Cypress Semiconductor CY7C1163V18 Specification Sheet

Cypress 18-mbit qdrtm-ii+ sram 4-word burst architecture (2.5 cycle read latency) specification sheet

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Features
Separate independent read and write data ports
Supports concurrent transactions
300 MHz to 400 MHz clock for high bandwidth
4-word burst to reduce address bus frequency
Double Data Rate (DDR) interfaces on both read and write ports
(data transferred at 800 MHz) at 400 MHz
Read latency of 2.5 clock cycles
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Echo clocks (CQ and CQ) simplify data capture in high speed
systems
Single multiplexed address input bus latches address inputs
for both read and write ports
Separate port selects for depth expansion
Data valid pin (QVLD) to indicate valid data on the output
Synchronous internally self-timed writes
Available in x8, x9, x18, and x36 configurations
Full data coherency providing most current data
Core V
= 1.8V ± 0.1V; IO V
DD
Available in 165-ball FBGA package (13 x 15 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
Variable drive HSTL output buffers
JTAG 1149.1 compatible test access port
Delay Lock Loop (DLL) for accurate data placement
Configurations
With cycle read latency of 2.5 cycles:
CY7C1161V18 – 2M x 8
CY7C1176V18 – 2M x 9
CY7C1163V18 – 1M x 18
CY7C1165V18 – 512K x 36
Selection Guide
Description
Maximum Operating Frequency
Maximum Operating Current
Note
1. The QDR consortium specification for V
= 1.4V to V
.
DD
Cypress Semiconductor Corporation
Document Number: 001-06582 Rev. *D
18-Mbit QDR™-II+ SRAM 4-Word Burst
Architecture (2.5 Cycle Read Latency)
[1]
= 1.4V to V
DDQ
DD
400 MHz
400
1080
is 1.5V + 0.1V. The Cypress QDR devices exceed the QDR consortium specification and are capable of supporting V
DDQ
198 Champion Court
CY7C1161V18, CY7C1176V18
CY7C1163V18, CY7C1165V18

Functional Description

The CY7C1161V18, CY7C1176V18, CY7C1163V18, and
CY7C1165V18 are 1.8V Synchronous Pipelined SRAMs
equipped with QDR™-II+ architecture. QDR-II+ architecture
consists of two separate ports to access the memory array. The
read port has dedicated data outputs to support read operations
and the write port has dedicated data inputs to support write
operations. QDR-II+ architecture has separate data inputs and
data outputs to completely eliminate the need to turn around the
data bus that is required with common IO devices. Each port can
be accessed through a common address bus. Addresses for
read and write addresses are latched onto alternate rising edges
of the input (K) clock. Accesses to the QDR-II+ read and write
ports are completely independent of one another. In order to
maximize data throughput, both read and write ports are
equipped with Double Data Rate (DDR) interfaces. Each
address
location
is
(CY7C1161V18), 9-bit words (CY7C1176V18), 18-bit words
(CY7C1163V18), or 36-bit words (CY7C1165V18) that burst
sequentially into or out of the device. Because data can be trans-
ferred into and out of the device on every rising edge of both input
clocks K and K, memory bandwidth is maximized while simpli-
fying system design by eliminating bus turnarounds.
Depth expansion is accomplished with port selects for each port.
Port selects allow each port to operate independently.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the or K or K input clocks. Writes are
conducted with on-chip synchronous self-timed write circuitry.
375 MHz
333 MHz
375
333
1020
920
,
San Jose
CA 95134-1709
associated
with
four
8-bit
300 MHz
Unit
300
MHz
850
mA
408-943-2600
Revised March 06, 2008
words
DDQ
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Summary of Contents for Cypress Semiconductor CY7C1163V18

  • Page 1: Functional Description

    (CY7C1161V18), 9-bit words (CY7C1176V18), 18-bit words (CY7C1163V18), or 36-bit words (CY7C1165V18) that burst sequentially into or out of the device. Because data can be trans- ferred into and out of the device on every rising edge of both input clocks K and K, memory bandwidth is maximized while simpli- fying system design by eliminating bus turnarounds.
  • Page 2 Control Logic [1:0] Logic Block Diagram (CY7C1176V18) [8:0] Address Register (18:0) Gen. DOFF Control Logic Document Number: 001-06582 Rev. *D CY7C1161V18, CY7C1176V18 CY7C1163V18, CY7C1165V18 Write Write Write Write Address Register Control Logic Read Data Reg. Reg. Reg. Reg. Write Write...
  • Page 3 Logic Block Diagram (CY7C1163V18) [17:0] Address Register (17:0) Gen. DOFF Control Logic [1:0] Logic Block Diagram (CY7C1165V18) [35:0] Address Register (16:0) Gen. DOFF Control Logic [3:0] Document Number: 001-06582 Rev. *D CY7C1161V18, CY7C1176V18 CY7C1163V18, CY7C1165V18 Write Write Write Write Address...
  • Page 4: Pin Configurations

