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General memory module installation guidelines
Your system supports Flexible Memory Configuration, enabling the system to be configured and run in any valid chipset architectural
configuration. The following are the recommended guidelines for best performance:
•
LRDIMMs, and RDIMMs must not be mixed.
•
x4 and x8 DRAM based DIMMs can be mixed. For more information, see the Mode-specific guidelines section.
•
A maximum of three single-rank or dual-rank RDIMMs can be populated in a channel.
•
Up to three LRDIMMs can be populated regardless of rank count.
•
Populate DIMM sockets only if a processor is installed. For single-processor systems, sockets A1 to A12 are available. For dual-
processor systems, sockets A1 to A12 and sockets B1 to B12 are available.
•
Populate all sockets with white release tabs first, black, and then green.
•
Populate the sockets by highest capacity DIMM in the following order - first in sockets with white release levers and then black. For
example, if you want to mix 16 GB and 8 GB DIMMs, populate 16 GB DIMMs in the sockets with white release tabs and 8 GB DIMMs in
the sockets with black release tabs.
•
In a dual-processor configuration, the memory configuration for each processor must be identical. For example, if you populate socket
A1 for processor 1, then populate socket B1 for processor 2, and so on.
•
Memory modules of different sizes can be mixed provided that other memory population rules are followed (for example, 4 GB and 8
GB memory modules can be mixed).
•
Depending on mode-specific guidelines, populate four DIMMs per processor (one DIMM per channel) at a time to maximize
performance. For more information, see the Mode-specific guidelines section.
Table 22. Heat sink — processor configurations
Processor
Processor Type (in Watts)
Configuration
Single processor
105 W, 120 W or 135 W
Single processor
135 W (four cores, six cores,
or eight cores) or 145 W
NOTE:
When using an 86 mm wide heat sink for a single processor, the memory module sockets A10 and A12 are not
available for population.
Dual processor
105 W, 120 W or 135 W
Dual processor
135 W (four cores, six cores,
or eight cores) or 145 W
Related reference
Mode-specific guidelines
Mode-specific guidelines
Four memory channels are allocated to each processor. The allowable configurations depend on the memory mode selected.
Advanced Error Correction Code (lockstep)
Advanced Error Correction Code (ECC) mode extends SDDC from x4 DRAM based DIMMs to both x4 and x8 DRAMs. This protects
against single DRAM chip failures during normal operation.
The installation guidelines for memory modules are as follows:
•
Memory modules must be identical in size, speed, and technology.
•
DIMMs installed in memory sockets with white release levers must be identical and the same rule applies for sockets with black release
levers. This ensures that identical DIMMs are installed in matched pair —for example, A1 with A2, A3 with A4, A5 with A6, and so on.
Heat
Sink
Maximum System Capacity
Width
68 mm
12
86 mm
10 (Three DIMMs in channel 0
and channel 2 and two DIMMs
in channel 1 and channel 3)
68 mm
24
86 mm
20 (Three DIMMs in channel 0
and channel 2 and two DIMMs
in channel 1 and channel 3)
Installing and removing blade components
Number of DIMMs
Reliability, Availability, and
Serviceability (RAS) Features
12
8 (Two DIMMs per channel)
24
16 (Two DIMMs per channel)
63
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