Hardware Installation and Reference Guide
Note
The ambient temperature and humidity of the switch are measured at a point located 1.5 m (59.06 in.) above
the floor and 0.4 m (15.75 in.) before the switch rack, assuming there are no protective plates installed in front
or at the back of the rack.
2.2.3
Cleanliness
Dust poses a major threat to the device. The indoor dust takes on a positive or negative static electric charge
when falling on the switch, causing poor contact of the metallic joint. Such electrostatic adhesion may occur
more easily when the relative humidity is low, affecting the service life of the switch and causing communication
faults.
Table 2-2
Requirements for the Dust Content and Granularity in the Equipment Room
Dust
Dust particles (diameter ≥ 0.5 μm)
Dust particles (diameter ≥ 5 μm)
Apart from dust, the salt, acid, and sulfide in the air of the equipment room must meet strict requirements. These
harmful substances will accelerate metal corrosion and component aging. Therefore, the equipment room should
be properly protected against the intrusion of harmful gases, such as sulfur dioxide, hydrogen sulfide, nitrogen
dioxide, and chlorine gas.
Table 2-3
Limit Values for Harmful Gases
Gas
Sulfur dioxide (SO
Hydrogen sulfide
Nitrogen dioxide (NO
Chlorine (CI
)
2
Note
The average value refers to the average value of harmful gases measured in one week. The maximum value
is the upper limit of the harmful gas measured in one week for up to 30 minutes every day.
Unit
Particles/m
Particles/m
Average (mg/m
)
0.3
2
(H
S)
0.1
2
)
0.5
2
0.1
3
3
3
)
15
Preparing for Installation
Maximum Quantity
≤ 3.5 x 10
6
≤ 3 x 10
4
3
Maximum (mg/m
)
1.0
0.5
1.0
0.3
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