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S
S
UPER
ERVER 6023L-8R Manual
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Mainboard Features
At the heart of the SuperServer 6023L-8R lies the X5DLR-8G2, a dual Xeon
processor motherboard designed to provide maximum performance. Below
are the main features of the X5DLR-8G2.
Chipset
The X5DLR-8G2 is based on the ServerWorks GC-LE chipset, which is a
high-performance core logic chipset designed for dual-processor servers.
The GC-LE chipset consists of three major components: a North Bridge, a
South Bridge and an IO bridge.
The North Bridge interfaces directly to the processor bus and integrates the
functions of the main memory subsystem and the IMB bus interface unit.
The memory subsystem consists of an 6-DIMM configuration accessed over
a 144-bit memory bus (most chipsets have a 72-bit memory bus), which
provides a significant boost in performance.
The South Bridge provides various integrated functions, including the PCI to
ISA bridge and support for UDMA100, security (passwords and system
protection), Plug & Play, USBs, power management, interrupt controllers
and the SMBus.
The 5704 (Broadcom Ethernet Dual Controller) is an integrated IO bridge that
provides high-performance data flow between the IMB interface and the
dual peer PCI-X bus interfaces.
Processors
The X5DLR-8G2 supports single or dual Intel Xeon 512K L2 cache proces-
sors of up to 3.06 GHz and faster with a 533/400 MHz FSB. Please refer to
the support section of our web site for a complete listing of supported
processors (http://www.supermicro.com/TechSupport.htm).
Memory
The X5DLR-8G2 has 6 184-pin DIMM slots that can support up to 12 GB of
registered ECC PC2100/1600 DDR-266/200 SDRAM. Module sizes of 128
MB, 256 MB, 512 MB, 1 GB and 2 GB may be used to populate the DIMM
slots. (PC2100 is also supported, but only at a speed of 200 MHz.)
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