UM3076 User manual Getting started with the X-STM32MP-MSP01 expansion board for the STM32MP157F-DK2 discovery kit Introduction X-STM32MP-MSP01 multisensor expansion board embeds the following devices: • ISM330DHCX iNEMO 3-axis accelerometer and 3-axis gyroscope • IIS2MDC 3-axis magnetometer • IIS2DLPC 3-axis accelerometer •...
The figure below shows the component placement on the board. Figure 2. X-STM32MP-MSP01 component placement details X-STM32MP-MSP01 interfaces with the main board via an I²C interface along with some GPIO pins for interrupts. A DIL 24-pin socket is available for additional MEMS adapters and other sensors.
UM3076 System requirements Figure 3. System block diagram System requirements To test the X-STM32MP-MSP01, you need: • X-STM32MP-MSP01 expansion board • STM32MP157F-DK2 discovery kit • a laptop/desktop (with Windows 10 or above) • a USB Type-A to micro-B USB cable (for connection as a virtual serial device, if required) •...
Connect the X-STM32MP-MSP01 to the STM32MP157F-DK2 from the top, as shown below. Figure 4. X-STM32MP-MSP01 connected to STM32MP157F-DK2 Step 3. Power the STM32MP157F-DK2 using the USB Type-C® cable. Step 4. Program the supported firmware in the microSD™ card of the STM32MP157F-DK2 board.
1.8 V to 5.5 V The EEPROM communicates with the X-STM32MP-MSP01 through I²C signals. The J4 jumper enables the write enable feature on the device. You can perform the read and write operation by setting the jumper as detailed in the following table.
UM3076 Level translator: ST2378E Figure 6. GPIO connector circuit Level translator: ST2378E ST2378E device is an 8-bit, dual supply, bidirectional level translator with ±15 kV ESD protection on I/Os at VCC side. It is designed to interface data transfer between low voltage ASICs/PLDs and higher voltage systems. Externally applied voltage, VCC and VL, set logic levels at both sides with the range specified as 1.71 V ≤...
UM3076 Accelerometer and gyroscope: ISM330DHCX Figure 7. ST2378ETTR circuit Accelerometer and gyroscope: ISM330DHCX ISM330DHCX is a system-in-package featuring a high-performance 3-axis digital accelerometer and 3-axis digital gyroscope tailored for Industry 4.0 applications. The sensing elements of the accelerometer and of the gyroscope are implemented on the same silicon die, thus guaranteeing superior stability and robustness.
UM3076 Linear accelerometer: IIS2DLPC Figure 8. ISM330DHCXTR circuit Linear accelerometer: IIS2DLPC IIS2DLPC is an ultra-low-power high-performance three-axis linear accelerometer with digital I²C/SPI output interface, which leverages on the robust and mature manufacturing processes already used for the production of micromachined accelerometers. The IIS2DLPC has user-selectable full scales of ±2g/±4g/±8g/±16g and is capable of measuring accelerations with output data rates from 1.6 Hz to 1600 Hz.
UM3076 Microphone: MP23DB02MM IIS2MDC includes an I²C serial bus interface that supports standard, fast mode, fast mode plus, and high- speed (100 kHz, 400 kHz, 1 MHz, and 3.4 MHz). The device can be configured to generate an interrupt signal for magnetic field detection. It can be used as a slave device with the ISM330DHCX device configured as a master using the solder bridge configuration.
UM3076 Pressure sensor: LPS22HH Figure 11. MP23DB02MM circuit Pressure sensor: LPS22HH LPS22HH is an ultra-compact piezoresistive absolute pressure sensor, which functions as a digital output barometer. The device comprises a sensing element and an IC interface, which communicates through I²C, MIPI I3CSM, or SPI from the sensing element to the application.
UM3076 Time-of-Flight sensor: VL53L5CX Table 10. STTS22HTR details Features Description Order code STTS22HTR Package 6-UDFN Operating voltage 1.5 V to 3.6 V Figure 13. STTS22HTR circuit 2.10 Time-of-Flight sensor: VL53L5CX VL53L5CX is a state of the art, Time-of-Flight (ToF), multizone ranging sensor, housed in a miniature reflowable package.
