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Thermal Solution Services
In order to provide quicker and more flexible solutions for customer's thermal designs. Advantech
provides a thermal solution service including modularized thermal solutions and customized
thermal solutions.
Standard Thermal Solutions
Customized Thermal Solutions
Embedded Software Services
Supports driver, software integration or customized firmware, root file-system and
Linux image. Customer can save lot of time and focus on their core development.
Embedded Linux/ Android OS
Advantech boot loader Customization
With the spread of industrial computing, a whole range of new applications have been
developed, resulting in a fundamental change in the IPC industry. In the past System Integrators
(SI) were used to completing projects without outside assistance but now such working models
have moved on. Due to diverse market demands and intense competition, cooperation for (both
upstream and downstream) vertical integration has become a much more effective way to create
competitive advantages. As a result, ARM-based CPU modules were born out of this trend.
Concentrating all necessary components on the CPU module and placing other parts on the carrier
board in response to market requirements for specialization, provides greater flexibility while
retaining its low power consumption credentials.
Advantech has been involved in the industrial computer industry for many years and found that
customers usually have the following questions when implementing modular designs.
General I/O design capability
Although customers possess the ability for vertical integration and have enough know-how and
core competitiveness in the professional application field, the lack of expertise and experience in
general power and I/O design causes many challenges for them, especially integrating CPU
modules into their carrier board.
The acquisition of information
Even if the individual client is able to obtain sufficient information to make the right decision for
the specialized vertical application, some customers encounter difficult problems dealing with
platform design in general and communicating with CPU or chipset manufacturers, thereby
increasing carrier board design difficulties and risk as well as seriously impacting on Time-to-
market and lost market opportunities.
Software development and modification
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