Table Of Contents - Texas Instruments SimpleLink CC1312PSIP Manual

www.ti.com
1 Features............................................................................1
2 Applications.....................................................................
3 Description.......................................................................2
4 Functional Block Diagram..............................................
5 Revision History..............................................................
6 Device Comparison.........................................................
7 Pin Configuration and
7.1 Pin Diagram - MOT Package (Top View)...................
7.2 Signal Descriptions - MOT Package........................
7.3 Connections for Unused Pins and Modules..............
8 Specifications................................................................
8.1 Absolute Maximum Ratings......................................
8.2 ESD Ratings.............................................................
8.3 Recommended Operating
8.4 Power Supply and Modules......................................
8.5 Power Consumption - Power Modes........................
8.6 Power Consumption - Radio Modes.........................
8.7 Nonvolatile (Flash) Memory Characteristics.............
8.8 Thermal Resistance Characteristics.........................
8.9 RF Frequency Bands................................................
8.10 861 MHz to 1054 MHz - Receive
8.11 861 MHz to 1054 MHz - Transmit (TX) ..................
8.12 861 MHz to 1054 MHz - PLL Phase Noise
Wideband Mode..........................................................
8.13 861 MHz to 1054 MHz - PLL Phase Noise
Narrowband Mode.......................................................23
8.14 Timing and Switching Characteristics.....................
8.15 Peripheral Characteristics.......................................27
8.16 Typical Characteristics............................................
9 Detailed Description......................................................44
9.1 Overview...................................................................
9.2 System CPU.............................................................
9.3 Radio (RF Core)........................................................45
9.4 Memory.....................................................................
9.5 Sensor Controller......................................................
9.6 Cryptography............................................................
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE
November
2023
Copyright © 2023 Texas Instruments Incorporated

Table of Contents

Functions...................................9
Conditions.......................12
(RX)....................16
REVISION
*
Product Folder Links:
9.7 Timers.......................................................................
2 9.8 Serial Peripherals and
9.9 Battery and Temperature Monitor.............................
3 9.10 µDMA......................................................................
5 9.11 Debug......................................................................50
6 9.12 Power Management................................................51
9.13 Clock Systems, production calibration and
9 temperature compensation..........................................52
10 9.14 Network Processor..................................................53
11 9.15 Device Certification and Qualification.....................
12 9.16 Module Markings.....................................................56
12 9.17 End Product
12 9.18 Manual Information to the End User.......................
10 Application, Implementation, and Layout.................
12 10.1 Application Information...........................................
13 10.2 Device Connection and Layout Fundamentals.......
14 10.3 PCB Layout
14 10.4 Reference Designs.................................................
14 11 Environmental Requirements and SMT
15 Specifications ...............................................................63
11.1 PCB Bending...........................................................63
21 11.2 Handling Environment.............................................63
11.3 Storage Condition...................................................
22 11.4 PCB Assembly
11.5 Baking Conditions...................................................
11.6 Soldering and Reflow
23 12 Device and Documentation
12.1 Device Nomenclature..............................................66
35 12.2 Tools and Software.................................................
12.3 Documentation Support..........................................
44 12.4 Support Resources.................................................
44 12.5 Trademarks.............................................................
12.6 Electrostatic Discharge
46 12.7 Glossary..................................................................69
47 13 Mechanical, Packaging, and Orderable
48 Information....................................................................
CC1312PSIP
SWRS293 - NOVEMBER 2023
I/O.........................................50
Labeling..............................................56
Guidelines...........................................58
Guide..............................................63
Condition..............................65
Support..........................66
Caution..............................69
NOTES
Initial Release
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