Cypress Semiconductor CY7C1166V18 Specification Sheet

Cypress 18-mbit ddr-ii+ sram 2-word burst architecture (2.5 cycle read latency) specification sheet

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Features
18 Mbit density (2M x 8, 2M x 9, 1M x 18, 512K x 36)
300 MHz to 400 MHz clock for high bandwidth
2-Word burst for reducing address bus frequency
Double Data Rate (DDR) interfaces
(data transferred at 800 MHz) at 400 MHz
Read latency of 2.5 clock cycles
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
Data valid pin (QVLD) to indicate valid data on the output
Synchronous internally self-timed writes
Core V
= 1.8V ± 0.1V; IO V
DD
HSTL inputs and Variable drive HSTL output buffers
Available in 165-Ball FBGA package (13 x 15 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
JTAG 1149.1-compatible test access port
Delay Lock Loop (DLL) for accurate data placement
Configurations
With Read Cycle Latency of 2.5 cycles:
CY7C1166V18 – 2M x 8
CY7C1177V18 – 2M x 9
CY7C1168V18 – 1M x 18
CY7C1170V18 – 512K x 36
Selection Guide
Description
Maximum Operating Frequency
Maximum Operating Current
Note
1. The QDR consortium specification for V
V
= 1.4V to V
.
DDQ
DD
Cypress Semiconductor Corporation
Document Number: 001-06620 Rev. *D
18-Mbit DDR-II+ SRAM 2-Word Burst
Architecture (2.5 Cycle Read Latency)
[1]
= 1.4V to V
DDQ
DD
400 MHz
400
1080
is 1.5V + 0.1V. The Cypress QDR devices exceed the QDR consortium specification and are capable of supporting
DDQ
198 Champion Court
CY7C1166V18, CY7C1177V18
CY7C1168V18, CY7C1170V18

Functional Description

The CY7C1166V18, CY7C1177V18, CY7C1168V18, and
CY7C1170V18 are 1.8V Synchronous Pipelined SRAMs
equipped with DDR-II+ architecture. The DDR-II+ consists of an
SRAM core with an advanced synchronous peripheral circuitry.
Addresses for read and write are latched on alternate rising
edges of the input (K) clock. Write data is registered on the rising
edges of both K and K. Read data is driven on the rising edges
of K and K. Each address location is associated with two 8-bit
words (CY7C1166V18), or 9-bit words (CY7C1177V18), or 18-bit
words (CY7C1168V18), or 36-bit words (CY7C1170V18) that
burst sequentially into or out of the device.
Asynchronous inputs include output impedance matching input
(ZQ). Synchronous data outputs (Q, sharing the same physical
pins as the data inputs D) are tightly matched to the two output
echo clocks CQ/CQ, eliminating the need for separately
capturing data from each individual DDR SRAM in the system
design.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the K or K input clocks. Writes are
conducted with on-chip synchronous self-timed write circuitry.
375 MHz
333 MHz
375
333
1020
920
,
San Jose
CA 95134-1709
300 MHz
Unit
300
MHz
850
mA
408-943-2600
Revised March 06, 2008
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Summary of Contents for Cypress Semiconductor CY7C1166V18

  • Page 1: Functional Description

    K and K. Read data is driven on the rising edges of K and K. Each address location is associated with two 8-bit words (CY7C1166V18), or 9-bit words (CY7C1177V18), or 18-bit words (CY7C1168V18), or 36-bit words (CY7C1170V18) that burst sequentially into or out of the device.
  • Page 2 Logic Block Diagram (CY7C1166V18) (19:0) Address Register Gen. DOFF Control Logic [1:0] Logic Block Diagram (CY7C1177V18) (19:0) Address Register Gen. DOFF Control Logic Document Number: 001-06620 Rev. *D CY7C1166V18, CY7C1177V18 CY7C1168V18, CY7C1170V18 Write Write Output Logic Control Read Data Reg.
  • Page 3 DOFF Control Logic [1:0] Logic Block Diagram (CY7C1170V18) (17:0) Address Register Gen. DOFF Control Logic [3:0] Document Number: 001-06620 Rev. *D CY7C1166V18, CY7C1177V18 CY7C1168V18, CY7C1170V18 Write Write Output Logic Control Read Data Reg. Reg. Reg. Reg. Write Write Output Logic Control Read Data Reg.
  • Page 4: Pin Configurations

