PREPARING AND INSTALLING THE MEMORY MODULE
THERMAL PAD G 1.0 mm
STEP 2
M3 x 5 DIN7991
SIDE
COVER
STEP 3
STEP 1
In case your Memory modules are equipped with heat spreaders by default
it is mandatory to remove those before continuing the installation process.
Because there is no prescribed standard on how the heat spreader should be
attached to the memory module, many methods are used, the most common
being self-adhesive tape between the heat spreader and memory IC.
Wipe off the remains (by using non–abrasive cloth or Q-tip) of the original
thermal compound or adhesive tape until the components and circuit board
are completely clean.
STEP 2
On BOTH sides of the Memory module, the provided Thermal Pads G 1.0 mm
must be placed. If necessary, trim the Thermal Pad to fit the Memory module.
For this step, you will need:
Thermal Pad G 1.0mm
STEP 3
Using the provided 2 mm Allen Key, unscrew three M3 x 5 DIN7991
screws from the Memory module.
For this step, you will need:
Allen Key2mm
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