Cypress Semiconductor CY7C1292DV18 Specification Sheet

Cypress 9-mbit qdr- ii sram 2-word burst architecture specification sheet

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Features
• Separate Independent Read and Write data ports
— Supports concurrent transactions
• 250-MHz clock for high bandwidth
• 2-Word Burst on all accesses
• Double Data Rate (DDR) interfaces on both Read and
Write ports (data transferred at 500 MHz) @ 250 MHz
• Two input clocks (K and K) for precise DDR timing
— SRAM uses rising edges only
• Two input clocks for output data (C and C) to minimize
clock-skew and flight-time mismatches
• Echo clocks (CQ and CQ) simplify data capture in
high-speed systems
• Single multiplexed address input bus latches address
inputs for both Read and Write ports
• Separate Port Selects for depth expansion
• Synchronous internally self-timed writes
• Available in x 18 and x 36 configurations
• Full data coherency, providing most current data
• Core V
= 1.8V (±0.1V); I/O V
DD
• Available in 165-ball FBGA package (13 x 15 x 1.4 mm)
• Offered in both lead-free and non-lead free packages
• Variable drive HSTL output buffers
• JTAG 1149.1 compatible test access port
• Delay Lock Loop (DLL) for accurate data placement
Configurations
CY7C1292DV18 – 512K x 18
CY7C1294DV18 – 256K x 36
Selection Guide
Maximum Operating Frequency
Maximum Operating Current
Cypress Semiconductor Corporation
Document #: 001-00350 Rev. *A
9-Mbit QDR- II™ SRAM 2-Word
= 1.4V to V
DDQ
DD
250 MHz
250
600
198 Champion Court
Burst Architecture
Functional Description
The
CY7C1292DV18
and
Synchronous Pipelined SRAMs, equipped with QDR™-II
architecture. QDR-II architecture consists of two separate
ports to access the memory array. The Read port has
dedicated Data Outputs to support Read operations and the
Write Port has dedicated Data Inputs to support Write opera-
tions. QDR-II architecture has separate data inputs and data
outputs to completely eliminate the need to "turn-around" the
data bus required with common I/O devices. Access to each
port is accomplished through a common address bus. The
Read address is latched on the rising edge of the K clock and
the Write address is latched on the rising edge of the K clock.
Accesses to the QDR-II Read and Write ports are completely
independent of one another. In order to maximize data
throughput, both Read and Write ports are equipped with
Double Data Rate (DDR) interfaces. Each address location is
associated with two 18-bit words (CY7C1292DV18) or 36-bit
words (CY7C1294DV18) that burst sequentially into or out of
the device. Since data can be transferred into and out of the
device on every rising edge of both input clocks (K and K and
C and C), memory bandwidth is maximized while simplifying
system design by eliminating bus "turn-arounds."
Depth expansion is accomplished with Port Selects for each
port. Port selects allow each port to operate independently.
All synchronous inputs pass through input registers controlled
by the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
200 MHz
200
550
,
San Jose
CA 95134-1709
CY7C1292DV18
CY7C1294DV18
CY7C1294DV18
are
1.8V
167 MHz
Unit
167
MHz
500
mA
408-943-2600
Revised July 20, 2006
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Summary of Contents for Cypress Semiconductor CY7C1292DV18

  • Page 1 Read and Write ports are equipped with Double Data Rate (DDR) interfaces. Each address location is associated with two 18-bit words (CY7C1292DV18) or 36-bit words (CY7C1294DV18) that burst sequentially into or out of the device. Since data can be transferred into and out of the...
  • Page 2 Logic Block Diagram (CY7C1292DV18) [17:0] Address Register (17:0) Gen. DOFF Control Logic [1:0] Logic Block Diagram (CY7C1294DV18) [35:0] Address Register (16:0) Gen. DOFF Control Logic [3:0] Document #: 001-00350 Rev. *A Write Write Address Register Control Logic Read Data Reg.
  • Page 3: Pin Configurations

    Pin Configurations 165-ball FBGA (13 x 15 x 1.4 mm) Pinout NC/144M NC/36M DOFF NC/288M NC/72M DOFF Document #: 001-00350 Rev. *A CY7C1292DV18 (512K x 18) NC/288M CY7C1294DV18 (256K x 36) NC/18M CY7C1292DV18 CY7C1294DV18 NC/18M NC/72M NC/36M NC/144M VDDQ Page 3 of 23...
  • Page 4: Pin Definitions

    Read and Write operations. Internally, the device is organized as 512K x 18 (2 arrays each of 256K x 18) for CY7C1292DV18 and 256K x 36 (2 arrays each of 128K x 36) for CY7C1294DV18. Therefore 18 address inputs for CY7C1292DV18 and 17 address inputs for CY7C1294DV18.
  • Page 5: Functional Overview

    Each access consists of two 18-bit data transfers in the case of CY7C1292DV18 and two 36-bit data transfers in the case of CY7C1294DV18 in one clock cycle. Accesses for both ports are initiated on the rising edge of the positive Input Clock (K).
  • Page 6 Byte Write operation. Single Clock Mode The CY7C1292DV18 can be used with a single clock that controls both the input and output registers. In this mode, the device will recognize only a single pair of input clocks (K and K) that control both the input and output registers.
  • Page 7: Application Example

