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HCD2-FBPS-1.500
Pepperl+Fuchs HCD2-FBPS-1.500 Manuals
Manuals and User Guides for Pepperl+Fuchs HCD2-FBPS-1.500. We have
2
Pepperl+Fuchs HCD2-FBPS-1.500 manuals available for free PDF download: Manual
Pepperl+Fuchs HCD2-FBPS-1.500 Manual (28 pages)
Compact Fieldbus Power Hub, Generic Interface
Brand:
Pepperl+Fuchs
| Category:
Power Supply
| Size: 2.43 MB
Table of Contents
Table of Contents
3
1 Safety
5
Validity
5
Symbols Used
5
System Operator and Personnel
5
Pertinent Laws, Standards, Directives, and Further Documentation5
5
Delivery, Transport and Storage
6
Marking
6
Intended Use
6
Mounting and Installation
7
Mounting Instructions for HD2* Modules
7
Zone 2 and DIV. 2
7
Ex IC
8
Housing
8
Repair and Maintenance
8
Disposal
8
2 Specification
9
Overview
9
System Components
10
Motherboard
10
Power Supply Modules HCD2-FBPS
10
Diagnostic Modules
11
Component Identity
12
Dimensional Drawings
12
Technical Data
12
3 Installation and Commissioning
15
Mounting and Dismounting
15
Mounting the Grounding Rail (ACC-MB-HSK)
16
Shielding and Grounding
17
Connection Layout
17
Connections
20
Installation Requirements for Ex IC Installations with MBHC-FB- 8R.HSC.R
20
Segment Termination
21
4 Thermal Dissipation
22
5 Appendix
24
Ordering Information
24
Electromagnetic Compatibility Verification in Accordance with EC Council Legislation Directive 2004/108/EC
24
Referenced Documents
25
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Pepperl+Fuchs HCD2-FBPS-1.500 Manual (26 pages)
Brand:
Pepperl+Fuchs
| Category:
Gateway
| Size: 1.79 MB
Table of Contents
Table of Contents
3
Introduction
4
Contents
4
Target Group, Personnel
4
Symbols Used
4
Product Specifications
6
Overview and Application
6
System Components
7
Motherboard
7
Gateway Modules HD2-GTR-4PA
7
Power Supply Modules HCD2-FBPS
8
Diagnostic Modules
8
Component Identity and Dimensions
10
Technical Data
10
Installation and Commissioning
14
Mounting and Dismounting
14
Mounting the Grounding Rail (ACC-MB-HSK)
16
Shielding and Grounding
16
Connection to Equipotential Bonding System
17
Connection Layout
18
Connections
21
Segment Termination
21
Host Connection
21
Gateway Addressing
21
Thermal Dissipation
22
Appendix
24
Ordering Information
24
Electromagnetic Compatibility Verification
24
Referenced Documents
25
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