Advantech RSB-3730 User Manual page 51

Thermal Solution Services
We provide services to assist customers with quicker and more flexible solutions for
thermal design. Advantech provides thermal solution services including modularized
thermal solutions and customized thermal solutions.
Standard Thermal Solutions

Customized Thermal Solutions

Embedded Software Services
These services are to provide driver support, software integration or customized firm-
ware, root file-system, and Linux images. This enables customers to save a lot of
time and focus on core development.
Embedded Linux/Android OS

Advantech Bootloader Customization

With the spread of industrial computing, a whole range of new applications has been
developed, resulting in a fundamental change in the IPC industry. In the past, System
Integrators (SI) were used to complete projects without outside assistance, but now
such working models have been left behind. Due to diverse market demands and
intense competition, cooperation for vertical integration (both upstream and down-
stream) has become a much more effective way to create competitive advantages.
As a result, ARM-based CPU modules were born out of this trend. Concentrating all
necessary components on the CPU module and placing other parts on the carrier
board in response to market requirements for specialization provides greater flexibil-
ity while retaining low power consumption credentials.
Advantech has been involved in the industrial computer industry for many years and
has found that customers usually have the following concerns when implementing
modular designs.
General I/O design capability
Although customers possess the ability for vertical integration and have enough
know-how and core competitiveness in the professional application field, the lack of
expertise and experience in general power and I/O design causes many challenges
for them, especially in integrating CPU modules into their carrier boards.
Acquisition of information
Even if an individual client is able to obtain sufficient information to make the right
decision for a specialized vertical application, some customers encounter difficult
problems dealing with platform design in general and communicating with CPU or
chipset manufacturers, thereby increasing carrier board design difficulties and risk as
well as seriously impacting time-to-market, possibly resulting in lost market opportu-
nities.
45 RSB-3730 User Manual