Analog Devices MAX25460 Manual page 7

MAX25460 Evaluation Kit
A low-impedance ground connection between the input
and output capacitors is required for reliable operation.
Make this connection through the ground pour on the
exposed pad. Place multiple vias in the pad to connect
to all other ground layers to reduce thermal resistance.
Inadequate thermal performance may cause the IC to
cycle in and out of thermal shutdown. Use a single com-
mon ground with GND vias directly adjacent to all com-
ponents that connect down to an adjacent ground plane.
This arrangement enables high frequency return currents
to flow directly under their respective source traces.
The USB traces must be routed as a 90Ω differential pair
with an appropriate keep-out area. Avoid routing USB
traces near high frequency switching nodes or other
sources of noise such as clocks. The length of the rout-
ing should be minimized and avoid 90° turns, excessive
vias, and RF stubs. The MAX25460 has high-bandwidth
data switches. See the IC data sheet for details on tuning
recommendations.
See the Layout Considerations section in the MAX25460
data sheet for additional information.
www.analog.com
Evaluates: MAX25460
MAX25460 GUI
The latest GUI can be downloaded from the MAX25460
EV kit webpage: https://www.analog.com/en/design-
center/evaluation-hardware-and-software/evaluation-
boards-kits/max25460evkit.html
The GUI is divided into sections to allow the user easy
access to all settings and direct register read/write.
1) Direct read/write access to all registers
2) Basic setup parameters for the buck converter, cable
compensation, and USB data switch mode
3) Interrupt mask and interrupt flag indicators
4) Control for MAX25460 hardware I/O pins
All GUI setting changes immediately affect the MAX25460.
Auto-polling of MAX25460 registers by the GUI can also
be enabled in the GUI Configuration section.
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