    Pin Configurations 165-Ball FBGA (13 x 15 x 1.4 mm) Pinout NC/72M DOFF NC/72M DOFF Document Number: 001-06620 Rev. *D CY7C1166V18, CY7C1177V18 CY7C1168V18, CY7C1170V18 CY7C1166V18 (2M x 8) NC/144M NC/288M QVLD CY7C1177V18 (2M x 9) NC/144M NC/288M QVLD NC/36M NC/36M...
  • Page 5 DQ30 DQ21 DQ31 DQ22 DOFF DQ32 DQ23 DQ33 DQ24 DQ34 DQ35 DQ25 DQ26 Document Number: 001-06620 Rev. *D CY7C1166V18, CY7C1177V18 CY7C1168V18, CY7C1170V18 CY7C1168V18 (1M x 18) NC/144M NC/288M QVLD CY7C1170V18 (512K x 36) QVLD NC/36M NC/72M DQ17 DQ16 DQ15 DQ14...
  • Page 6: Pin Definitions

    These address inputs are multiplexed for both read and write operations. Internally, the device is organized as 2M x 8 (two arrays each of1M x 8) for CY7C1166V18, 2M x 9 (two arrays each of 1M x 9) for CY7C1177V18, 1M x 18 (two arrays each of 512K x 18) for CY7C1168V18, and 512K x 36 (two arrays each of 256K x 18) for CY7C1170V18.
  • Page 7 Ground Ground for the Device. Power Supply Power Supply Inputs for the Outputs of the Device. Document Number: 001-06620 Rev. *D CY7C1166V18, CY7C1177V18 CY7C1168V18, CY7C1170V18 Pin Description output impedance are set to 0.2 x RQ, where RQ is a resistor...
  • Page 8: Functional Overview

    (K/K). CY7C1168V18 is described in the following sections. The same basic descriptions apply to CY7C1166V18, CY7C1177V18, and CY7C1170V18. Read Operations The CY7C1168V18 is organized internally as a single array of 1M x 18.
  • Page 9: Truth Table

    Source CLK Source CLK Echo Clock1/Echo Clock1 Echo Clock2/Echo Clock2 Truth Table The truth table for the CY7C1166V18, CY7C1177V18, CY7C1168V18, and CY7C1170V18 follows. Operation Write Cycle: Load address; wait one cycle; input write data on consecutive K and K rising edges.
  • Page 10 Write Cycle Descriptions The write cycle descriptions of CY7C1166V18 and CY7C1168V18 follows. L–H – During the Data portion of a write sequence: CY7C1166V18 − both nibbles (D CY7C1168V18 − both bytes (D – L-H During the Data portion of a write sequence: CY7C1166V18 −...
  • Page 11 – – – – – – Document Number: 001-06620 Rev. *D CY7C1166V18, CY7C1177V18 CY7C1168V18, CY7C1170V18 [2, 8] Comments – During the data portion of a write sequence, all four bytes (D the device. L-H During the data portion of a write sequence, all four bytes (D the device.
  • Page 12 Data is serially loaded into the TDI pin on the rising edge of TCK. Data is output on the TDO pin on the falling edge of TCK. Document Number: 001-06620 Rev. *D CY7C1166V18, CY7C1177V18 CY7C1168V18, CY7C1170V18 Instruction Register Load three-bit instructions serially into the instruction register.
  • Page 13 TAP into the Shift-DR state. This places the boundary scan register between the TDI and TDO pins. Document Number: 001-06620 Rev. *D CY7C1166V18, CY7C1177V18 CY7C1168V18, CY7C1170V18 PRELOAD enables an initial data pattern to be placed at the latched parallel outputs of the boundary scan register cells be- fore the selection of another boundary scan test operation.
  • Page 14: Tap Controller State Diagram

    RESET TEST-LOGIC/ IDLE Note 9. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document Number: 001-06620 Rev. *D CY7C1166V18, CY7C1177V18 CY7C1168V18, CY7C1170V18 Figure 2. Tap Controller State Diagram SELECT DR-SCAN CAPTURE-DR...
  • Page 15 11. Overshoot: V (AC) < V + 0.35V (pulse width less than t 12. All voltage refer to ground. Document Number: 001-06620 Rev. *D CY7C1166V18, CY7C1177V18 CY7C1168V18, CY7C1170V18 Figure 3. Tap Controller Block Diagram Bypass Register Instruction Register Identification Register...
  • Page 16 TCK Clock LOW to TDO Valid TDOV TCK Clock LOW to TDO Invalid TDOX TAP Timing and Test Condition The Tap Timing and Test Conditions for the CY7C1166V18, CY7C1177V18, CY7C1168V18, and CY7C1170V18 follows. 0.9V = 50Ω Test Clock Test Mode Select...
  • Page 17: Instruction Codes