    Pin Configurations 165-Ball FBGA (13 x 15 x 1.4 mm) Pinout NC/72M DOFF NC/72M DOFF Document Number: 001-06582 Rev. *D CY7C1161V18, CY7C1176V18 CY7C1163V18, CY7C1165V18 CY7C1161V18 (2M x 8) NC/144M NC/144M NC/288M QVLD CY7C1176V18 (2M x 9) NC/144M NC/288M QVLD NC/36M...
  • Page 5 Pin Configurations (continued) NC/144M NC/36M DOFF NC/288M NC/72M DOFF Document Number: 001-06582 Rev. *D 165-Ball FBGA (13 x 15 x 1.4 mm) Pinout CY7C1163V18 (1M x 18) NC/288M QVLD CY7C1165V18 (512K x 36) QVLD CY7C1161V18, CY7C1176V18 CY7C1163V18, CY7C1165V18 NC/72M NC/36M NC/144M...
  • Page 6: Pin Definitions

    2M x 8 (4 arrays each of 512K x 8) for CY7C1161V18, 2M x 9 (4 arrays each of 512K x 9) for CY7C1176V18, 1M x 18 (4 arrays each of 256K x 18) for CY7C1163V18, and 512K x 36 (4 arrays each of 128K x 36) for CY7C1165V18.
  • Page 7 Ground for the Device. Power Supply Power Supply Inputs for the Outputs of the Device. Document Number: 001-06582 Rev. *D CY7C1161V18, CY7C1176V18 CY7C1163V18, CY7C1165V18 Pin Description output impedance are set to 0.2 x RQ, where RQ is a resistor [x:0] “Switching Characteristics”...
  • Page 8: Functional Overview

    CY7C1161V18, four 9-bit data transfers in the case of CY7C1176V18, four 18-bit data transfers in the case of CY7C1163V18, and four 36-bit data transfers in the case of CY7C1165V18 in two clock cycles. Accesses for both ports are initiated on the positive input clock (K).
  • Page 9 Depth Expansion The CY7C1163V18 has a port select input for each port. This enables easy depth expansion. Both port selects are only sampled on the rising edge of the positive input clock (K). Each port select input can deselect the specified port. Deselecting a port does not affect the other port.
  • Page 10: Application Example

    BUS MASTER (CPU or ASIC) CLKIN/CLKIN Source K Source K Truth Table The truth table for the CY7C1161V18, CY7C1176V18, CY7C1163V18, and CY7C1165V18 follows. Operation RPS WPS Write Cycle: Load address on rising edge of K; input write data on two consecutive K and K rising edges.
  • Page 11 Write Cycle Descriptions The write cycle descriptions of CY7C1161V18 and CY7C1163V18 follow. L–H – During the data portion of a write sequence: CY7C1161V18 − both nibbles (D CY7C1163V18 − both bytes (D – L-H During the data portion of a write sequence: CY7C1161V18 −...
  • Page 12 L–H – L–H – Document Number: 001-06582 Rev. *D CY7C1161V18, CY7C1176V18 CY7C1163V18, CY7C1165V18 [3, 11] Comments – During the data portion of a write sequence, all four bytes (D the device. L–H During the data portion of a write sequence, all four bytes (D the device.
  • Page 13 TCK. Data outputs on the TDO pin on the falling edge of TCK. Document Number: 001-06582 Rev. *D CY7C1161V18, CY7C1176V18 CY7C1163V18, CY7C1165V18 Instruction Register Three-bit instructions are serially loaded into the instruction register. This register is loaded when it is placed between the TDI and TDO pins as shown in page 16.
  • Page 14 TDI and TDO pins. Document Number: 001-06582 Rev. *D CY7C1161V18, CY7C1176V18 CY7C1163V18, CY7C1165V18 PRELOAD enables an initial data pattern to be placed at the latched parallel outputs of the boundary scan register cells before the selection of another boundary scan test operation.
  • Page 15: Tap Controller State Diagram

    TEST-LOGIC/ IDLE Note 12. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document Number: 001-06582 Rev. *D CY7C1161V18, CY7C1176V18 CY7C1163V18, CY7C1165V18 Figure 2. Tap Controller State Diagram SELECT DR-SCAN CAPTURE-DR SHIFT-DR...
  • Page 16 (AC) < V + 0.35V (pulse width less than t 15. All voltage referenced to ground. Document Number: 001-06582 Rev. *D CY7C1161V18, CY7C1176V18 CY7C1163V18, CY7C1165V18 Figure 3. Tap Controller Block Diagram Bypass Register Instruction Register Identification Register Boundary Scan Register...
  • Page 17 TCK Clock LOW to TDO Valid TDOV TCK Clock LOW to TDO Invalid TDOX TAP Timing and Test Conditions The Tap Timing and Test Conditions for the CY7C1161V18, CY7C1176V18, CY7C1163V18, and CY7C1165V18 follows. 0.9V = 50Ω Test Clock Test Mode Select...
  • Page 18: Instruction Codes