    C and C rising edges. NOP: No Operation Standby: Clock Stopped Write Cycle Descriptions (CY7C1292DV18) – During the Data portion of a Write sequence: both bytes (D – L-H During the Data portion of a Write sequence: both bytes (D –...
  • Page 8 [26:0] No data is written into the device during this portion of a Write operation. L-H No data is written into the device during this portion of a Write operation. CY7C1292DV18 CY7C1294DV18 ) are written [35:0] ) are written...
  • Page 9 Data is serially loaded into the TDI pin on the rising edge of TCK. Data is output on the TDO pin on the falling edge of TCK. Document #: 001-00350 Rev. *A CY7C1292DV18 CY7C1294DV18 Instruction Register Three-bit instructions can be serially loaded into the instruction register.
  • Page 10 Document #: 001-00350 Rev. *A CY7C1292DV18 CY7C1294DV18 The shifting of data for the SAMPLE and PRELOAD phases can occur concurrently when required—that is, while data captured is shifted out, the preloaded data can be shifted in.
  • Page 11: Tap Controller State Diagram

    9. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document #: 001-00350 Rev. *A SELECT DR-SCAN CAPTURE-DR SHIFT-DR EXIT1-DR PAUSE-DR EXIT2-DR UPDATE-DR CY7C1292DV18 CY7C1294DV18 SELECT IR-SCAN CAPTURE-IR SHIFT-IR EXIT1-IR PAUSE-IR EXIT2-IR UPDATE-IR...
  • Page 12: Tap Controller

    Test Conditions = −2.0 mA = −100 µA = 2.0 mA = 100 µA GND ≤ V ≤ V /2), Undershoot: V (AC) > –1.5V (Pulse width less than t CY7C1292DV18 CY7C1294DV18 Selection Circuitry Min. Max. Unit 0.65V + 0.3 –0.3...
  • Page 13 Document #: 001-00350 Rev. *A [13, 14] Over the Operating Range Description [13] 1.8V TMSS TMSH TDIS TDIH TDOV = 1 ns. CY7C1292DV18 CY7C1294DV18 Min. Max. Unit ALL INPUT PULSES 0.9V TCYC TDOX Page 13 of 23 [+] Feedback...
  • Page 14: Instruction Codes

    Identification Register Definitions Instruction Field CY7C1292DV18 Revision Number (31:29) Cypress Device ID (28:12) 11010011010010110 Cypress JEDEC ID (11:1) 00000110100 ID Register Presence (0) Scan Register Sizes Register Name Instruction Bypass Boundary Scan Cells Instruction Codes Instruction Code EXTEST IDCODE SAMPLE Z...
  • Page 15 Boundary Scan Order Bit # Bump ID Bit # Document #: 001-00350 Rev. *A Bump ID Bit # Bump ID Internal CY7C1292DV18 CY7C1294DV18 Bit # Bump ID Page 15 of 23 [+] Feedback...
  • Page 16: Start Normal Operation

    > 1024 Stable clock Stable) Stable (< +/- 0.1V DC per 50ns ) Fix High (or tied to V DDQ ) CY7C1292DV18 CY7C1294DV18 KC Var Start Normal Operation Page 16 of 23...
  • Page 17: Maximum Ratings

    /2)/(RQ/5) for values of 175Ω <= RQ <= 350Ωs. (min.) within 200 ms. During this time V < V and V (Max.) = 0.95V or 0.54V , whichever is smaller. CY7C1292DV18 CY7C1294DV18 Ambient [19] [19] 1.8 ± 0.1 V 1.4V to V Min.
  • Page 18 = 0.75V 0.75V R = 50Ω OUTPUT Device 0.25V 5 pF Under Test RQ = 250Ω and load capacitance shown in (a) of AC Test Loads. CY7C1292DV18 CY7C1294DV18 165 FBGA Unit °C/W 28.51 °C/W 5.91 [22] ALL INPUT PULSES 1.25V 0.75V Slew Rate = 2 V/ns = 1.5V, input...
  • Page 19: Switching Characteristics

    –0.45 – –0.30 [25,26] – [25,26] –0.45 – 1024 is the time that the power needs to be supplied above V and t less than t CY7C1292DV18 CY7C1294DV18 200 MHz 167 MHz Max. Min. Max. Min. Max. Unit – –...
  • Page 20: Switching Waveforms

    READ WRITE t CYC t KHKH t SD t HD t SD t HD t CQDOH t DOH t CYC t CCQO t CQOH t CCQO CY7C1292DV18 CY7C1294DV18 WRITE t CQD DON’T CARE UNDEFINED Page 20 of 23 [+] Feedback...
  • Page 21: Ordering Information

    CY7C1292DV18-167BZC 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) CY7C1294DV18-167BZC CY7C1292DV18-167BZXC 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free CY7C1294DV18-167BZXC CY7C1292DV18-167BZI 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) CY7C1294DV18-167BZI CY7C1292DV18-167BZXI 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free...
  • Page 22: Package Diagram

    SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD) JEDEC REFERENCE : MO-216 / DESIGN 4.6C PACKAGE WEIGHT : 0.475g PACKAGE CODE : BB0AC JEDEC REFERENCE : MO-216 / DESIGN 4.6C PACKAGE CODE : BB0AC CY7C1292DV18 CY7C1294DV18 BOTTOM VIEW PIN 1 CORNER BOTTOM VIEW PIN 1 CORNER Ø0.05 M C...
  • Page 23 Document History Page Document Title: CY7C1292DV18/CY7C1294DV18 9-Mbit QDR- II™ SRAM 2-Word Burst Architecture Document Number: 001-00350 Orig. of REV. ECN No. Issue Date Change 380737 See ECN 485631 See ECN Document #: 001-00350 Rev. *A Description of Change New data sheet Converted from Preliminary to Final Removed 300MHz Speed Bin.

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