Quectel SC690A Series Hardware Design page 12

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Smart Module Series
Figure 42: Module Bottom Dimensions (TOP View, Unit: mm) .................................................................. 96
Figure 43: Recommended Footprint (TOP View) ....................................................................................... 97
Figure 44: Top & Bottom Views of the Module ........................................................................................... 98
Figure 45: Recommended Reflow Soldering Thermal Profile ................................................................. 100
Figure 46: Carrier Tape Dimension Drawing ............................................................................................ 102
Figure 47: Plastic Reel Dimension Drawing ............................................................................................ 102
Figure 48: Packaging Process ................................................................................................................. 103
SC690A_Series_Hardware_Design
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