preliminary to final...

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Cy7c1143v18Cy7c1145v18Cy7c1156v18

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