    SAMPLE Z RESERVED SAMPLE/PRELOAD RESERVED RESERVED BYPASS Document Number: 001-06582 Rev. *D CY7C1161V18, CY7C1176V18 CY7C1163V18, CY7C1165V18 Value CY7C1176V18 CY7C1163V18 00000110100 00000110100 Description Captures the input and output ring contents. Loads the ID register with the vendor ID code and places the register between TDI and TDO.
  • Page 19 Boundary Scan Order Bit # Bump ID Bit # Document Number: 001-06582 Rev. *D CY7C1161V18, CY7C1176V18 CY7C1163V18, CY7C1165V18 Bump ID Bit # Bump ID Internal Bit # Bump ID Page 19 of 29 [+] Feedback [+] Feedback...
  • Page 20: Power-Up Sequence

    Figure 4. Power Up Waveforms > 2048 Stable Clock V DD /V DDQ Stable (< + 0.1V DC per 50 ns) Fix HIGH (tie to V DDQ ) CY7C1161V18, CY7C1176V18 CY7C1163V18, CY7C1165V18 KC Var Start Normal Operation Page 20 of 29...
  • Page 21: Maximum Ratings

    (min) within 200 ms. During this time V < V /2)/(RQ/5) for values of 175Ω < RQ < 350Ω. (max) = 0.95V or 0.54V , whichever is smaller. CY7C1161V18, CY7C1176V18 CY7C1163V18, CY7C1165V18 Ambient [18] Temperature (T 0°C to +70°C 1.8 ± 0.1V 1.4V to...
  • Page 22: Thermal Resistance

    23. Unless otherwise noted, test conditions are based upon signal transition time of 2V/ns, timing reference levels of 0.75V, Vref = 0.75V, RQ = 250Ω, V pulse levels of 0.25V to 1.25V, and output loading of the specified I Document Number: 001-06582 Rev. *D CY7C1161V18, CY7C1176V18 CY7C1163V18, CY7C1165V18 Test Conditions = 25°C, f = 1 MHz, = 1.8V = 1.5V...
  • Page 23: Switching Characteristics

    – 250 ps, where 250 ps is the internal jitter. An input jitter of 200 ps (t KHKH Waveforms. Transition is measured ± 100 mV from steady state voltage. AC Test Loads and and t less than t CY7C1161V18, CY7C1176V18 CY7C1163V18, CY7C1165V18 375 MHz 333 MHz 300 MHz – – –...
  • Page 24 K Static to DLL Reset KC Reset KC Reset Note 30. Hold to >V or <V Document Number: 001-06582 Rev. *D CY7C1161V18, CY7C1176V18 CY7C1163V18, CY7C1165V18 400 MHz Description Min Max Min Max Min Max Min Max – 0.20 2048 –...
  • Page 25 WRITE t KHKH t HD t SD t QVLD CCQO t CQOH CCQO t CQOH CY7C1161V18, CY7C1176V18 CY7C1163V18, CY7C1165V18 [31, 32, 33] QVLD t DOH t CQDOH DON’T CARE UNDEFINED Page 25 of 29 t CHZ [+] Feedback [+] Feedback...
  • Page 26: Ordering Information

    CY7C1176V18-375BZXI CY7C1163V18-375BZXI CY7C1165V18-375BZXI Document Number: 001-06582 Rev. *D CY7C1161V18, CY7C1176V18 CY7C1163V18, CY7C1165V18 Package Diagram Package Type 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
  • Page 27 CY7C1176V18-300BZXI CY7C1163V18-300BZXI CY7C1165V18-300BZXI Document Number: 001-06582 Rev. *D CY7C1161V18, CY7C1176V18 CY7C1163V18, CY7C1165V18 Package Diagram Package Type 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
  • Page 28: Package Diagram

    Figure 7. 165-Ball FBGA (13 x 15 x 1.4 mm), 51-85180 TOP VIEW PIN 1 CORNER 13.00±0.10 SEATING PLANE Document Number: 001-06582 Rev. *D 0.15(4X) CY7C1161V18, CY7C1176V18 CY7C1163V18, CY7C1165V18 BOTTOM VIEW PIN 1 CORNER Ø0.05 M C Ø0.25 M C A B 0.06 Ø0.50 (165X) +0.14...
  • Page 29 Document History Page Document Title: CY7C1161V18/CY7C1176V18/CY7C1163V18/CY7C1165V18, 18-Mbit QDR™-II+ SRAM 4-Word Burst Archi- tecture (2.5 Cycle Read Latency) Document Number: 001-06582 Orig. of REV. ECN No. Issue Date Change 430351 See ECN 461654 See ECN 497629 See ECN 1167806 See ECN VKN/KKVTMP Converted from preliminary to final...

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Cy7c1161v18Cy7c1165v18Cy7c1176v18

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