Table Of Contents - Pepperl+Fuchs HCD2-FBPS Series Manual

Fieldbus Power Hub,Motherboard for Gateway and Power Supply Modules
1 Introduction................................................................................. 4
1.1 Contents................................................................................................ 4
1.2 Target Group, Personnel...................................................................... 4
1.3 Symbols Used ...................................................................................... 4
2 Product Specifications............................................................... 6
2.1 Overview and Application ................................................................... 6
2.2 System Components ........................................................................... 7
2.2.1 Motherboard ...................................................................................... 7
2.2.2 Gateway Modules HD2-GTR-4PA* ..................................................... 7
2.2.3 Power Supply Modules HCD2-FBPS-*............................................... 8
2.2.4 Diagnostic Modules ........................................................................... 8
2.3 Component Identity and Dimensions .............................................. 10
2.4 Technical Data .................................................................................... 10
3 Installation and Commissioning ............................................. 14
3.1 Mounting and Dismounting............................................................... 14
3.2 Mounting the Grounding Rail (ACC-MB-HSK)................................. 16
3.3 Shielding and Grounding .................................................................. 16
3.3.1 Connection to Equipotential Bonding System .................................. 17
3.4 Connection Layout............................................................................. 18
3.4.1 Connections..................................................................................... 21
3.5 Segment Termination......................................................................... 21
3.6 Host Connection ................................................................................ 21
3.7 Gateway Addressing .......................................................................... 21
4 Thermal Dissipation ................................................................. 22
5 Appendix ................................................................................... 24
5.1 Ordering Information ......................................................................... 24
5.2 Electromagnetic Compatibility Verification .................................... 24
5.3 Referenced Documents ..................................................................... 25
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