Table of Contents
Advertisement
Interposer Fabrication Notes
Operating Environment
The W3301A interposers are constructed of polyimide material that supports solder attachment of
the interposer using the higher temperatures required by a lead-free solder process. The coefficient
of thermal expansion for the interposer is 55 ppm/degree C. When operating in a soldered-down
environment over a wide range of temperatures, the expansion coefficient of the interposer, DRAM,
and system being probed must be matched to avoid stress related failure of the solder connections
between the Interposer and attached components. The interposer material allows operation over an
industrial temperature range of -40 to +85 degrees Celsius (non-condensing), subject to the above
constraint.
Mechanical Dimensions
When a W3301A interposer is soldered to a riser, flatness must be maintained on the order of 3.5
mils or less across the BGA footprint to maximize successful soldering to the interposer.
Keysight W3301A LPDDR3 BGA Interposers Installation Guide
W3301A Interposer and Riser Soldering Guidelines
2
23
Advertisement
Table of Contents
