Dallas Semiconductor MAXIM DS3112 Manual page 6

Tempe t3/e3 multiplexer 3.3v t3/e3 framer and m13/e13/g.747 mux
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DS3112
LIST OF TABLES
Table 2-1. Pin Naming Convention............................................................................................................................ 14
Table 2-2. Pin Description ......................................................................................................................................... 14
Table 2-3. Mode Select Decode ................................................................................................................................ 30
Table 3-1. Memory Map............................................................................................................................................. 31
Table 5-1. T3 Alarm Criteria ...................................................................................................................................... 56
Table 5-2. E3 Alarm Criteria ...................................................................................................................................... 57
Table 6-1. T2 Alarm Criteria ...................................................................................................................................... 67
Table 6-2. E2 Alarm Criteria ...................................................................................................................................... 67
Table 6-3. G.747 Alarm Criteria................................................................................................................................. 67
Table 11-1. Instruction Codes.................................................................................................................................. 103
Table 11-2. Boundary Scan Control Bits ................................................................................................................. 104
Table 12-1. Recommended DC Operating Conditions ............................................................................................ 109
Table 12-2. DC Characteristics................................................................................................................................ 109
Table 13-1. AC Characteristics-Low-Speed (T1 and E1) Ports ............................................................................ 110
Table 13-2. AC Characteristics-High-Speed (T3 and E3) Ports ........................................................................... 112
Table 13-3. AC Characteristics-Framer (T3 and E3) Ports .................................................................................... 113
Table 13-4. AC Characteristics-CPU Bus (Multiplexed and Nonmultiplexed) ...................................................... 114
Table 13-5. AC Characteristics-JTAG Test Port Interface .................................................................................... 119
Table 13-6. AC Characteristics-Reset and Manual Error Counter/Insert Signals................................................. 120
Table 14-1. T Carrier Rates ..................................................................................................................................... 122
Table 14-2. T2 Overhead Bit Assignments.............................................................................................................. 123
Table 14-3. T3 Overhead Bit Assignments.............................................................................................................. 125
Table 14-4. C-Bit Assignment for C-Bit Parity Mode ............................................................................................... 126
Table 14-5. E Carrier Rates..................................................................................................................................... 128
Table 14-6. G.747 Carrier Rates ............................................................................................................................. 131
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