UM3076 Ambient light sensor: VD6283TX Figure 14. VL53L5CX circuit 2.10.1 Laser safety considerations VL53L5CX contains a laser emitter and the corresponding drive circuitry. The laser output is designed to remain within Class 1 laser safety limits under all reasonable foreseeable conditions, including single faults, in compliance with the IEC 60825-1:2014 (third edition).
UM3076 NFC tag: ST25DV64KC Figure 16. VD6283TX circuit 2.12 NFC tag: ST25DV64KC ST25DV64KC is NFC RFID tag that includes 64‑Kbit of electrically erasable programmable memory (EEPROM) with two interfaces. The first one is an I²C serial link and can be operated from a DC power supply. The second one is an RF link activated when it acts as a contactless memory powered by the received carrier electromagnetic wave.
On-board LEDs are available for visual indication. A push button switch is used for the user inputs. Note: You can configure different hardware settings of the X-STM32MP-MSP01 board through several solder bridges, which can be left open (not mounted) or closed (mounted).
UM3076 Other connectors: DIL 24-pin socket, flexible cable, I²C groove connector Figure 19. LED and switch circuit 2.15 Other connectors: DIL 24-pin socket, flexible cable, I²C groove connector Several connectors are available on the board to connect external boards: • a DIL 24-pin socket (J10) for additional adapter boards •...
Figure 25. X-STM32MP-MSP01 circuit schematic (5 of 11) I2C1_SCL I2C1_SDA SB4 Open LPS22HH_INT_DRDY 1.5K 1.5K SB5 Open IIS2MDC_INT_DRDY SDO/SA0 SDO_Aux ISM330DHC_SDX OCS_Aux SB6 Close ISM330DHC_SCX ISM330DHC_INT2 INT2 SB7 Open ISM330DHC_INT1 INT1 Keep only one soldered at a time ISM330DHCXTR 2.2K 4.7K...
Figure 26. X-STM32MP-MSP01 circuit schematic (6 of 11) Close I2C1_SCL IIS2MDC_INT_DRDY SCL/SPC INT/DRDY Open ISM330DHC_SCX NC_1 GND_2 SDA/SDI/SDO VDD_IO Keep only one soldered at a time NC_2 GND_1 NC_3 SB10 Close IIS2MDC I2C1_SDA 220nF 100nF 10uF SB11 Open ISM330DHC_SDX 100nF...
Figure 27. X-STM32MP-MSP01 circuit schematic (7 of 11) SB20 Open ISM330DHC_SCX SB21 Close I2C1_SCL Keep only one soldered at a time VDD_IO SCL/SPC SDA/SDI/SDO SDO/SA0 GND1 SB22 Open ISM330DHC_SDX GND2 INT_DRDY 100nF 100nF SB23 Close I2C1_SDA LPS22HH Keep only one soldered at a time 4.7K...
Figure 30. X-STM32MP-MSP01 circuit schematic (10 of 11) SB25 Open DIL24_SPI_MISO 3-pin Male Header SB26 Open DIL24_SPI_MOSI SB27 Close I2C1_SDA Keep only one soldered at a time SB28 Open SB30 Open ISM330DHC_SCX DIL24_SPI_CLK SB29 Open SB31 Close ISM330DHC_SDX I2C1_SCL Keep only one soldered at a time...
Figure 31. X-STM32MP-MSP01 circuit schematic (11 of 11) 4.7K LED1 LED GREEN SWITCH_1 LED2 100nF LED RED SPST SW Switch LEDs Keep only one soldered at time SB33 Open SB34 Close BYP/ADJ LDK130M-R Voltage regulator...
X-STM32MP-MSP01 versions PCB version Schematic diagrams Bill of materials X$STM32MP-MSP01A X$STM32MP-MSP01A schematic diagrams X$STM32MP-MSP01A bill of materials 1. This code identifies the X-STM32MP-MSP01 expansion board first version. It is printed on the board PCB. UM3076 - Rev 1 page 32/38...
Conformity. Notice for the United Kingdom The X-STM32MP-MSP01 is in compliance with the UK Radio Equipment Regulations 2017 (UK SI 2017 No. 1206 and amendments) and with the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment Regulations 2012 (UK SI 2012 No. 3032 and amendments). Applied standards are listed in...
X-STM32MP-MSP01 connected to STM32MP157F-DK2 ........
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