Quick Start Procedure - Analog Devices DC2510A Demo Manual

QUICK START PROCEDURE

Instructions
To use DC2510A, you will need to connect a sensor to the
board. This device can be soldered onto the grid of copper
pads, attached to one of the provided SMD footprints, or
inserted into the headers directly (if it is a through-hole
part such as a thermistor).
There are a few inputs and interfaces for receiving data:
1. UART
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2. I C
3. SPI
4. ADC (×4)
5. GPIO (×4 default, up to 18)
Table 1 shows which of these inputs can be read from
the DC2321A GUI through the Mote Measurement Set-
tings dialog. This allows users to start taking sensor
measurements out-of-the-box without reprogramming
the DC2321A. However, any of these inputs can be used
if a custom program is written.
Some sensors can output a voltage that is suitable for ADC
measurements (ADC abs max = 1.98V), or may have an
integrated serial port. However, other sensors may require
an additional IC to read the measurement and communicate
with the mote.
General Notes
• The copper rails on DC2510A are not connected to
anything by default, and must be wired by the user.
• SMD footprints on the top and bottom of the PCB share
plated holes. Only one IC per each set of plated holes
should be populated at any time.
• Do not connect USB power to any pin on the mote.
• Pull-up resistors should be pulled to VSUPPLY.
• Any input with a voltage applied when VSUPPLY is not
powered can power the mote through a sneak path.
DEMO MANUAL
Combining Application Circuits
Because DC2510A is stackable, a user can make custom
applications on several different boards and connect all
of the boards together to combine the circuits. This can
be useful if a user runs out of routing space on a board,
or if an additional SMD footprint is needed.
Additionally, if a different GPIO pin is tied high on each of
these boards, data from these circuits can be read from
a single program which checks the state of a GPIO to
determine if a particular sensor circuit is present.
SMD Soldering Instructions
The footprints for U3 and U4 allow ICs with GND paddles
to be mounted using a soldering iron rather than a heat
gun. The recommended procedure is as follows:
1. Place the IC onto the footprint as it will be soldered;
solder the four corner pins into place on the copper
pads.
2. Turn the board over and touch the soldering iron to both
the paddle and the plated hole. Quickly apply solder to
the junction.
3. Turn the board back to the original orientation and solder
the rest of the pins.
4. Wire the paddle to its destination on the board.
5. Wire the pins to their destinations on the board.
DC2510A
dc2510afa
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