    Instruction Code EXTEST IDCODE SAMPLE Z RESERVED SAMPLE/PRELOAD RESERVED RESERVED BYPASS Document Number: 001-06620 Rev. *D CY7C1166V18, CY7C1177V18 CY7C1168V18, CY7C1170V18 Value CY7C1177V18 CY7C1168V18 11010111000001101 11010111000010101 00000110100 00000110100 Description Captures the input output ring contents. Loads the ID register with the vendor ID code and places the register between TDI and TDO.
  • Page 18 Boundary Scan Order Bit # Bump ID Bit # Document Number: 001-06620 Rev. *D CY7C1166V18, CY7C1177V18 CY7C1168V18, CY7C1170V18 Bump ID Bit # Bump ID Internal Bit # Bump ID Page 18 of 27 [+] Feedback [+] Feedback...
  • Page 19: Power-Up Sequence

    Figure 5. Power Up Waveforms > 2048 Stable Clock V DD /V DDQ Stable (< + 0.1V DC per 50 ns) Fix HIGH (tie to V DDQ ) CY7C1166V18, CY7C1177V18 CY7C1168V18, CY7C1170V18 KC Var Start Normal Operation...
  • Page 20: Maximum Ratings

    (min) within 200 ms. During this time V < V and V /2)/(RQ/5) for values of 175Ω < RQ < 350Ω. (max) = 0.95V or 0.54V , whichever is smaller. CY7C1166V18, CY7C1177V18 CY7C1168V18, CY7C1170V18 Ambient [15] Temperature 0°C to +70°C 1.8 ±...
  • Page 21: Thermal Resistance

    20. Unless otherwise noted, test conditions are based on a signal transition time of 2V/ns, timing reference levels of 0.75V, V pulse levels of 0.25V to 1.25V, and output loading of the specified I Document Number: 001-06620 Rev. *D CY7C1166V18, CY7C1177V18 CY7C1168V18, CY7C1170V18 Test Conditions = 25°C, f = 1 MHz,...
  • Page 22: Switching Characteristics

    - 250 ps, where 250 ps is the internal jitter. An input jitter of 200 ps (t KHKH on page 21. Transition is measured ± 100 mV from steady-state “AC Test Loads and Waveforms” and t less than t CY7C1166V18, CY7C1177V18 CY7C1168V18, CY7C1170V18 375 MHz 333 MHz 300 MHz –...
  • Page 23 28. Q00 refers to output from address A0. Q01 refers to output from the next internal burst address following A0, i.e., A0 + 1. 29. Outputs are disabled (High-Z) one clock cycle after a NOP. Document Number: 001-06620 Rev. *D CY7C1166V18, CY7C1177V18 CY7C1168V18, CY7C1170V18 WRITE...
  • Page 24: Ordering Information

    CY7C1170V18-375BZI CY7C1166V18-375BZXI CY7C1177V18-375BZXI CY7C1168V18-375BZXI CY7C1170V18-375BZXI Document Number: 001-06620 Rev. *D CY7C1166V18, CY7C1177V18 CY7C1168V18, CY7C1170V18 Package Diagram Package Type 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
  • Page 25 CY7C1170V18-300BZI CY7C1166V18-300BZXI CY7C1177V18-300BZXI CY7C1168V18-300BZXI CY7C1170V18-300BZXI Document Number: 001-06620 Rev. *D CY7C1166V18, CY7C1177V18 CY7C1168V18, CY7C1170V18 Package Diagram Package Type 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
  • Page 26: Package Diagram

    Figure 8. 165-Ball FBGA (13 x 15 x 1.4 mm), 51-85180 TOP VIEW PIN 1 CORNER 13.00±0.10 SEATING PLANE Document Number: 001-06620 Rev. *D 0.15(4X) CY7C1166V18, CY7C1177V18 CY7C1168V18, CY7C1170V18 BOTTOM VIEW PIN 1 CORNER Ø0.05 M C Ø0.25 M C A B 0.06 Ø0.50...
  • Page 27 Document History Page Document Title: CY7C1166V18/CY7C1177V18/CY7C1168V18/CY7C1170V18, 18-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency) Document Number: 001-06620 Orig. of REV. ECN No. Issue Date Change 430351 See ECN 461654 See ECN 497629 See ECN 1175245 See ECN VKN/KKVTMP Converted from preliminary to final...

This manual is also suitable for:

Cy7c1177v18Cy7c1168v18Cy7c1170v18

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