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Introduction
W3301A LPDDR3 BGA Interposers - An Overview
The W3301A LPDDR3 BGA Interposer enables probing of 178-pin JEDEC standard footprint directly
at the ball grid array using the Keysight logic analyzers.
This interposer supports:
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•
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Using this interposer, you can capture LPDDR3 signals up to 1.6 Gb/s for a system under test that
can operate under probe load.
A W3301A interposer interposes between the DRAM being probed and the PC board where the
DRAM would normally be soldered. The interposer is designed to be soldered to the PCB footprint for
the DRAM on top of either the LPDDR riser included with the W3301A interposer or an optional
Grypper socket (not included with the interposer) or both. The DRAM being probed is then soldered
to the top side of the interposer.
Each LPDDR signal in the common footprint passes directly from the bottom side of the interposer to
the top side of the interposer.
NOTE
The following figure shows a W3301A interposer's top view.
Figure 1
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probing of all CA and DQ/DQS signals between a single-channel x32 DRAM and a PC board.
data rates up to 1.6 Gb/s
smaller KOV
The W3301A interposer is tested for via connections through the interposer.
W3301A LPDDR3 Interposer
Keysight W3301A LPDDR3 BGA Interposers Installation Guide
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