Features And Specifications - IBM System x3755 Problem Determination And Service Manual

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Features and specifications

The following information is a summary of the features and specifications of the
server. Depending on the server model, some features might not be available, or
some specifications might not apply.
Table 1. Features and specifications
Microprocessor:
v AMD Opteron
v Discrete Level-1 and Level-2 cache for
each core
v 6 MB Level-3 cache
v Support for up to four dual-core,
quad-core or six-core microprocessors
depending on the model.
Note: Use the Configuration/Setup Utility
program to determine the type and speed
of the microprocessors.
Memory:
v Minimum: 1 GB depending on server
model, expandable to 128 GB
v Type: 667 MHz, registered, ECC,
PC2-5300 double data rate (DDR) II,
SDRAM
v Sizes: 512 MB, 1 GB, 2 GB, or 4 GB in
pairs
v Connectors: Two-way interleaved, eight
dual inline memory module (DIMM)
connectors per microprocessor/memory
card
v Maximum: Four microprocessor/memory
cards, each card containing four pairs of
PC2-5300 DDRII DIMMs
Drives:
v Slim CD-RW/DVD: IDE (some models
only)
v Serial Attached SCSI (SAS) hard disk
drives
Expansion bays:
v Four SAS, 3.5-inch bays
v One 5.25-inch bay (CD-RW/DVD drive
installed) (some models only)
Expansion slots:
v One PCI Express x16 (full-length)
v Two PCI Express x8 (full-length)
v One PCI Express x4 (full-length)
v Two 100 MHz/64-bit PCI-X (full-length)
v One HTX (half-length)
Upgradeable microcode:
System BIOS, diagnostics, service
processor, BMC, CPLD, and SAS
microcode
Power supply:
v Standard: One dual-rated power supply
– 1500 watts at 220 V ac input
– 750 watts at 110 V ac input
v Upgradeable to two power supplies
(redundant at 220 V ac only)
Size:
v 4 U
v Height: 178 mm (7 in.)
v Depth: 711 mm (28 in.)
v Width: 483 mm (19 in.)
v Weight: approximately 43.2 kg (95.25
lb) when fully configured or 29.5 kg (65
lb) minimum
Racks are marked in vertical increments
of 4.45 cm (1.75 inches). Each increment
is referred to as a unit, or "U." A 1-U-high
device is 4.45 cm (1.75 inches) tall.
Integrated functions:
v Support for ServeRAID-8k-l or
ServeRAID-8k SAS controller
v Baseboard management controller
(BMC)
v Service processor support for Remote
Supervisor Adapter II SlimLine
v Light path diagnostics
v Three Universal Serial Bus (USB) ports
(2.0)
– Two on front of server
– One on rear of server
v Two Broadcom 5708 10/100/1000
Ethernet controllers (with Wake on LAN
support)
v ATI ES1000 video controller
v Mouse connector
v Keyboard connector
v Serial connector
v Trusted platform module
Acoustical noise emissions:
v Sound power, idle: 6.6 bel declared
v Sound power, operating: 6.6 bel
declared
Environment:
v Air temperature:
– Server on: 10° to 35°C (50.0° to
95.0°F); altitude: 0 to 2133 m
(6998.0 ft)
– Server off: 10° to 43°C (50.0° to
109.4°F); maximum altitude: 2133 m
(6998.0 ft)
v Humidity:
– Server on: 8% to 80%
– Server off: 8% to 80%
Heat output:
Approximate heat output in British thermal
units (Btu) per hour:
v Minimum configuration: 683 Btu per hour
(200 watts)
v Maximum configuration: 6598 Btu per
hour (1932 watts)
Electrical input:
v Sine-wave input (50-60 Hz) required
v Input voltage low range:
– Minimum: 100 V ac
– Maximum: 127 V ac
v Input voltage high range:
– Minimum: 200 V ac
– Maximum: 240 V ac
v Approximate input kilovolt-amperes (kVA):
– Minimum: 0.20 kVA
– Maximum: 1.93 kVA
Notes:
1. Power consumption and heat output
vary depending on the number and type
of optional features that are installed and
the power-management optional features
that are in use.
2. These levels were measured in
controlled acoustical environments
according to the procedures that are
specified by the American National
Standards Institute (ANSI) S12.10 and
ISO 7779 and are reported in
accordance with ISO 9296. Actual
sound-pressure levels in a given location
might exceed the average stated values
because of room reflections and other
nearby noise sources. The declared
sound-power levels indicate an upper
limit, below which a large number of
computers will operate.
Chapter 1. Introduction
3

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